Abstract: An electronic module has a first substrate 11, an electronic element 13 provided on one side of the first substrate 13, a second substrate 21 provided on one side of the electronic element 13 and a positioning part 200 extending from the first substrate 11 to one side and abutting a circumferential part of the second substrate 21, or extending from the second substrate 21 to the other side and abutting against a circumferential part of the first substrate 11.

Abstract: An electronic module has a sealing part 90; a rear surface-exposed conductor 10, 20, 30 having a rear surface-exposed part 12, 22, 32 whose rear surface is exposed; a rear surface-unexposed conductor 40, 50 whose rear surface is not exposed; an electronic element 15, 25, which is provided in the sealing part 90 and provided on a front surface of the rear surface-exposed conductor 40, 50; a first connector 60 for electrically connecting the electronic element 15, 25 with the rear surface-exposed conductor 10, 20, 30; and a second connector 70 for electrically connecting the electronic element 15, 25 with the rear surface-unexposed conductor 40, 50. A thickness T1 of the first connector 60 is thicker than a thickness T2 of the second connector 70.

Abstract: An electronic device includes a board having a mounting surface for an electronic component, a case having an opening for insertion of the board into the case and configured to house the board inserted through the opening, and a cover fixed to the case so as to close the opening. The board also has at least one deformable device formed on an end side of the board and configured to be elastically deformable in a direction orthogonal to the mounting surface. The deformable device comes into contact with the case or the cover in a state of being elastically deformed to hold the board in a fixed state in a storage space formed through fixation of the cover to the case when the board is housed in the storage space.

Abstract: An electronic module has a first electronic unit having a first substrate 11, a first conductor layer 12 provided on one side of the first substrate 11, and a first electronic element 13 provided on one side of the first conductor layer 12, a first connection body 60 provided on one side of the first electronic element 13, and a second electronic unit having a second electronic element 23 provided on one side of the first connection body 60. The first connection body 60 has a first head part 61 and a plurality of support parts 65 extending from the first head part 61. The electronic module is characterized by that the support part 65 abuts on the first substrate 11 or the first conductor layer 12.

Abstract: An electronic module has a first substrate 11, a first electronic element 13, a second electronic element 23, a second substrate 21, a first terminal part 110 and a second terminal part 120. The first terminal part 110 has a first terminal base end part 111, a first terminal outer part 113, and a first bending part 112 that is provided between the first terminal base end part 111 and the first terminal outer part 113 and that is bent toward the other side on a side of the first terminal base end part 111. The second terminal part 120 has a second terminal base end part 121, a second terminal outer part 123, and a second bending part 122 that is provided between the second terminal base end part 121 and the second terminal outer part 123 and that is bent toward one side on a side of the second terminal base end part 121.

Abstract: An electronic device includes a board having a mounting surface for an electronic component, a case having an opening for insertion of the board into the case and configured to house the board inserted through the opening, and a cover fixed to the case so as to close the opening. The board also has at least one deformable device formed on an end side of the board and configured to be elastically deformable in a direction orthogonal to the mounting surface. The deformable device comes into contact with the case or the cover in a state of being elastically deformed to hold the board in a fixed state in a storage space formed through fixation of the cover to the case when the board is housed in the storage space.

Abstract: A control unit repeats the series of processing of comparing a first phase representing a phase of the first reference sine wave and being a phase included in the first synchronization signal, with a second phase that is the phase of the second reference sine wave when the first synchronization signal is received when the communication unit receives the first synchronization signal from the other inverter generator, changing a phase change amount per unit time of the second reference sine wave in accordance with the comparison result, continuing to update the phase of the second reference sine wave so that the phase of the second reference sine wave changes with a phase change amount per unit time after the change with reference to the first phase until the next first synchronizing signal is received from the other inverter generator.

Abstract: A method of manufacturing a chip module comprises a step of disposing a first electronic element 13 on a first jig 500, a step of disposing a first connector 60 on the first electronic element 13 via a conductive adhesive 5, a step of disposing a second electronic element 23 on the first connector 60 via a conductive adhesive 5, a step of disposing a second connector 70 on a second jig 550, a step of reversing the second jig in a state where the second connector 70 is fixed to the second jig 550 and disposing the second connector 70 on the second electronic element 23 via a conductive adhesive 5, and a step of curing the conductive adhesives 5.

Abstract: An electronic module has a first substrate 11, a first electronic element 13 provided on one side of the first substrate 11, a first connection body 60 provided on one side of the first electronic element 13, a second electronic element 23 provided on one side of the first connection body 60, a second substrate 21 provided on one side of the second electronic element 23, and an abutment body 250 that abuts on a face on one side of the second electronic element 23 and is capable of imparting a force toward one side with respect to the second substrate 21.

Abstract: A power module includes a switching element, a temperature detection part which detects an operation temperature T of the switching element, a control electrode voltage control part which controls a control electrode voltage based on a threshold voltage Vth during an operation of the switching element which is calculated based on information including the operation temperature T of the switching element detected by the temperature detection part, and a switching speed control part which controls a switching speed of the switching element based on the operation temperature T of the switching element detected by the temperature detection part.

Abstract: A printed board joining method according to an embodiment includes preparing a printed board having, on an upper surface, a plurality of connection land portions provided along a side end, preparing a printed board having, on a lower surface, a plurality of connection land portions along a side end, and joining the printed board and the printed board together with a conductive joining material such that the upper surface is opposed to the lower surface and the plurality of connection land portions are electrically connected to the corresponding connection land portions. One or more cutout portions are provided between the plurality of connection land portions and/or between the plurality of connection land portions.

Abstract: A power conversion circuit includes: a MOSFET having a super junction structure; an inductive load; and a freewheel diode. A switching frequency of the MOSFET is 10 kHz or more. When the MOSFET is turned off, a first period during which a drain current decreases, a second period during which the drain current increases, and a third period during which the drain current decreases again appear in this order. The freewheel diode is an Si-FRD or an SiC-SBD, and current density obtained by dividing a current value of the forward current by an area of an active region of the freewheel diode falls within a range of 200 A/cm2 to 400 A/cm2 when the freewheel diode is the Si-FRD, and the current density falls within a range of 400 A/cm2 to 1500 A/cm2 when the freewheel diode is the SiC-SBD.

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region an an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.

Abstract: An electronic module has a first substrate 11; a first electronic element 13 provided on one side of the first substrate 11; a first connection body 60 provided on the one side of the first electronic element 13; a second electronic element 23 provided on the one side of the first connection body 60; and a second connection body 70 provided on the one side of the second electronic element 23. The first electronic element 13 and the second electronic element 23 do not overlap in a plane direction.

Abstract: A semiconductor device has a first electrode 61; a second electrode 62; and a semiconductor layer 1 having a winding wire part 10 provided so as to surround a current flowing between the first electrode 61 and the second electrode 62, a winding return wire part, which is provided so as to surround the current, is connected to a terminal end part of the winding wire part 10 and returns toward a starting end part side from the terminal end part, and an integration circuit configuration part connected to the winding wire part 10 or the winding return wire part. The integration circuit configuration part has one or more of a resistance part 115, a capacitor part 125 and an operational amplifier part 135.

Abstract: An electronic module has an electronic element 210; a connection body 250 provided on a front face of the electronic element 210; and a detection part 100 having a winding wire part 10 provided so as to surround the connection body 250, and a winding return wire part 50 connected to a terminal end part of the winding wire part 10 and returns from the terminal end part toward a starting end part.

Abstract: A semiconductor device has: a semiconductor substrate; a drift layer of a first conductivity type; a well region of a second conductivity type; a high-concentration region of the second conductivity type, a source region of the first conductivity type; an insulating film provided on the drift layer; a first contact metal film in contact with the source region and the high-concentration region through a first opening provided in the insulating film; and a second contact metal film formed on a surface of the first contact metal film and contacting the high-concentration region through a second opening provided in the first contact metal film; a source electrode film formed on a surface of a contact metal layer including the first contact metal film and the second contact metal film. The first contact metal film includes titanium nitride, and the second contact metal film includes titanium.

Abstract: A semiconductor device includes: a seal portion; a first electronic element; a first lead terminal; a second lead terminal having one end that is disposed to be close to the one end of the first lead terminal within the seal portion, and another end that is exposed from another end of the seal portion, the other end of the seal portion being along the longitudinal direction; a first connecting element disposed within the seal portion, and having one end that is electrically connected to the first electrode disposed on the first electronic element, and another end that is electrically connected to the one end of the second lead terminal; and a conductive bonding agent.

Abstract: A switching element control circuit includes a third electrode voltage control part which controls a third electrode voltage; a temperature detection part which detects an operation temperature of the switching element; a memory part which stores an initial threshold voltage, an initial temperature when the initial threshold voltage is measured, and a temperature characteristic of a threshold voltage; and a threshold voltage calculation part which calculates a threshold voltage at the time of operating the switching element based on information including the operation temperature of the switching element, the initial threshold voltage, and an initial temperature when the initial threshold voltage is measured, and information relating to a temperature characteristic of a threshold voltage, wherein the third electrode voltage control part controls the third electrode voltage based on a threshold voltage at the time of operating the switching element calculated by the threshold voltage calculation part.