Contact wafer

- SAMTEC, INC.
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Description

FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;

FIG. 2 is a bottom, back, and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a back view thereof;

FIG. 5 is a left thereof;

FIG. 6 is a right view thereof;

FIG. 7 is a top view thereof; and,

FIG. 8 is a bottom view thereof.

The broken lines in the drawing views are included to show portions of the contact wafer that form no part of the claimed design.

Claims

The ornamental design for contact wafer, as shown and described.

Referenced Cited
U.S. Patent Documents
D714227 September 30, 2014 Buck
D727268 April 21, 2015 Buck
D748063 January 26, 2016 Buck
D750030 February 23, 2016 Zerebilov
D768089 October 4, 2016 Liu
D796452 September 5, 2017 Masaki
D796453 September 5, 2017 Masaki
D816044 April 24, 2018 Zerebilov
D823814 July 24, 2018 Buck
D877084 March 3, 2020 Buck
D877088 March 3, 2020 Musser
D877700 March 10, 2020 Buck
D879724 March 31, 2020 Buck
D881133 April 14, 2020 Buck
D881134 April 14, 2020 Musser
D926144 July 27, 2021 Musser
D926705 August 3, 2021 Musser
20190097357 March 28, 2019 Mongold
20200036138 January 30, 2020 Mongold
20200212631 July 2, 2020 Buck
20210126401 April 29, 2021 Musser
Foreign Patent Documents
D130799 September 2009 TW
D132453 December 2009 TW
D159828 April 2014 TW
D163315 October 2014 TW
D168325 June 2015 TW
D168328 June 2015 TW
D172197 December 2015 TW
Other references
  • Official Communication issued in corresponding Taiwanese Patent Application No. 109301707, dated Oct. 30, 2020.
  • Official Communication issued in corresponding Taiwanese Patent Application No. 107304340D01 dated Sep. 26, 2020.
  • Official Communication issued in corresponding Taiwanese Patent Application No. 107304341D01 dated Sep. 25, 2020.
  • Official Communication issued in corresponding Taiwanese Patent Application No. 107304337D02 dated Sep. 25, 2020.
  • Official Communication issued in corresponding Taiwanese Patent Application No. 107304336D01 dated Sep. 30, 2020.
  • Official Communication issued in corresponding Taiwanese Patent Application No. 106306823D02 dated Sep. 25, 2020.
  • Buck et al., “Contact Wafers”, U.S. Appl. No. 29/652,017, filed Dec. 20, 2018.
  • WELCON Inc., “Liquid-cooling Heat Sink”, www.welcon.co.jp/product/heatsink/, Retrieved Feb. 14, 2020, pp. 1-4.
  • Official Communication issued in corresponding Taiwanese Patent Application No. 106306823D01, dated Sep. 26, 2020.
Patent History
Patent number: D941780
Type: Grant
Filed: Feb 25, 2020
Date of Patent: Jan 25, 2022
Assignee: SAMTEC, INC. (New Albany, IN)
Inventors: Jonathan E. Buck (New Albany, IN), John A. Mongold (New Albany, IN)
Primary Examiner: Bridget L Eland
Application Number: 29/725,389
Classifications
Current U.S. Class: Element Or Attachment (D13/154)