Contact wafer
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Description
The broken lines in the drawing views are included to show portions of the contact wafer that form no part of the claimed design.
Claims
The ornamental design for contact wafer, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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- Official Communication issued in corresponding Taiwanese Patent Application No. 107304340D01 dated Sep. 26, 2020.
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- Official Communication issued in corresponding Taiwanese Patent Application No. 106306823D02 dated Sep. 25, 2020.
- Buck et al., “Contact Wafers”, U.S. Appl. No. 29/652,017, filed Dec. 20, 2018.
- WELCON Inc., “Liquid-cooling Heat Sink”, www.welcon.co.jp/product/heatsink/, Retrieved Feb. 14, 2020, pp. 1-4.
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Patent History
Patent number: D941780
Type: Grant
Filed: Feb 25, 2020
Date of Patent: Jan 25, 2022
Assignee: SAMTEC, INC. (New Albany, IN)
Inventors: Jonathan E. Buck (New Albany, IN), John A. Mongold (New Albany, IN)
Primary Examiner: Bridget L Eland
Application Number: 29/725,389
Type: Grant
Filed: Feb 25, 2020
Date of Patent: Jan 25, 2022
Assignee: SAMTEC, INC. (New Albany, IN)
Inventors: Jonathan E. Buck (New Albany, IN), John A. Mongold (New Albany, IN)
Primary Examiner: Bridget L Eland
Application Number: 29/725,389
Classifications
Current U.S. Class:
Element Or Attachment (D13/154)