Abstract: Since a head part is arranged in an inclined posture, the ink ejected from a nozzle surface of the head part may drip to a first lower surface peripheral edge portion along the nozzle surface, and then drops from a first long side of a lower surface of the head part toward a first side wall of a cover member being arranged below the head part. The first side wall having an upper end portion is located away from the first long side. Thus, the dropped ink is collected by the cover member without being attached to the upper end portion of the first side wall. Therefore, the ink can be prevented from being solidified at the first lower surface peripheral edge portion and the reattachment of the ink to the nozzle surface can be effectively prevented.

Abstract: A data processing method that processes a plurality of unit processing data (each unit processing data include plural types of time-series data) includes an evaluation value distribution utilization step, in which processing that uses evaluation value distributions showing degrees of each value of evaluation values obtained by evaluating each time-series datum is carried out (for example, a step in which each time-series datum is compared with reference data and scoring that quantifies results obtained thereby as the evaluation values is carried out, and a step in which judgment of abnormality degrees is carried out using the evaluation value distributions based on results of the scoring); and an evaluation value distribution update step, in which the evaluation value distributions are updated.

Abstract: A front surface of a semiconductor wafer is rapidly heated by irradiation of a flash of light. Temperature of the front surface of the semiconductor wafer is measured at predetermined intervals after the irradiation of the flash of light, and is sequentially accumulated to acquire a temperature profile. From the temperature profile, an average value and a standard deviation are each calculated as a characteristic value. It is determined that the semiconductor wafer is cracked when an average value of the temperature profile deviates from the range of ±5? from a total average of temperature profiles of a plurality of semiconductor wafers or when a standard deviation of the temperature profile deviates from the range of 5? from the total average thereof of the plurality of semiconductor wafers.

Abstract: A substrate treatment apparatus includes: a substrate holding unit; a rotator for rotating the substrate holding unit; a first liquid nozzle for supplying a rinsing liquid; a second liquid nozzle for supplying a low surface tension liquid; a heater; a lifting mechanism for relatively moving up and down the heater between a contact position allowing the heater to be brought into contact with the lower surface of the substrate and a separation position allowing the heater to be separated from the substrate; a gas nozzle provided in an upper surface of the heater to suck the substrate; a suction pump for sucking an atmosphere above the heater through the gas nozzle; a gas supply source for supplying an inert gas toward above the heater through the gas nozzle; and a controller for selectively performing suction of the atmosphere or supply of the inert gas, through the gas nozzle.

Abstract: A silicon etching solution includes a mixed solution comprising a quaternary alkylammonium hydroxide and water and further comprises a compound represented by the following formula (1): R1O—(CmH2mO)n—R2??(1) wherein R1 is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, R2 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, m is an integer of 2 to 6, and n is 1 or 2.

Abstract: An organ container includes flexible films and a tube holder. The films hold an organ in contact with the surface of the organ. The tube holder holds tubes that extend between the organ in the films and an outside of the films. This makes it possible to hold and preserve the organ while allowing a liquid to be perfused through the organ via the tubes. It is also possible to reduce movements of the organ relative to the organ container and to reduce damage to the organ.

Abstract: After a semiconductor wafer held by a susceptor in a chamber is preheated by irradiating the semiconductor wafer with light from halogen lamps, the semiconductor wafer is irradiated with a flash of light from flash lamps. A temperature of the semiconductor wafer is measured with an end edge part radiation thermometer and a temperature of the susceptor is measured with a central part radiation thermometer. It is determined that the semiconductor wafer bows when a specific singular point appears in a temporal differentiation in the temperature measured with the end edge part radiation thermometer or a temporal differentiation in the temperature measured with the central part radiation thermometer. A flash light irradiation of the semiconductor wafer which is determined to be in the bowing state is omitted and the semiconductor wafer is transported out of the chamber, and the subsequent semiconductor wafer is transported into the chamber.

Abstract: In the air-blow dryers 7a, 7b, the back surface M2 of the printing medium M is supported by the rollers 74 while the hot wind is injected from the nozzles 76u to the front surface M1 of the printing medium M. By extending the printing medium M along the rollers 74, the evaporation of the moisture can be promoted by the hot wind while the formation of creases of the printing medium M is suppressed against the influence of the temperature distribution caused by the latent heat of the moisture on the printing medium M. After a certain amount of the moisture is evaporated, the temperature of the printing medium M becomes relatively uniform. In the air-blow dryers 7c, 7d, the printing medium M is dried by injecting the hot wind to the printing medium M from the nozzles 76l and 76u from both sides.

Abstract: A chemical liquid preparation method of preparing a chemical liquid for treating a film formed on a substrate, including a gas dissolving process in which an oxygen-containing gas and an inert-gas-containing gas are dissolved in the chemical liquid by supplying the oxygen-containing gas which contains oxygen gas and the inert-gas-containing gas which contains an inert gas to a chemical liquid, wherein in the gas dissolving process, a dissolved oxygen concentration in the chemical liquid is adjusted by setting a mixing ratio between the oxygen-containing gas and the inert-gas-containing gas supplied to the chemical liquid as a mixing ratio corresponding to a predetermined target dissolved oxygen concentration.

Abstract: A semiconductor wafer is heated by a flash of light emitted from a flash lamp after being preheated by a halogen lamp. Temperature of the semiconductor wafer immediately before the flash of light is emitted is measured by a lower radiation thermometer. At the time of irradiation with a flash of light, an upper radiation thermometer measures temperature increase of a front surface of the semiconductor wafer. Front surface temperature of the semiconductor wafer is calculated by adding the temperature increase of the front surface of the semiconductor wafer at the time of irradiation with a flash of light measured by the upper radiation thermometer to the back surface temperature of the semiconductor wafer measured by the lower radiation thermometer.

Abstract: A printing apparatus for printing on a front surface of a printing medium, and thereafter printing on a back surface of the printing medium. The apparatus includes the following elements: a front surface print head for printing a front surface image based on front surface image data, over a surface page length on the front surface of the printing medium; a back surface print head for printing a back surface image based on back surface image data, on the back surface of the printing medium; a data corrector for creating corrected front surface image data by correcting an image size of the front surface image data based on elasticity information in the transport direction; and a printing controller for causing printing based on the corrected front surface image data, and controlling the back surface print head to perform printing on the back surface.

Abstract: A printing apparatus configured to print on a continuous sheet to be cut into a plurality of cut sheets at a plurality of cutting positions while being conveyed, includes a conveyance mechanism configured to convey the continuous sheet, and a print head provided so as to face a conveyance path for the continuous sheet in the conveyance mechanism and configured to sequentially print a plurality of cutting marks indicating the plurality of cutting positions on the continuous sheet being conveyed by the conveyance mechanism, in which, from between front end portions and rear end portions of each of the pages in a conveyance direction of the continuous sheet in the conveyance mechanism when printing by the print head is performed, the print head prints the cutting marks on the rear end portions for a plurality of pages on the continuous sheet corresponding to the plurality of cut sheets.

Abstract: The substrate processing method includes alternately performing a plurality of times of a metal oxide layer forming process in which an oxidation fluid is supplied to a surface of the substrate and a metal oxide layer composed of a one-atom layer or a several-atom layer is formed on a surface layer of the metal layer; and a metal oxide layer removal process in which an etching solution is supplied to the surface of the substrate and the metal oxide layer is removed from the surface of the substrate. A final dissolved oxygen concentration which is a dissolved oxygen concentration in the etching solution supplied to the surface of the substrate in a final metal oxide layer removal process is lower than an initial dissolved oxygen concentration which is a dissolved oxygen concentration in the etching solution supplied to the substrate in an initial metal oxide layer removal process.

Abstract: A substrate processing apparatus includes a base portion 1541 that is disposed in a manner of being adjacent to a chamber; a hand 155 that holds a substrate S; an arm 1542 that is attached to the base portion 1541, supports the hand, and moves the hand forward and rearward by horizontally moving the hand with respect to the base portion; and a cover portion 156 that accommodates the hand in an internal space. The cover portion has a cover main body 1561 forming the internal space and an extending member 1562 having a hollow structure which penetrates the cover portion in a horizontal direction and of which one end serves as an opening 1562a and being engaged with the cover main body in a state of being movable in the horizontal direction while the opening communicates with the internal space.

Abstract: First, a color close to a prediction target color is selected as a first similar color from among a plurality of similar candidate colors. Next, a first relational expression representing a relationship of spectral reflectances of a solid patch between a reference medium and a prediction target medium is obtained for the first similar color. Then, spectral reflectances of the solid patch in the prediction target medium for the prediction target color are predicted by applying spectral reflectances of a solid patch in the reference medium for the prediction target color to the first relational expression. Finally, spectral reflectances of each halftone patch in the prediction target medium for the prediction target color are predicted based on the prediction result.

Abstract: After printing cue marks and front surface images on the front surface of web paper by a printing station, an image data elongation-contraction processor creates corrected back surface image data based on elasticity information, and a printing station prints back surface images based on the corrected back surface image data, on the back surface of the printing medium. At this time, a page interval calculator calculates a page interval from an interval between the cue marks detected by a detector, and a difference computing unit calculates differences between the page interval and image size in a transport direction of the corrected back surface image data. Since these differences indicate shifts of the correction based on the elasticity information, optimal elasticity information can be set by revising the elasticity information with these differences through a setting unit. Consequently, the operator of the apparatus can easily set optimal elasticity information based on the differences.

Abstract: The area of the openings Ow that discharges the white ink is larger than the area of the openings Ot that discharges the color inks. Since the openings Ow are secured to be large in this way, more white ink can be discharged to one pixel while the number of ink droplets discharged by the multi-drop method is suppressed or without depending on the multi-drop method. As a result, a generation amount of an ink mist can be suppressed while the discharge amount of the white ink is secured.

Abstract: In a printing method, is obtained position information of an invisible region invisible from outside, out of the printing surface of the packaging base material. Then a flushing process in which ink is ejected the ink toward the invisible region from the nozzle based on the position information is performed. Therefore, printing for packaging pouch can be satisfactorily performed on the packaging base material without impairing the design quality of the packaging pouch manufactured by applying the bag making process to the packaging base material.

Abstract: A substrate treatment device is provided, including a substrate holding unit holding a substrate and rotating the substrate; plural nozzles each having a discharge port and discharging a treatment liquid from the discharge port at a treatment position; a camera imaging an imaging region from an imaging position to acquire captured images, the imaging region containing the treatment liquid discharged from the discharge port of each nozzle positioned at the treatment position, and the imaging position being above the substrate held on the substrate holding unit and in a plan view, the imaging position being positioned at a central side of the substrate with respect to the nozzles and at an upstream side in a rotation direction of the substrate holding unit with respect to the nozzles; and an image processing unit determining a discharge state of the treatment liquid based on the captured images.

Abstract: A substrate processing apparatus includes a substrate holder, a rotating mechanism, a processing liquid discharge unit, and a gas discharge unit. The processing liquid discharge unit discharges a liquid flow of a processing liquid such that the liquid flow comes into contact with a landing position in a rotation path of a peripheral portion of an upper surface of the substrate being rotated. The gas discharge unit discharges a first gas flow of an inert gas from above toward a first position upstream from the landing position in a direction of rotation of the substrate in the rotation path, and discharges a second gas flow of the inert gas from above toward a second position upstream from the first position in the direction of rotation of the substrate in the rotation path. The kinetic energy of the second gas flow is lower than the kinetic energy of the first gas flow.