Abstract: A method of providing a Transient Voltage Suppression (TVS) device is described utilizing a Metal Oxide Semiconductor (MOS) structure and an Insulated Gate Bipolar Transistor (IGBT) structure. The MOS based TVS devices offer reduced leakage current with reduced clamp voltages between 0.5 and 5 volts. Trench MOS based TVS device (72) provides an enhanced gain operation, while device (88) provides a top side drain contact. The high gain MOS based TVS devices provide increased control over clamp voltage variation.

Abstract: A semiconductor device is formed to have a shape that reduces the thermal resistance of the semiconductor device.

Abstract: In one embodiment, a power supply controller has a plurality of PWM control channels. The PWM control signals of the PWM control channels are selectively alternated among the outputs of the power supply controller.

Abstract: In one embodiment, an error amplifier of a power supply controller forms differential error signals that are used to set an active and inactive state of a power switch.

Abstract: In one embodiment, a power supply controller of a power supply system uses an algorithm to reduce the number of drive pulses to the output transistors under light load conditions. The algorithm groups the drive pulses to the output transistors into sets and removes some of the drive pulses for each set drive pulses issued by the controller. Each successive set removes additional drive pulses.

Abstract: In one embodiment, an SCR device (41) includes a p+ wafer (417), a p? layer (416), an n+ buried layer (413) and an n? layer (414). P? wells (411,421) are formed in the n? layer (414). N+ regions (412,422) and p+ regions (415,425) are formed in the p? wells (411,421). A first ohmic contact (431) couples one n+ regions (422) to one p+ region (425). A second ohmic contact (433) couples another n+ region (412) to another p+ region (415) to provide physically and electrically symmetrical low-voltage p-n-p-n silicon controlled rectifiers. A deep isolation trench (419) surrounding the SCR device (41) and dopant concentration profiles provide a low capacitance SCR design for protecting high frequency integrated circuits from electrostatic discharges.

Abstract: In one embodiment, an over-voltage protection circuit of a power supply system disables an upper power transistor of an output stage of the power supply system responsively to an over-voltage condition on an output voltage of the power supply system. Subsequently, the over-voltage protection circuit alternately enables and disables a lower power transistor of the output stage responsively to respective first and second value of the output voltage.

Abstract: A MOSFET device (50) has a trench (60) extending from a major surface (56) of the device (50). Within the trench (60), a gate structure (62) is formed where the top surface (64) is below the major surface (56). Source regions (66, 68) are formed along a vertical wall (84) inside of the trench (60). The source regions (66, 68) have a horizontal component along the major surface (56) and a vertical component extending the vertical wall (84). The majority of the source regions (66, 68) are formed along the vertical wall (84) within the trench (60). A typical aspect ratio of the vertical length of the source regions (66, 68) to the horizontal width is greater than 3:1. An Inter-layer dielectric (ILD) layer (74) is formed on the gate structure (62) within the trench (60) below the major surface (56).

Abstract: A power semiconductor device including a semiconductor die having electrically active first and second surfaces. A mark is located on the second surface configured to facilitate identification of the device and a metal layer is formed over the second surface of the semiconductor die and over the mark. The metal layer is configured to conduct a current of the device and to allow the mark to be visible for identification purposes.

Abstract: A semiconductor device (10) is formed on a semiconductor substrate (12) whose surface (24) is formed with a trench (18). A capacitor (20) has a first plate (22) formed over the substrate surface with first and second portions lining first and second sidewalls (25) of the trench, respectively. A second plate (35, 38) is formed over the first plate and extends into the trench between the first and second portions.

Abstract: In one embodiment, a transistor is formed to have alternating depletion and conduction regions that are formed by doping the depletion and conduction regions through an opening in a substrate of the transistor.

Abstract: In one embodiment, a lateral FET structure (30) is formed in a body of semiconductor material (32). The structure (30) includes a plurality non-interdigitated drain regions (39) that are coupled together with a conductive layer (57), and a plurality of source regions (34) that are coupled together with a different conductive layer (51). One or more interlayer dielectrics (53,54) separate the two conductive layers (51,57). The individual source regions (34) are absent small radius fingertip regions.

Abstract: A voltage regulator (10) is formed to generate a compensation current to flow when an output voltage of the voltage regulator (10) exceeds a compensation value. The compensation current is at least equal to the leakage current of the output transistor (24).

Abstract: A variable-frequency oscillator (10) is formed to change an internal delay of the oscillator inversely proportional to changes in the frequency of the oscillator.

Abstract: A power supply system (10) forms an active zone that facilitates the power supply system (10) enabling an output transistor (37) when the input voltage (30) is between a first voltage value and a second voltage value. When the output transistor is enabled, it forms a load current (35) having an instantaneous value that when averaged over the period of the input signal results in a desired average value of the load current.

Abstract: In one embodiment, a power switch device (33) includes a first MOSFET device 41 and a second MOSFET device (42). A split gate structure (84) including a first gate electrode (48,87) controls the first MOSFET device (41). A second gate electrode (49,92) controls the second MOSFET device (42). A current limit device (38) is coupled to the first gate electrode (48,97) to turn on the first MOSFET device during a current limit mode. A comparator device (36) is coupled to the second gate electrode (49,92) to turn on the second MOSFET device (42) when the power switch device (33) is no longer in current limit mode.

Abstract: A power control system (25) uses two separate currents to control a startup operation of the power control system (25). The two currents are shunted to ground to inhibit operation of the power control system (25) and one of the two currents is disabled to minimize power dissipation. The two independently controlled currents are generated by a multiple output current high voltage device (12) responsively to two separate control signals (23, 24).

Abstract: A semiconductor switching device (10) is formed on a semiconductor substrate (12) having a trench (44) formed on one of its surfaces (42). A control electrode (32) activates a wall of the trench to form a conduction channel (36). A first conduction electrode (40) is disposed on the semiconductor substrate to have a first doped region (34) for receiving a current and a second doped region (24) for routing the current to the conduction channel.

Abstract: A power control system uses two separate currents to control a startup operation of the power control system. One of the currents has a small value and is used to charge an output voltage to an initial value. Once the initial value is reached, a second current that has a large value is used to charge the output voltage to an operating voltage value.

Abstract: An integrated detector circuit (20) includes first and second gain stages (GS1, GS2). The first gain stage has an input (82) that monitors a high frequency signal (VRFDET) for routing a first detection current (IS1) to a node (60). The second gain stage includes a first current source (PF1) that supplies a bias current (IMAX1) indicative of a predefined amplitude of the high frequency signal. An input of the second gain stage monitors the high frequency signal to route a portion of the bias current to the node as a second detection current (IS2), which is limited to the bias current when the high frequency signal is greater than the predefined amplitude to compensate for a nonlinearity in a transconductance of the second gain stage.