Abstract: Disclosed herein are switching or other active FET configurations that implement a main-auxiliary branch design. Such designs include a circuit assembly for performing a switching function that includes a branch including a main path in parallel with a first auxiliary path and the main path in series with a second auxiliary path. The circuit assembly also includes a first gate bias network connected to the main path. The circuit assembly also includes a second gate bias network connected to the first auxiliary path. The circuit assembly also includes a third gate bias network connected to the second auxiliary path, the second gate bias network and the third gate bias network configured to improve linearity of the switching function.

Abstract: In some embodiments, an attenuator for electronic application can include a first group of attenuation steps, with each configured to switchably provide a first fixed attenuation value. The attenuator can further include a second group of attenuation steps, with each configured to switchably provide a second fixed attenuation value. Magnitude of the second fixed attenuation value can be less than magnitude of the first fixed attenuation value. The attenuator can be configured to be capable of providing a total attenuation value from approximately zero to a sum of the attenuation steps of the first group and the second group in increments of the second fixed attenuation value.

Abstract: In an embodiment, an apparatus includes a first radio frequency (RF) signal path and a second RF signal path. The first RF signal path can provide a first RF signal when active and the second RF signal path can provide a second RF signal when active. The second RF signal path can include a matching network with a load impedance configured to prevent a resonance in the second RF signal path due to coupling with the first RF signal path when the first RF signal path is active.

Abstract: Described herein are systems, devices, and methods for a multi-standard radio switchable multiplexer that is configured to process wireless local area network (WLAN) signals and cellular signals in the same module without the use of cascaded filters. The disclosed systems use intelligent switching to direct cellular frequency bands along targeted paths and to direct WLAN signals along different paths, such as to a dedicated WLAN module for further processing. By removing notch filters coupled to cellular band filters and/or cascaded filters, insertion losses are reduced.

Abstract: Described herein are radio-frequency (RF) modules that include shielding for improved RF performance. The RF modules including a packaging substrate with a receiving system implemented thereon. The RF module includes a shield implemented to provide RF shielding for at least a portion of the receiving system. The receiving system can include any combination of pre-amplifier or post-amplifier bandpass filters, amplifiers, switching networks, impedance matching components, phase-shifting components, input multiplexers, and output multiplexers. The shielding can include a conductive layer within a conformal shielding on an upper side and side walls of the RF module. The shielding can be an overmold formed over the packaging substrate. The conductive layer can be connected to one or more ground planes. The packaging substrate can include contact features on an underside of the substrate for mounting an underside component.

Abstract: A reconfigurable triplexer that can support more frequency bands than a traditional triplexer is disclosed. For example, the reconfigurable triplexer can handle frequencies of several hundred megahertz up to 10 gigahertz. Further, certain implementations of the reconfigurable multiplexer can reduce or eliminate frequency dead zones that exist with traditional multiplexers. The reconfigurable triplexer includes a multi-stage filter bank capable of supporting a number of frequency bands and a bypass circuit that enables the triplexer to support a variety of sets of frequencies. For instance, unlike traditional triplexers, the reconfigurable triplexer can support both frequency bands with relatively narrow spacing and frequency bands with relatively wide spacing. Further, the inclusion of the bypass circuit enables the reduction or elimination of dead zones between supported frequencies.

Abstract: Power amplification system with variable supply voltage. A power amplification system can include a power amplifier and a boost converter configured to provide a supply voltage to the power amplifier. The power amplification system can include a control system configured to provide a boost converter control signal to the boost converter to adjust the supply voltage based on a parameter associated with the power amplifier.

Abstract: Apparatus and methods for LNAs with mid-node impedance networks are provided herein. In certain configurations, an LNA includes a mid-node impedance circuit including a resistor and a capacitor electrically connected in parallel, a cascode device electrically connected between an output terminal and the mid-node impedance circuit, and a transconductance device electrically connected between the mid-node impedance circuit and ground. The transconductance device amplifies a radio frequency signal received from an input terminal. The LNA further includes a feedback bias circuit electrically connected between the output terminal and the input terminal and operable to control an input bias voltage of the transconductance device.

Abstract: A power amplifier that can support multiple communication networks while maintaining power efficiency across each of the supported communication networks is disclosed. In some implementations described herein, a power amplifier module includes a bypass circuit that enables different voltage supplies to be provided to the power amplifier. By regulating the voltage supply provided to the power amplifier, the power amplifier can support different communication networks while maintaining power efficiency across a dynamic frequency range. Moreover, embodiments herein may include a buck converter, or other form of DC-DC converter, that enables the power amplifier to operate with respect to multiple communication networks.

Abstract: High bandwidth envelope trackers are provided herein. In certain embodiments, an envelope tracking system for a power amplifier includes a switching regulator that operates in combination with a high bandwidth amplifier to generate a power amplifier supply voltage for the power amplifier based on an envelope of a radio frequency (RF) signal amplified by the power amplifier. The high bandwidth amplifier includes an output that generates an output current for adjusting the power amplifier supply voltage, a first input that receives a reference signal, and a second input that receives an envelope signal indicating the envelope of the RF signal. The second input has lower input impedance than the first input to provide a rapid transient response and high envelope tracking bandwidth.

Abstract: A wireless device comprising a first antenna and second antenna, a transceiver and a radio frequency front end system electrically coupled between the transceiver and the antennas. The RF front end system includes a first module operable to provide a high band transmit signal to the first antenna, receive a first high band receive signal and a first mid band receive signal from the first antenna. The first high band receive signal has a frequency range greater than that of the first mid band receive signal. The RF front end system further includes a second module operable to provide a mid band transmit signal to the second antenna, receive a second mid band receive signal and a second high band receive signal from the second antenna. The second high band receive signal has a frequency range greater than that of the second mid band receive signal.

Abstract: Disclosed herein are embodiments of composite hexagonal ferrite materials formed from a combination of Y phase and Z phase hexagonal ferrite materials. Advantageously, embodiments of the material can have a high resonant frequency as well as a high permeability. In some embodiments, the materials can be useful for magnetodielectric antennas.

Abstract: A packaged radio-frequency device is disclosed, including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. A shielded package may be implemented on the first side of the packaging substrate, the shielded package including a first circuit and a first overmold structure, the shielded package configured to provide radio-frequency shielding for at least a portion of the first circuit. A set of through-mold connections may be implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting volume on the second side of the packaging substrate. The device may include a component implemented within the mounting volume and a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.

Abstract: A radio frequency low noise amplifier circuit with a receive signal input, a receive signal output, and a voltage source include a low noise amplifier and a coupled inductor circuit with a primary inductive chain connected to the output of the low noise amplifier and to the voltage source. The coupled inductor circuit further includes a secondary inductive chain with a first inductor electromagnetically coupled to the primary inductive chain, and a second inductor in series with the first inductor and magnetically coupled to the primary inductive chain. The second inductor is connected to a feedback node of the low noise amplifier. There is an output matching network connected to the first inductor of the secondary inductive chain and to the receive signal output.

Abstract: A power amplifier system can include a power amplifier that provides amplification to a radio frequency signal associated with a first frequency band and outputs an amplified radio frequency signal. An acoustic wave bandpass filter such as a surface acoustic wave or bulk acoustic wave bandpass filter is arranged in a feedback configuration with respect to the power amplifier. The filter can pass through a portion of the amplified radio frequency signal corresponding to a second frequency to provide negative feedback to the power amplifier, resulting in a reduction in an amount of gain from the power amplifier within the second frequency band.

Abstract: Techniques and systems for recognizing characters on a circuit board are discussed herein. For example, a digital image of a character on a circuit board can be obtained. The digital image can be processed with a gradient, structural, and concavity algorithm. The processing can include identifying a gradient feature based on a stroke shape, identifying a structural feature based on a stroke trajectory, identifying a concavity feature based on a stroke relationship, and so on. The character can be classified based on the gradient feature, the structural feature, and/or the concavity feature. The classifying can be performed using a k-nearest neighbor classifier algorithm and/or a distance metric.

Abstract: Voltage regulators for battery operated systems are provided. In certain implementations, a voltage regulator is operable in a regulating mode and a bypass mode. In the regulating mode, an input voltage greater than a selected value can be regulated so as to yield a desired output voltage. In the bypass mode, an input voltage at or less than the selected value can be regulated so as to yield an output voltage that substantially tracks the input voltage. Such a capability of switching between two modes can provide advantageous features such as reducing the likelihood of damage in a powered circuit due to high input voltage, and extending the operating duration of a power source such as a rechargeable battery. Also disclosed are examples of how the foregoing features can be implemented in different products and methods of operation and fabrication.

Abstract: A method of dynamically configuring a multiplexer that can support more frequency bands than a traditional multiplexer is disclosed. For example, the reconfigurable multiplexer can handle frequencies of several hundred megahertz up to 10 gigahertz. Further, certain implementations of the method enable the multiplexer to reduce or eliminate frequency dead zones that exist with traditional multiplexers. The reconfigurable multiplexer includes a filter bank capable of supporting a number of frequency bands and a bypass circuit that enables the multiplexer to support a variety of sets of frequencies. For instance, unlike traditional multiplexers, the reconfigurable multiplexer can support both frequency bands with relatively narrow spacing and frequency bands with relatively wide spacing. Further, the inclusion of the bypass circuit enables the reduction or elimination of dead zones between supported frequencies.

Abstract: Devices and methods related to radio-frequency (RF) filters on silicon-on-insulator (SOI) substrate. In some embodiments, an RF device can include a silicon die such as an SOI die including a first side and a second side. The silicon die can further include a plurality of vias, with each via configured to provide an electrical connection between the first side and the second side of the silicon die. The RF device can further include at least one RF flip chip mounted on the first side of the silicon die. The silicon die can include, for example, an RF circuit such as a switch circuit, and the RF flip chip can include, for example, a filter such as a surface acoustic wave (SAW) filter.

Abstract: Described herein are methods of manufacturing dual-sided packaged electronic modules to control the distribution of an under-fill material between one or more components and a packaging substrate. The disclosed technologies include forming a trench in a packaging substrate that is configured to prevent or limit the flow of a capillary under-fill material. This can prevent or limit the capillary under-fill material from flowing onto or contacting other components or elements on the packaging substrate, such as solder balls of a ball-grid array. Accordingly, the disclosed technologies control under-fill for dual-sided ball grid array packages using a trench in a packaging substrate.