Abstract: For a non-volatile memory that uses hard bit and a soft bit data in error correction operations, architectures are introduced for the compression of the soft bit data to reduce the amount of data transferred over the memory's input-output interface. For a memory device with multiple planes of memory cells, the internal global data bus is segmented and a data compression circuit associated with each segment. This allows soft bit data from a cache buffer of a plane using one segment to transfer data between the cache buffer and the associated compression circuit concurrently with transferring data from a cache buffer of another plane using another segment, either for compression or transfer to the input-output interface.

Abstract: Technology is disclosed herein for a memory system that regulates charge pump current during a ramp up of the output voltage. The memory systems operates the charge pump in a current regulation mode while the charge pump output voltage ramps up. After the output voltage crosses a threshold voltage, the charge pump is operated in a voltage regulation mode in which the output voltage is regulated to a target output voltage. In one aspect, the memory system generates a random duty cycle clock in the current regulation mode. The memory system determines a target duty cycle for the random duty cycle clock that will regulate the input current of the charge pump to a target current, given the present output voltage. A clock based on the random duty cycle clock is provided to a clock input of the charge pump to regulate the charge pump current.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to word lines and disposed in memory holes organized in rows grouped in strings and configured to retain a threshold voltage. The memory cells are connected in series between a drain-side select gate transistor on a drain-side of each of the memory holes and a source-side select gate transistor on a source-side of each of the memory holes. A control means determines whether a downshift recovery trigger event has occurred in memory operations. In response to determining the downshift recovery trigger event has occurred, the control means inserts at least one of a predetermined idle time in the memory operations and a recovery pulse of a negative voltage to the drain-side select gate transistor of the memory holes of the strings for a predetermined pulse period of time during one of the memory operations.

Abstract: Technology is disclosed for a fast ECC engine for a mixed read of MRAM cells. A codeword read from MRAM cells using a referenced read is decoded using a first ECC mode. If decoding passes, results are provided to a host. If decoding fails, a self-referenced read (SRR) is performed. The data read using the SRR is decoded with a second ECC mode that is capable of correcting a greater number of bits than the first ECC mode. The second ECC mode may have a higher mis-correction rate than the first ECC mode (for a given raw bit error rate (RBER)). However, the RBER may be lower when using the second ECC mode. Therefore, the first and second ECC modes may result in about the same probability of an undetectable error (or mis-correction).

Abstract: A memory system identifies memory cells connected to a common word line that have had their threshold voltage unintentionally drift lower than programmed by determining whether memory cells meet two criteria: (1) the memory cells have threshold voltages within an offset of a read compare voltage of a data state; and (2) adjacent memory cells (connected to word lines that are adjacent to the common word line) are in one or more low data states. For those memory cells meeting the two criteria, the memory system performs some amount of programming on the memory cells to refresh the data stored in those memory cells to be as originally intended.

Abstract: A non-volatile semiconductor memory device, described herein, comprises non-volatile storage elements and one or more control circuits in communication with the non-volatile storage elements. The one or more control circuits are configured to, during a program iteration of a program operation, determine whether a program voltage level of the program iteration exceeds a threshold program voltage level and in response to the determination, identify a set of voltage levels to apply to a source line connected to a set of the non-volatile storage elements. The one or more control circuits are further configured to perform the program iteration of the program operation on the set of non-volatile storage elements, where the program iteration includes applying the set of voltage levels to the source line.

Abstract: The memory device includes a memory block with an array of memory cells. The memory device also includes control circuitry that is in communication with the memory cells. The control circuitry is configured to program a group of the memory cells in a programming operation that does not include verify to obtain a natural threshold voltage (nVt) distribution, calculate an nVt width of the nVt distribution, compare the nVt width to a threshold, and identify the memory block as being vulnerable to cross-temperature read errors in response to the nVt width exceeding the threshold.

Abstract: A circuit is provided that includes a first transistor having a first terminal, a second terminal and a third terminal, and a second transistor comprising a first terminal, a second terminal and a third terminal. The first terminal of the first transistor comprises an input terminal of the circuit, the second terminal of the first transistor is coupled to a power supply bus, and the first transistor conducts a first current. The first terminal of the first transistor comprises an output terminal of the circuit, the second terminal of the second transistor is coupled to the power supply bus, and the third terminal of the second transistor is coupled to the third terminal of the first transistor. The second transistor conducts a second current proportional to the first current substantially independent of distance between the first transistor and the second transistor.

Abstract: In a non-volatile memory system that performs programming of selected memory cells (in coordination with pre-charging and boosting of channels for unselected memory cells) and program-verify to determine whether the programming was successful, the system transitions from program-verify to the next dose of programming by concurrently lowering a voltage applied to a selected word line and voltages applied to word lines on a first side of the selected word line at the conclusion of program-verify. Subsequent to lowering the voltage applied to the selected word line, the system successively lowers voltages applied to groups of one or more word lines on a second side of the selected word line at the conclusion of program-verify beginning with a group of one or more word lines immediately adjacent the selected word line and progressing to other groups of one or more word lines disposed increasingly remote from the selected word line.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected word lines. The memory cells are disposed in strings and configured to retain a threshold voltage. A control means is configured to apply a program voltage to selected ones of the word lines while applying pass voltages to unselected ones of the word lines and ramp down both the selected ones of the plurality of word lines and the unselected ones of the word lines to a recovery voltage at a start of a verify phase of each of a plurality of program loops and apply a targeted word line bias to each of the word lines during the verify phase. The control means is also configured to adjust the recovery voltage based on the targeted word line bias applied to each of the plurality of word lines during the verify phase.

Abstract: A memory device with adaptive sense time tables is disclosed. In order to maintain a desired (initial or preset) threshold voltage distribution, the sense time is adjusted as the program-erase cycle count increases. The program-erase cycle process tends to wear down memory cells, causing the QPW window to expand and the threshold voltage to widen. However, by adjusting (i.e., reducing) the sense time for increased program-erase cycles, the QPW window and the threshold voltage can be at least substantially maintained. Additionally, systems and methods for adjusting sense time based on die-to-die variations are also disclosed.

Abstract: Memory cells are arranged as NAND strings to form a block divided into sub-blocks, and each NAND string includes a dummy memory cell connected to a dummy word line. Memory cells are programmed by applying programming pulses to a selected word line in a selected sub-block with program-verify performed between pulses. Unselected NAND strings are inhibited from programming by boosting channels of the unselected NAND strings in the selected sub-block from a positive pre-charge voltage to a boosted voltage. The pre-charging of the channels of unselected NAND strings is performed while lowering voltages at the end of program-verify by applying overdrive voltages to data word lines in a sub-block closer to the source line than the selected sub-block and lowering to a resting voltage a dummy word line between the sub-blocks prior to lowering to a resting voltage the data word lines in the sub-block closer to the source line.

Abstract: A memory system programs memory cells connected to a selected word line by applying doses of programming and performing program-verify between doses. An efficient and low current program-verify operation includes: while scanning the results of a previous program-verify operation, ramp up voltages on the select lines for the next program-verify operation without waiting for the scan to complete and ramp up voltages on unselected word lines for the next program-verify operation following a step signal (so that voltage applied to the unselected word lines rise in steps) without waiting for the scan to complete.

Abstract: The memory device includes a plurality of dies, and each die includes a plurality of blocks with a plurality of word lines. Some of the word lines are arranged in a plurality of exclusive OR (XOR) sets with each XOR set containing word lines in the same positions across the plurality of dies. The memory device further includes a controller that is configured to program the word lines of the blocks of at least one of the dies in a first programming direction. The controller is further configured to program the word lines of the blocks of at least one other die in a second programming direction that is opposite of the first programming direction.

Abstract: Technology is disclosed for a non-volatile memory system that decouples dataload from program execution. A memory controller transfers data for a program operation and issues a first type of program execution command. When in a coupled mode, the die programs the data in response to the first type of program execution command. When in a decoupled mode, rather than program the data into non-volatile memory cells the die enters a wait state. Optionally, the memory controller can instruct another die to execute a memory operation while the first die is in the wait state. In response to receiving a second type of program execution command from the memory controller when in the wait state, the first die will program the data into non-volatile memory cells. The memory controller may issue the second type of program execution command in response to determining that sufficient power resources (or thermal budget) exist.

Abstract: A semiconductor wafer includes pairs of semiconductor dies having test pads which are electrically coupled to each other to enable testing of pairs of semiconductor dies together at the same time. In this way, even wafers having large numbers of semiconductor dies can be tested with a semiconductor test assembly in a single touch-down test process.

Abstract: A rotatable transmission electron microscope (TEM) grid holder includes first and second legs orthogonally positioned with respect to each other. Each clamp holder leg is configured to be received within a hole in a main stage supporting the rotatable TEM grid holder. When the first leg of the clamp holder is affixed within the main stage, the sample has a first orientation with respect to the FIB, and when second leg of the clamp holder is affixed within the main stage, the sample has a second orientation with respect to the FIB, rotated 90° relative to the first orientation. The sample may be rotated back and forth between the first and second orientations multiple times as needed to produce a sample which may be clearly imaged by the TEM system, substantially free of curtaining effects.

Abstract: During a read operation for memory cells connected a selected word line, a memory system adjusts the overdrive voltage applied to word lines adjacent the selected word line in order to compensate for margin degradation between the erased data state and the lowest programmed data state.

Abstract: Technology is disclosed herein in which a duration of a program pulse used to program non-volatile memory cells such as NAND may be increased responsive to a programming failure using a shorter duration program pulse. The duration of at least one program pulse may be increased for at least one group of memory cells in response to a failure to program a group using a default program pulse duration. The group that experiences the increased duration program pulse may be the same group for which the program operation failed using the shorter program pulse or may be a different group than the group for which the program operation failed using the shorter program pulse.

Abstract: A semiconductor wafer includes pairs of semiconductor dies having test pads which are electrically coupled to each other to enable testing of pairs of semiconductor dies together at the same time. In this way, even wafers having large numbers of semiconductor dies can be tested with a semiconductor test assembly in a single touch-down test process.