Abstract: A semiconductor device includes a voltage input circuit node and a ground voltage node. A first transistor is coupled between the voltage input circuit node and the ground voltage node. A triggering circuit is coupled between the voltage input circuit node and the ground voltage node in parallel with the first transistor. The triggering circuit includes a trigger diode. An output of the triggering circuit is coupled to a control terminal of the first transistor. A load is powered by coupling the load between the voltage input circuit node and the ground voltage node.

Abstract: A semiconductor device includes a semiconductor wafer. A plurality of pillar bumps is formed over the semiconductor wafer. A solder is deposited over the pillar bumps. The semiconductor wafer is singulated into a plurality of semiconductor die after forming the pillar bumps while the semiconductor wafer is on a carrier. An encapsulant is deposited around the semiconductor die and pillar bumps while the semiconductor die remains on the carrier. The encapsulant covers an active surface of the semiconductor die between the pillar bumps.

Abstract: A circuit comprising a first regulator coupled to a voltage input, a second regulator coupled to a voltage output and a switch coupled to the first regulator and the second regulator, wherein the switch is configured to provide voltage to a load from the voltage input when the voltage input is greater than a first predetermined voltage, and to provide voltage to the load from the voltage output when the voltage input is lower than a second predetermined voltage.

Abstract: A mobile device includes a conductive element and a ground node. The conductive element is configured to be detected by a proximity sensor. A switch is coupled between the conductive element and ground node. The conductive element is coupled to the ground node by closing the switch. A first memory element is configured to control the switch. The first memory element includes a register bit coupled to a control terminal of the switch. A data output is configured to control the switch. A FIFO is configured to provide data to the data output. The first memory element includes a FIFO. A capacitive touch controller is configured to measure a capacitance of the conductive element. A digital processing unit is configured to convert the capacitance of the conductive element to a bit of data. A second memory element is configured to store the bit of data.

Abstract: A mobile device has a proximity sensor. A compensation value of the proximity sensor is determined. The compensation value is compared to a reference compensation value to determine validity of the compensation value. A capacitance of the proximity sensor is measured. A value of the capacitance of the proximity sensor is adjusted based on the compensation value. A coefficient defining a relationship between a capacitance of the proximity sensor and a temperature of the mobile device is calculated. A temperature sensor is coupled to the proximity sensor. The temperature of the mobile device is measured. A value of the capacitance of the proximity sensor is adjusted based on the coefficient and the temperature of the mobile device. The adjusted capacitance value is compared to a threshold capacitance value to determine proximity of an object to the mobile device. A radio frequency signal is adjusted by detecting proximity.

Abstract: An antenna is disclosed that includes a ground plane extending in a first direction on a substrate and a radiating element occupying a same plane as the ground plane on the substrate, and coupled to the ground plane, the radiating element comprising a first portion with a first end and a second end extending in a substantially parallel direction to the ground plane, a feed line coupled to the first end of the first portion of the radiating element and extending in a substantially perpendicular direction from the first portion of the radiating element and a second portion having a third end and a fourth end, wherein the third end is coupled to the ground plane and the fourth end is coupled to the radiating element at a point between the first end and the second end.

Abstract: A voltage regulator has a comparator and a reference voltage coupled to a first input of the comparator. An output voltage of the voltage regulator is coupled to a second input of the comparator through a resistor. A current source is coupled to the second input of the comparator. The first current source can be a first digital-to-analog converter (DAC). A second current source can be coupled in parallel with the first DAC. The second current source can be a second DAC. The voltage regulator can include a boost topology.

Abstract: A proximity sensor has a sensing node. A radio frequency signal is received at the sensing node. The radio frequency signal is coupled to an intermediate node through a first capacitor. The radio frequency signal is coupled from the intermediate node to a ground node through a second capacitor. An RF amplifier is coupled to the sensing node. The radio frequency signal is generated using the RF amplifier. A third capacitor is coupled between the RF amplifier and the sensing node. An antenna is coupled to the sensing node. The radio frequency signal is transmitted using the antenna. A capacitance of the antenna is measured using the proximity sensor. The capacitance of the antenna is compared to a threshold to determine proximity of a conductive object. An inductor is coupled between the sensing node and the antenna. A shielding area is coupled to the intermediate node.

Abstract: A radio receiver for processing digital chirp spread-spectrum modulated signals that comprise a plurality of frequency chirps that are cyclically time-shifted replicas of a base chirp profile, said time-shifts being an encoded representation of a transmitted message. Includes a soft demapping unit that is adapted for working on fully populated as well as on partial modulation sets, and implements a timing error correction loop that acts back both in the time domain and in the frequency domain.

Abstract: A sensor for a portable connected device comprising a filter 30 is arranged to reduce a noise component on a sampled input signal, wherein the filter is arranged to consider only input measurements that change systematically in a same direction, updating an output value when all the input samples in a predetermined time window are above or below a current output value and, repeating the current output value when the input samples in the time window are below and above the current output value.

Abstract: A mobile device has a proximity sensor. A compensation value of the proximity sensor is determined. The compensation value is compared to a reference compensation value to determine validity of the compensation value. A capacitance of the proximity sensor is measured. A value of the capacitance of the proximity sensor is adjusted based on the compensation value. A coefficient defining a relationship between a capacitance of the proximity sensor and a temperature of the mobile device is calculated. A temperature sensor is coupled to the proximity sensor. The temperature of the mobile device is measured. A value of the capacitance of the proximity sensor is adjusted based on the coefficient and the temperature of the mobile device. The adjusted capacitance value is compared to a threshold capacitance value to determine proximity of an object to the mobile device. A radio frequency signal is adjusted by detecting proximity.

Abstract: A system comprising at least a mobile device (110) and a plurality of gateways (120a-120g) whose positions are known, wherein the gateways (120a-120g) are operatively arranged to determine for each gateway a time differences of arrival (TDOA) of a signal originated by the mobile device (110). A solver unit (160) computes the position of the mobile device (110), based on said time difference of arrival (TDOA). The solver unit (160) implements ELM and a LMS algorithm to compute the mobile device's one-shot location estimate based on one or several packet transmissions, and includes a procedure to decide if an LMS algorithm needs to be run and a procedure to select or combine the location output from ELM and LMS for the one-shot location output. Further the solver unit comprises a tracking algorithm to realise the tracking of the moving device or to improve location accuracy should the device static.

Abstract: A tag is provided that includes a battery having a printed anode and cathode. A printed circuit connection layer is formed in one of the anode or the cathode. A printed antenna is formed in one of the anode or the cathode. A low-power transmitter coupled to the circuit connection layer.

Abstract: A system is disclosed that includes a wireless power receiver, a battery charging system coupled to the wireless power receiver and configured to charge a battery using power received from the wireless power receiver and a wireless data communication system coupled to the wireless power receiver and the battery charging system, the wireless data communication system configured to determine a power requirement and to transmit the power requirement using the wireless power receiver.

Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die and a plurality of contact pads formed over a first surface of the semiconductor wafer. A trench is formed partially through the first surface of the semiconductor wafer. An insulating material is disposed over the first surface of the semiconductor wafer and into the trench. A conductive layer is formed over the contact pads. The conductive layer can be printed to extend over the insulating material in the trench between adjacent contact pads. A portion of the semiconductor wafer opposite the first surface of the semiconductor wafer is removed to the insulating material in the trench. An insulating layer is formed over a second surface of the semiconductor wafer and side surfaces of the semiconductor wafer. The semiconductor wafer is singulated through the insulating material in the first trench to separate the semiconductor die.

Abstract: A leadframe is formed by chemically half-etching a sheet of conductive material. The half-etching exposes a first side surface of a first contact of the leadframe. A solder wettable layer is plated over the first side surface of the first contact. An encapsulant is deposited over the leadframe after plating the solder wettable layer.

Abstract: A semiconductor device has a semiconductor wafer including a plurality of semiconductor die and a plurality of contact pads formed over a first surface of the semiconductor wafer. A trench is formed partially through the first surface of the semiconductor wafer. An insulating material is disposed over the first surface of the semiconductor wafer and into the trench. A conductive layer is formed over the contact pads. The conductive layer can be printed to extend over the insulating material in the trench between adjacent contact pads. A portion of the semiconductor wafer opposite the first surface of the semiconductor wafer is removed to the insulating material in the trench. An insulating layer is formed over a second surface of the semiconductor wafer and side surfaces of the semiconductor wafer. The semiconductor wafer is singulated through the insulating material in the first trench to separate the semiconductor die.

Abstract: A wireless communication method in a network comprising a plurality of nodes including ranging masters, broadcasting a chirp-modulated ranging requests, and ranging slaves slave, replying with thereto with chirp-modulated ranging responses, whereby mobile nodes can locate themselves passively by listening to the request/reply exchanges, based on the respective time differences of arrival.

Abstract: A capacitive proximity detector for use in a connected portable device such as a telephone, laptop or tablet, in which the capacity seen by the sensor electrode is compared with four thresholds: a proximity threshold, set lower than the other, to generate a general proximity flag, and a body detection threshold set higher than the other arranged to generate a body detection flag that indicates that the object in proximity is a part of a human body. Two object detection thresholds in the region between the proximity threshold and the body threshold define a region in which the detector can decide whether the object in proximity is an inanimate object, based on the time variation of the capacity.

Abstract: A semiconductor device is protected from electrical overstress (EOS) and electro-static discharge (ESD) events by a series protection circuit electrically coupled in series along the transmission line between a signal source and a load. The series protection circuit includes a first field-effect transistor (FET) electrically coupled in series between the signal source and load. A parallel protection circuit is electrically coupled between the transmission line and a ground node. The parallel protection circuit can include a transient-voltage-suppression (TVS) diode.