Abstract: A non-volatile memory system detects a memory operation failure. In response to the memory operation failure, the system determines whether adjusting an overdrive voltage applied to a word line avoids the memory operation failure. If adjusting the overdrive voltage applied to the word line avoids the memory operation failure, then future memory operations are performed by applying the adjusted overdrive voltage to the word line.

Abstract: A memory system programs memory cells connected to a selected word line by applying doses of programming and performing program-verify between doses. An efficient and low current program-verify operation includes: while scanning the results of a previous program-verify operation, ramp up voltages on the select lines for the next program-verify operation without waiting for the scan to complete and ramp up voltages on unselected word lines for the next program-verify operation following a step signal (so that voltage applied to the unselected word lines rise in steps) without waiting for the scan to complete.

Abstract: A non-volatile memory system is configured to program non-volatile memory cells by applying doses of programming to the memory cells and performing a program-verify operation following each dose of programming. Each dose of programming and the corresponding program-verify operation following the dose of programming is referred to as a program loop. The program-verify operation comprises applying a verify reference voltage to a selected word line and applying an overdrive voltage to unselected word lines. To reduce the amount of current used, the memory system includes a loop dependent reduction in the ramp-up rate of the overdrive voltage applied to unselected word lines during program-verify.

Abstract: A three dimensional non-volatile memory structure includes word lines connected to non-volatile memory cells arranged in blocks. A plurality of word line switches are connected to the word lines and one or more sources of voltage. The word line switches are arranged in groups of X word line switches such that each group of X word line switches is positioned in a line under Y blocks of non-volatile memory cells and has a length that is equal to the width of the Y blocks of non-volatile memory cells. To allow closer placement of word line switches that supply different blocks and support the possible large voltage differences between their transistors, word line switches supplying different blocks are formed over a single active region and separated by an intermediate control gate set to be off.

Abstract: A three-dimensional memory device includes an alternating stack of source layers and drain layers located over a substrate, a memory opening vertically extending through the alternating stack, a vertical word line located in the memory opening and vertically extending through each of the source layers and the drain layers of the alternating stack, discrete semiconductor channels contacting horizontal surfaces of a respective vertically neighboring pair of a source layer of the source layers and a drain layer of the drain layers, and a vertical stack of discrete memory material portions laterally surrounding the vertical word line.

Abstract: A three-dimensional memory device includes a first alternating stack of first insulating layers and first electrically conductive layers located over a semiconductor material layer, an inter-tier dielectric layer, and a second alternating stack of second insulating layers and second electrically conductive layers located over the inter-tier dielectric layer. A memory opening vertically extends through the second alternating stack, the inter-tier dielectric layer, and the first alternating stack. A memory opening fill structure is located in the memory opening, and includes a first vertical semiconductor channel, a second vertical semiconductor channel, and an inter-tier doped region located between the first and the second semiconductor channel, and providing a first p-n junction with the first vertical semiconductor channel and providing a second p-n junction with the second vertical semiconductor channel.

Abstract: An apparatus includes control circuits configured to connect to a plurality of non-volatile memory cells. The control circuits are configured to receive a read command directed to at least one logical page of data during a program operation to store the at least one logical page of data in a plurality of non-volatile memory cells. The control circuits are further configured to stop the program operation at an intermediate stage of programming, read the plurality of non-volatile memory cells at the intermediate stage to obtain first partial data of at least one logical page and obtain the at least one logical page of data by combining the first partial data with second partial data of the at least one logical page stored in data latches.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers, and memory stack structures extending through the alternating stack. Each of the memory stack structures includes a vertical semiconductor channel, a tunneling dielectric layer, a vertical stack of discrete silicon nitride memory elements located at levels of the electrically conductive layers, and a vertical stack of discrete silicon oxide blocking dielectric structures laterally surrounding the vertical stack of discrete silicon nitride memory elements. Each of the silicon oxide blocking dielectric structures includes a silicon oxynitride surface region, and an atomic concentration of nitrogen atoms within the silicon oxynitride surface region decreases with a lateral distance from an interface between the silicon oxynitride surface region and a respective one of the silicon nitride memory elements.

Abstract: Two types of support pillar structures are formed in a staircase region of an alternating stack of insulating layers and sacrificial material layers. First-type support pillar structures are formed in areas distal from backside trenches to be subsequently formed, and second-type support pillar structures may be formed in areas proximal to the backside trenches. The second-type support pillar structures may be formed as dielectric support pillar structures, or may be formed with at least one additional dielectric spacer.

Abstract: A first field effect transistor contains a first active region including a source region, a drain region and a channel region located between the source region and the drain region, a first gate dielectric overlying the active region, and a first gate electrode overlying the first gate dielectric. A second field effect transistor contains a second active region including a source region, a drain region and a channel region located between the source region and the drain region, a second gate dielectric overlying the active region, a second gate electrode overlying the second gate dielectric. A trench isolation region surrounds the first and the second active regions. The first field effect transistor includes a fringe region in which the first gate electrode extends past the active region perpendicular to the source region to drain region direction and the second field effect transistor does not include the fringe region.

Abstract: A memory system is described having an x-direction (bit line direction) divided sub-block mode. Each block is divided in a y-direction and in the x-direction into a number of groups of contiguous NAND strings that are referred to as XY sub-blocks. The memory system performs a memory operation in parallel in multiple XY sub-blocks in a block while inhibiting the memory operation in the other XY sub-blocks in the block. Each XY sub-block for which the memory operation is performed has its NAND strings connected to a different set of contiguous bit lines. In an aspect the memory operation is a program operation with selected memory cells in each of the multiple XY sub-blocks programmed in parallel while inhibiting programming of all memory cells in all other XY sub-blocks in the block. In one aspect, the memory operation is an erase operation.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to word lines and disposed in memory holes each comprising a channel. The memory cells retain a threshold voltage and are operable in one of a first read condition in which a word line voltage of the word lines is discharged and a second read condition in which the word line voltage of the word lines is coupled up to a residual voltage level. A control means is configured to apply a predetermined refresh read voltage to the word lines at predetermined intervals of time during a refresh read operation to maintain the memory cells in the second read condition. The control means also adjusts a read setup time in which the word lines are ramped up and the channel is discharged during a read operation based on occurrences of the refresh read operation.

Abstract: The memory device includes a memory block with an array of memory cells arranged word lines. The memory device also includes control circuitry that is configured to program final data into a selected word line in a multi-pass programming operation that includes a first pass and a second pass. In the first pass, the control circuitry is configured to program the memory cells of the selected word line to foggy data and program parity data in the memory device. The parity data includes three possible data states. Prior to the second pass, the control circuitry is configured to read the foggy data and the parity data and reconstruct the final data from the foggy data and the parity data. In the second pass, the control circuitry is configured to program the memory cells of the selected word line from the foggy data to the final data.

Abstract: An apparatus is provided that includes a control circuit coupled to a plurality of non-volatile memory cells disposed in a plurality of planes. The control circuit is configured to concurrently erase a block of memory cells in each of the plurality of planes, determine that the concurrent erase failed, disconnect a first one of the planes from the plurality of planes to form first remaining planes, and concurrently erase a block of memory cells in each of the first remaining planes.

Abstract: A non-volatile memory system detects an indication of erase depth of a population of memory cells and adjusts the programming process for the memory cells based on the detected erase depth.

Abstract: Technology is disclosed herein for a memory device having a narrow gap between planes and a method of shrinking the gap between planes. A first and second adjacent planes each has a word line (WL) hookup region at mid-plane. A dummy array region resides between the two planes. The dummy array region may contain a stack of alternating layers of a first insulating material and a second insulating material. There is a first electrical isolation structure between the dummy array region and a stack in the first plane. There is a second electrical isolation structure between the dummy array region and a stack in a second plane. The electrical isolation structures may be formed in narrow trenches. The combination of the dummy array region and the two electrical isolation structures results in a very short gap between the adjacent planes.

Abstract: Systems and methods disclosed herein provide for selectively activating or deactivating one or more memory of a memory array, such that related data path logic of deactivated memory dies neither detects nor processes control signals or data signals for data operations. Examples of the systems and methods provided herein operate to detect a first enable signal at a memory die and detect a first data signal on input/output (I/O) receivers of the memory die. Responsive to detecting at least the first enable signal, a bit value encoded in the first data signal is latched to obtain a first bit pattern. A second bit pattern is obtained, and, based on a comparison of the first bit pattern to the second bit pattern, the I/O receivers of the memory die are activated.

Abstract: Techniques are presented for the application of neural networks to the fabrication of integrated circuits and electronic devices, where example are given for the fabrication of non-volatile memory circuits and the mounting of circuit components on the printed circuit board of a solid state drive (SSD). The techniques include the generation of high precision masks suitable for analyzing electron microscope images of feature of integrated circuits and of handling the training of the neural network when the available training data set is sparse through use of a generative adversary network (GAN).

Abstract: The memory device includes a memory block with memory cells arranged in word lines that are divided into sub-blocks. Control circuitry is configured to program each of the word lines of a selected sub-blocks in a plurality of program loops. During at least one program loop, the control circuitry applies a programming pulse to a selected word line. The control circuitry is also configured to simultaneously apply a verify voltage to the selected word line and a pass voltage to unselected word lines. In a first phase of a multi-phase pre-charge process, the control circuitry reduces the voltages applied to the selected word line and at least one unprogrammed word line to a low voltage. In a second phase that follows the first phase, the control circuitry reduces the voltages applied to all word lines that remained at the pass voltage to the low voltage.

Abstract: An apparatus is provided that includes a control circuit coupled to a plurality of non-volatile memory cells. The control circuit is configured to perform a program-verify iteration on a first set of the non-volatile memory cells in a plurality of program loops, determine that the first set of the non-volatile memory cells passes verification to a particular programmed state in a first number of program loops, determine a first voltage based on the first number of program loops, add an adaptive voltage offset to the first voltage to obtain a second voltage, and program a second set of the non-volatile memory cells in a plurality of program loops using the second voltage. The adaptive voltage offset varies as a function of temperature.