Patents Assigned to Skyworks Solution, Inc.
  • Patent number: 10290585
    Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: May 14, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Hoang Mong Nguyen, Luis Eduardo Herrera, Sergio Joaquin Gonzalez Flores, Matthew Sean Read, Anthony James Lobianco, Heliodoro Osuna
  • Patent number: 10291190
    Abstract: A power amplifier comprising a bipolar transistor connected in cascode with a field effect transistor (FET) such as a pseudomorphic high electron mobility transistor (PHEMT) device. The bipolar transistor has a common emitter and the FET a common gate. Advantageously, the bipolar transistor is a heterojunction bipolar transistor (HBT); and the HBT and the FET may be integrated on a single die. Illustrative materials for the HBT and FET are Gallium Nitride, Indium Phosphide, or Gallium Arsenide/Indium Gallium Phosphide.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: May 14, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventor: Thomas William Arell
  • Patent number: 10284149
    Abstract: A power amplifier module includes a driver transistor having first, second, and third terminals, a radio-frequency input port coupled to the first terminal of the driver transistor, a cascode transistor having first, second, and third terminals, the second terminal of the cascode transistor being coupled to the third terminal of the driver transistor, a radio-frequency output port coupled to the second terminal of the cascode transistor, and a coupling path connecting the first terminal of the cascode transistor to the third terminal of the cascode transistor, the coupling path including a capacitor.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: May 7, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventor: John William Mitchell Rogers
  • Patent number: 10284200
    Abstract: A process for fabricating a semiconductor die involves providing a semiconductor substrate, forming a first field-effect transistor on the semiconductor substrate, the first field-effect transistor having a source, a drain, a gate, and a body, forming a coupling path that couples the body of the first field-effect transistor to the gate of the first field-effect transistor, the coupling path including a diode, and forming an adjustable impedance network coupled between the body of the first field-effect transistor and a ground reference, the adjustable impedance network being configured to reduce radio-frequency distortion in the first field-effect transistor.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: May 7, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Ambarish Roy, Guillaume Alexandre Blin
  • Patent number: 10284177
    Abstract: Aspects of this disclosure relate to providing over temperature protection for a filter in a radio frequency system. The filter can include an integrated temperature sensor. A power level of a radio frequency signal provided to the filter can be reduced responsive to an indication of temperature provided by the integrated temperature sensor satisfying a threshold.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: May 7, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Joshua James Caron, Joel Anthony Penticoff
  • Patent number: 10283859
    Abstract: Aspects of this disclosure relate to selectively shielded radio frequency modules. A radio frequency module can include a package substrate, a radio frequency shielding structure extending above the package substrate, a radio frequency component over the package substrate and in an interior of the radio frequency shielding structure, and an antenna on the package substrate external to the radio frequency shielding structure. The shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: May 7, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Hoang Mong Nguyen, Anthony James LoBianco, Gregory Edward Babcock, Darren Roger Frenette, George Khoury
  • Patent number: 10284153
    Abstract: Peak voltage limiting circuits and method for power amplifiers. A power amplifier and/or a voltage limiting circuit includes a diode circuit coupled to an output of an amplification stage, the diode circuit configured to provide a conductive path from the output when an output voltage exceeds a selected value. The power amplifier and/or voltage limiting circuit also includes a sink circuit coupled to the diode circuit and a bias circuit, the sink circuit configured to reduce a bias voltage provided by the bias circuit when the output voltage exceeds the selected value to thereby limit the output voltage.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: May 7, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Anthony Francis Quaglietta, Joseph A Cuggino, Xuanang Zhu
  • Patent number: 10277174
    Abstract: Radio-frequency amplification systems, devices and methods. In some embodiments, an amplification system can include a supply circuit configured to provide a high supply voltage in an average power tracking mode. The amplification system can further include an amplifier configured to operate with the high supply voltage and provide an impedance that substantially matches an impedance of a component coupled to an output of the amplifier. The amplification system can further include a signal path configured to route an amplified signal from the output of the amplifier to the component, with the output path being substantially free of an output matching network.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: April 30, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventor: Philip John Lehtola
  • Patent number: 10277177
    Abstract: A variable load power amplifier that improves the performance of a power amplifier that provides both envelope tracking (ET) and average power tracking (APT). The variable load power amplifier can include a plurality of amplifiers that are each selectively connectable into one of a plurality of parallel combinations, each of the plurality of parallel combinations characterized by a corresponding load line. The variable load power amplifier can also include a plurality of control elements arranged to selectively connect one or more of the plurality of amplifiers into one of the plurality of parallel combinations, each of the plurality of control elements having a respective input terminal provided to receive a respective control signal, each of the plurality of control elements responsive to the respective control signal.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: April 30, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Sabah Khesbak, Florinel G. Balteanu, Hardik Bhupendra Modi
  • Patent number: 10276287
    Abstract: Disclosed herein are embodiments of an enhanced resonant frequency hexagonal ferrite material and methods of manufacturing. The hexagonal ferrite material can be Y-phase hexagonal ferrite material, such as those including strontium. In some embodiments, oxides consistent with the stoichiometry of Sr3Co2Fe24O41, SrFe12O19 or CoFe2O4 can be used form an enhanced hexagonal ferrite material.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: April 30, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventor: Michael David Hill
  • Patent number: 10276521
    Abstract: Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a multi-mode power amplifier circuit in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: April 30, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Gregory Edward Babcock, Lori Ann DeOrio, Darren Roger Frenette, George Khoury, Anthony James LoBianco, Hoang Mong Nguyen, Yasser Khairat Soliman, Leslie Paul Wallis, René Rodríguez
  • Patent number: 10269769
    Abstract: A packaged module for use in a wireless communication device has a substrate supporting a first integrated circuit die that implements at least a portion of a radio frequency baseband subsystem and a second integrated circuit die that implements at least a portion of a radio frequency front end including a radio frequency power amplifier. The substrate is disposed between the first integrated circuit die and the second integrated circuit die. An overmold encloses one of the first integrated circuit die and the second integrated circuit die.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: April 23, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Darren Roger Frenette, George Khoury, Lori Ann DeOrio
  • Patent number: 10270394
    Abstract: Embodiments described herein relate to an envelope tracking system that uses a single-bit digital signal to encode an analog envelope tracking control signal, or envelope tracking signal for brevity. In certain embodiments, the envelope tracking system can estimate or measure the amplitude of the baseband signal. The envelope tracking system can further estimate the amplitude of the envelope of the RF signal. The system can convert the amplitude of the envelope signal to a single-bit digital signal, typically at a higher, oversample rate. The single-bit digital signal can be transmitted in, for example, a low-voltage differential signaling (LVDS) format, from a transceiver to an envelope tracker. An analog-to-digital converter (ADC or A/D) can convert the single-bit digital signal back to an analog envelope signal. Moreover, a driver can increase the power of the A/D output envelope signal to produce an envelope-tracking supply voltage for a power amplifier.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: April 23, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Serge Francois Drogi, Florinel G. Balteanu, Luigi Panseri, Craig Joseph Christmas, Paul T. DiCarlo
  • Patent number: 10263647
    Abstract: Multiplexing architectures for wireless applications. In some embodiments, a front-end architecture can include a first power amplifier having an output coupled to a transmit filter through a path that is substantially free of a switch. The transmit filter can be configured for a first transmit band or a second transmit band, with the first and second transmit bands at least partially overlapping with each other. The front-end architecture can further include a receive filter configured for at least a first receive band corresponding to the first transmit band, and a second power amplifier having an output capable of being coupled to a first duplexer or a second duplexer through a selector switch. The first duplexer can include a receive portion configured for a second receive band corresponding to the second transmit band.
    Type: Grant
    Filed: April 9, 2017
    Date of Patent: April 16, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventor: Christopher Robert Little
  • Patent number: 10263602
    Abstract: Aspects of this disclosure relate to a surface acoustic wave filter with an integrated temperature sensor. The integrated temperature sensor can be a resistive thermal device configured as a reflective grating for a surface acoustic wave resonator, for example. A radio frequency system can provide over temperature protection by reducing a power level of a radio frequency signal provided to the surface acoustic wave filter responsive to an indication of temperature provided by the integrated temperature sensor satisfying a threshold.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: April 16, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Joshua James Caron, Joel Anthony Penticoff
  • Patent number: 10263072
    Abstract: Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: April 16, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Michael Joseph McPartlin, Mark M. Doherty
  • Patent number: 10263626
    Abstract: Apparatus and methods for tuning a voltage controlled oscillator (VCO) are provided. In one aspect, a method of auto-tuning in a phase-locked loop includes generating a VCO clock signal using a VCO coupled to a capacitor array, dividing the VCO clock signal to generate a divided clock signal using a prescaler circuit having a selectable division ratio, controlling a value of the selectable division ratio using a first counter and a second counter of a counter module, generating a phase-frequency detector feedback signal based on a division control signal M and the divided clock signal using the counter module, counting a number of cycles of the divided clock signal that occur during a calibration interval using a cycle counter of a digital processing logic circuit, and determining the value of a capacitor array control signal based on the number of cycles counted during the calibration interval.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: April 16, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Hua Wang, David Steven Ripley, Bryan J. Roll
  • Patent number: 10263594
    Abstract: Impedance matching circuit for radio-frequency amplifier. In some embodiments, an impedance matching circuit can include a primary metal trace having a first end configured to be capable of being coupled to a voltage source for the power amplifier, and a second end configured to be capable of being coupled to an output of the power amplifier. The impedance matching circuit can further include a secondary metal trace having first end coupled to the second end of the primary metal trace, and a second end configured to be capable of being coupled to an output node. The impedance matching circuit can further include a capacitance implemented between the first and second ends of the secondary metal trace, and be configured to trap a harmonic associated with an amplified signal at the output of the power amplifier.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: April 16, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Aleksey A. Lyalin, Weimin Sun, Nicholas Quinn Muhlmeyer, Russ Alan Reisner
  • Patent number: 10256851
    Abstract: Systems and methods related to time-division and frequency-division duplex protocols for wireless applications. In some embodiments, a wireless architecture can include a radio-frequency (RF) path configured to support a first modified time-division duplex (TDD) band operation and a second modified TDD band operation. Such a wireless architecture can allow consolidation of signal paths and/or re-use of components such as filters and duplexers, to advantageously reduce or eliminate some paths and/or components.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: April 9, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: David Richard Pehlke, Joel Richard King
  • Patent number: 10256197
    Abstract: A transistor device includes a transistor implemented over a semiconductor substrate, one or more dielectric layers formed over the transistor, and a handle wafer layer disposed on at least a portion of the one or more dielectric layers, the handle wafer layer including a topside trench defined at least in part by sidewall portions of the handle wafer layer.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: April 9, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Jerod F. Mason, Dylan Charles Bartle, David Scott Whitefield