Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to word lines and arranged in strings. The memory cells are configured to retain a threshold voltage corresponding to memory states. Each one of the strings has drain-side select gate transistors on a drain-side of the one of the strings including top drain-side select gate transistors connected to bit lines and coupled to the memory cells of the-one of the strings. A control means is coupled to the word lines and bit lines and is configured to apply an unselected top voltage to unselected ones of the top drain-side select gate transistors during a memory operation. The control means is also configured to simultaneously apply a selected top voltage to selected ones top drain-side select gate transistors during the memory operation. The unselected top voltage is intentionally different electrically than the selected top voltage.

Abstract: A memory die includes source-select-level electrically conductive strips laterally spaced apart by source-select-level dielectric isolation structures, an alternating stack of word-line-level electrically conductive layers and insulating layers; and source strips located on an opposite side of the source-select-level electrically conductive strips. Each of the source strips has an areal overlap with only a respective one of the source-select-level electrically conductive strips. Memory stack structures vertically extend through the alternating stack and a respective subset of the source-select-level electrically conductive strips. A logic die may be bonded to the memory die on an opposite side of the source strips. Each source strip is electrically connected to a respective group of memory stack structures laterally surrounded by a respective source-select-level electrically conductive strip.

Abstract: An apparatus is provided that includes a plurality of non-volatile memory cells, a charge pump circuit configured to receive a clock signal and provide a plurality of voltages to the non-volatile memory cells, and a control circuit coupled to the non-volatile memory cells and the charge pump circuit. The control circuit is configured to reduce a current consumed by the apparatus by selectively reducing a clock rate of the clock signal depending on a memory operation being performed on the non-volatile memory cells.

Abstract: A storage device including control circuitry, communicatively coupled to a non-volatile memory, configured to perform a programming operation to program a set of memory cells. The control circuitry, when performing the programming operation, may be configured to apply a set of biased program voltages to lines connecting to respective memory cells in an array. The set of biased program voltages may have values that are based on positions of the respective memory cells within the array relative to an outer memory string group of a set of memory string groups.

Abstract: Programming a plurality of non-volatile memory cells includes performing a soft erase process during the programming. The soft erase process includes pre-charging channels of the memory cells and performing an erase operation subsequent to the pre-charging while the channels are at one or more elevated voltages at least partially due to the pre-charging.

Abstract: Technology is disclosed herein for a memory device with multiple dies bonded together. The memory device may be referred to herein as an integrated memory assembly. The integrated memory assembly has a control semiconductor die and two or more memory semiconductor dies. In one embodiment, each memory semiconductor die has a memory structure having blocks of memory cells. Bit lines extend over the respective memory structure. In one embodiment the integrated memory assembly has what is referred to herein as a “separate bit line architecture”. The separate bit line architecture allows the control semiconductor die to control a memory operation in parallel in the two memory semiconductor dies. Moreover, the separate bit line architecture allows for good scaling of a memory device with multiple dies bonded together.

Abstract: A storage device is disclosed herein. The storage device comprises: a non-volatile memory, where the non-volatile memory includes a block of N wordlines partitioned into a plurality of sub-blocks; and control circuitry coupled to the N wordlines. The control circuitry is configured to: determine a program status of an unselected sub-block of the plurality of sub-blocks before performing an operation on a selected sub-block of the plurality of sub-blocks; based on determining that the program status of the unselected sub-block is programmed, perform a precharge operation including applying a first precharge time; and based on determining that the program status of the unselected sub-block is not programmed, perform a precharge operation including applying a second precharge time, wherein the first precharge time is for a longer period than the second precharge time.

Abstract: A memory apparatus and operating method are provided. The apparatus includes memory cells connected to word lines and disposed in strings and configured to retain a threshold voltage corresponding to data states. A control means is configured to program and verify the memory cells during a program operation. The memory cells associated with predetermined ones of the data states are not verified until the memory cells associated with specific prior ones of the data states finish programming to define verify windows ranging between each one of the specific prior ones of the data states and each one of the predetermined ones. The control means adjusts the verify windows in response to the memory cells associated with one of the specific prior ones of the data states not finishing programming before the one of the predetermined ones of the at least one of the verify windows is verified.

Abstract: A memory device including an array of memory cells arranged in a plurality of word lines is provided. A control circuitry is configured to program the memory cells of a selected word line to a plurality of leading data states in a plurality of programming loops that include programming and verify pulses. The control circuitry is also configured to count a total number of programming loops during programming of the selected word line. The control circuitry is also configured to program at least one memory cell of the selected word line to a last data state in at least one last data state programming loop. In response to both the total number of programming loops being less than a first predetermined threshold and the number of last data state programming loops being equal to a second predetermined threshold, the control circuitry automatically skips verify in a final programming loop.

Abstract: A vertical repetition of multiple instances of a unit layer stack is formed over a substrate. The unit layer stack includes an insulating layer and a sacrificial material layer. Lateral recesses are formed by removing the sacrificial material layers selective to the insulating layers. Each lateral recess is sequentially fill with at least one conductive fill material and an insulating fill material, and vertically-extending portions of the at least one conductive fill material are removed such that a vertical layer stack including a first-type electrically conductive layer, a seamed insulating layer, and a second-type electrically conductive layer are formed in each lateral recess. Memory opening fill structures including a respective vertical stack of memory elements is formed through the insulating layers and the layer stacks. Access points for providing an etchant for removing the sacrificial material layers may be provided by memory openings, contact via cavities or backside trenches.

Abstract: The memory device has a plurality of memory blocks including a plurality of memory cells arranged in a plurality of word lines. The memory device also includes control circuitry that is in communication with the plurality of memory blocks. The control circuitry is configured to receive a data write instruction. The control circuitry is further configured to program the memory cells of the memory blocks to an SLC format. In response to the data programmed to the memory cells of the memory blocks in the SLC format reaching an SLC limit prior to completion of the data write instruction, without erasing the memory cells programmed to the SLC format, the control circuitry is configured to program the memory cells of at least some of the plurality of memory blocks from the SLC format to a TLC format.

Abstract: To prevent loss of data due to a word line to memory hole short (or another defect), it is proposed to perform an erase process for a plurality of memory cells, detect that a subset of the plurality of memory cells are slow to erase, and prevent successfully programming for at least some of the memory cells that are slow to erase. This technique uses the erase process to predict future word line to memory hole shorts and prevent programming of memory cells predicted to have a future word line to memory hole short so no data will be lost when the short manifests.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to word lines including a dummy word line and other data word lines. The memory cells are disposed in memory holes and configured to retain a threshold voltage. A control means is coupled to the word lines and the memory holes and is configured to determine whether one of the word lines being programmed in a program operation is a particular one of the word lines adjacent the dummy word line needing a dummy positioning operation. The control means is also configured to program the memory cells connected to the dummy word line to adjust the threshold voltage to a predetermined position threshold voltage in the dummy positioning operation in response to determining the one of the plurality of word lines being programmed in the program operation is the particular one of the word lines.

Abstract: An apparatus that comprises a plurality of memory cells and a control circuit coupled to the plurality of memory cells is disclosed. The control circuit is configured to perform a read operation. The read operation includes determining a read condition of a memory cell, where the read condition is of a plurality of read conditions and determining a boost timing for the memory cell, where the boost timing corresponds to the read condition.

Abstract: A controller is configured to program the memory cells to a first set of data states in a first programming pass and to a greater second set of data states in a second programming pass. The controller performs the first programming pass on the first word line. The controller then repeats the process of programming a portion of another word line and then comparing an upper tail of an erased data state of the first word line to a critical voltage until the upper tail of the erased data state of the first word line exceeds the critical voltage by a threshold. In response to the upper tail of the erased data state exceeding the critical voltage by the threshold, the controller then alternates between the first and second programming passes until the first programming pass is completed on the remaining word lines of the memory block.

Abstract: A memory apparatus and method of operation are provided. The memory apparatus includes memory cells connected to one of a plurality of word lines including an edge word line and a plurality of other data word lines. The memory cells are disposed in memory holes organized in rows grouped in a plurality of strings. The rows include full circle rows and semi-circle rows. A control means is configured to program the memory cells connected to the edge word line and in the semi-circle rows of a first one and a second one of the plurality of strings to a predetermined one of a plurality of data states in a first program operation. The control means then selects both the first one and the second one of the plurality of strings together and programs the memory cells of the full circle rows together in a second program operation.

Abstract: The memory device includes a plurality of hybrid memory blocks that can operate in either a single bit per memory cell mode or a multiple bits per memory cell mode. The memory blocks each include a plurality of memory cells, which are arranged in a plurality of word lines. Control circuitry is configured to program a selected word line to an SLC format. The control circuitry is further configured to determine which zone within the selected hybrid memory block the selected word line is located in and set an SLC programming voltage to a level based on the determination of the zone of the selected word line. The control circuitry is further configured to apply a programming pulse at the SLC programming voltage to the selected word line to program the memory cells of the selected word line.

Abstract: A field effect transistor includes a source region embedded in a semiconductor material layer, a drain region embedded in the semiconductor material layer and laterally spaced from the source region by a channel, a gate stack including a gate dielectric and a gate electrode, a shallow trench isolation portion embedded in an upper portion of the semiconductor material layer and contacting the drain region and the gate stack, and a concave drain extension region continuously extending underneath the shallow trench isolation portion from a bottom surface of the gate dielectric to a bottom surface of the drain region.

Abstract: A memory device includes a cross-point array of magnetoresistive memory cells. Each magnetoresistive memory cell includes a vertical stack of a selector-containing pillar structure and a magnetic tunnel junction pillar structure. The lateral spacing between neighboring pairs of magnetoresistive memory cells may be smaller along a first horizontal direction than along a second horizontal direction, and a dielectric spacer or a tapered etch process may be used to provide a pattern of an etch mask for patterning first electrically conductive lines underneath the magnetoresistive memory cells. Alternatively, a resist layer may be employed to pattern first electrically conductive lines underneath the cross-point array. Alternatively, a protective dielectric liner may be provided to protect selector-containing pillar structures during formation of the magnetic tunnel junction pillar structures.

Abstract: Technology is disclosed herein for sensing memory cells while compensating for resistance along an electrical pathway between a voltage driver and a control line connected to the memory cells. A control circuit provides a voltage from the voltage driver over a first electrical pathway to a control line in a first block and a second electrical pathway to a control line in a second block. The control circuit senses first memory cells in the first block and the second memory cells in the second block while compensating for a difference in resistance of the first and second electrical pathways. In one aspect, the control circuit discharges a first sense node for a different period of time than a second sense node to compensate for the difference in resistance. Compensating for the difference in resistance compensates for a different IR drop of the electrical pathways.