Abstract: A bonding element includes a first transient liquid phase (TLP) bonding element including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first TLP bonding element having a first value and a second TLP bonding element including the first material and the second material, a ratio of a quantity of the first material and the second material in the second TLP bonding element having a second value different from the first value.

Abstract: Aspects of this disclosure relate to a multiplexer, such as a duplexer, a quadplexer, a hexaplexer, or the like. The multiplexer includes acoustic wave filters coupled to a common node. A first acoustic wave filter of the acoustic wave filters includes acoustic wave resonators of a first type and a series acoustic wave resonator of a second type coupled between the acoustic wave resonators of the first type and the common node.

Abstract: A radio-frequency switch includes a pole node, a throw node connected to the pole node via a radio-frequency signal path, the radio-frequency signal path including first, second, third and fourth field-effect transistors connected in series, each of the first, second, third and fourth field-effect transistors having a gate, a first coupling path coupling the gate of the first field-effect transistor to the gate of the second field-effect transistor, a second coupling path coupling the gate of the third field-effect transistor to the gate of the fourth field-effect transistor, and a third coupling path coupling the first coupling path to the second coupling path.

Abstract: A radio frequency (RF) transmit-receive switch has an antenna port, first and second transmit differential ports and first and second receive differential ports. Transmit transistor switches are connected to the transmit differential ports. Primary and secondary windings of a transmit coupled inductor transformer are connected to the transmit transistor switches. Receive transistor switches are connected to the receive differential ports. Primary and secondary windings of a receive coupled inductor transformer are connected to the receive transistor switches. A first balun inductive winding is connected to the antenna port, and a second balun inductive winding is connected to the transistor switches.

Abstract: Methods to form stacked circuit assemblies include mounting a first wireless device component to a first surface of a substrate and placing a second wireless device component over the first wireless device component such that the first wireless device component is disposed between the second wireless device component and the first surface of the substrate such that a first overhanging portion of the second wireless device component extends beyond a periphery of the first wireless device component. The first wireless device component is in communication with the second wireless device component and second wireless device component is in communication with the substrate.

Abstract: Aspects of this disclosure relate to a surface acoustic wave device that includes a thermally conductive layer configured to dissipate heat of the surface acoustic wave device. The surface acoustic wave device includes a piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer. The thermally conductive layer can be thinner than the piezoelectric layer. Related radio frequency modules and wireless communication devices are disclosed.

Abstract: The disclosed technology is related to a radio-frequency (RF) amplifier having a bypass circuit and a resonant structure to improve performance in a bypass mode (e.g., a low gain mode). The disclosed amplifiers have a resonant structure that effectively isolates an amplifier core from a bypass circuit. For example, in a bypass mode, the resonant structure is configured to create an open impedance looking into the amplifier core input. This effectively removes any loading from the amplifier core to the bypass circuit. The disclosed amplifiers with resonant structures improve linearity performance in bypass modes due at least in part to the open impedance to the amplifier core provided by the resonant structure.

Abstract: Disclosed herein are circuits, devices and methods that address challenges associated with power amplifier systems. A power amplifier system includes two or more fast error amplifiers coupled to corresponding power amplifiers. The fast error amplifiers are configured to generate envelope tracking signals based on a signal envelope, the envelope tracking signals modifying a DC-DC regulated voltage from a DC-DC converter to more efficiently operate the power amplifiers. By splitting the envelope tracking between two or more fast error amplifiers and amplification between corresponding two or more power amplifiers, the power, frequency or bandwidth, linearity, signal-to-noise ratio, efficiency, or the like of the power amplifier system can be improved. Wireless communications configurations with such power amplifier systems can provide uplink carrier aggregation and/or cellular signals based on standards and protocols that require increased bandwidth and/or power.

Abstract: This disclosure relates to a mobile device with a transmission line for a radio frequency (RF) signal. The transmission line includes a bonding layer having a bonding surface, a barrier layer proximate the bonding layer, a diffusion barrier layer proximate the barrier layer, and a conductive layer proximate the diffusion barrier layer. The barrier layer and the diffusion barrier layer are configured to prevent conductive material from the conductive layer from entering the bonding layer. The diffusion barrier layer has a thickness sufficiently small such that a radio frequency signal is allowed to penetrate the diffusion barrier layer and propagate in the conductive layer.

Abstract: Selectively shielded radio frequency modules are disclosed. A radio frequency module can include a package substrate, a radio frequency component on the package substrate, a multi-layer antenna, a radio frequency shielding structure configured to provide shielding between the multi-layer antenna and the radio frequency component. The radio frequency shielding structure can include a shielding layer providing a shield over the radio frequency component and leaving the radio frequency module unshielded over the antenna.

Abstract: Described herein are variable gain amplifiers that selectively provide variable or tailored impedances at a degeneration block and/or feedback block depending at least in part on a gain mode of the variable gain amplifier. This advantageously reduces or eliminates performance penalties in one or more gain modes. The variable impedances can be configured to improve linearity of the amplification process in targeted gain modes. The variable gain amplifier can be configured to provide a low-loss bypass mode in a low gain mode to improve signal quality. The degeneration block can be selectively isolated from a reference potential node to improve performance.

Abstract: A SAW element configured to suppress spurious emissions resulting from non-periodicity of an IDT electrode finger arrangement. In one example, the SAW element is a resonator comprising an IDT electrode including a first plurality of IDT electrode fingers connected to a first busbar and a second plurality of IDT electrode fingers connected to a second busbar, and reflectors having a plurality of reflector fingers. The pluralities of first and second IDT electrode fingers are alternatively connected to each busbar by either normal connections or reversed connections and include regions arranged by at least two different types of pitches. The normal connections are such that either the odd-numbered or even-numbered IDT electrode fingers connect to the first busbar, and the reversed connections are such that the opposite group of IDT electrode fingers connect to the first busbar.

Abstract: A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, and forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding that includes reducing a volume of melted resin in a direction having a component perpendicular to a plane defined by the packaging substrate.

Abstract: A radio frequency switch circuit with improved harmonic suppression and low insertion loss has an antenna port and a plurality of signal ports. A plurality of transistor switch circuits, are connected to a respective one of the plurality of signal ports and to the antenna port. Each of the transistor switch circuits has a transistor, which in an off state, together with a harmonic suppression capacitor and a parallel inductor both connected thereto, define a tank circuit that suppresses RF signals applied to the corresponding transistor switch circuit from a different one of the transistor switch circuits. The harmonic suppression capacitor is tuned to distribute large signal voltage swings in the RF signal amongst parasitic diodes of the transistor.

Abstract: According to some implementation, a charge pump includes a boost charge pump circuit and a buck charge pump circuit sharing a common flying capacitance. In some implementations, the boost pump circuit includes an input node and a boosted-voltage output node, and the buck charge pump circuit includes the input node and a divided-voltage output node. In some implementations, the charge pump of claim 3 wherein the boosted-voltage includes 2×Vin, and the divided-voltage includes Vin/2, Vin being an input voltage at the input node. In some implementations, the boost pump circuit further includes a first holding capacitance that couples the boosted-voltage output node to a ground. In some implementations, the buck pump circuit further includes a second holding capacitance that couples the divided-voltage output node to the ground.

Abstract: Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.

Abstract: A radio-frequency (RF) module is disclosed to include a packaging substrate configured to receive a plurality of components. The RF module also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.

Abstract: Disclosed are embodiments of a multi-phase ceramic material which can have advantageous properties as a thermal barrier coating. In particular, embodiments of the ceramic can have high fracture toughness as well as calcium, magnesium, and aluminum silicate corrosion resistance. The improved properties of the ceramic can make the material applicable as a coating on turbines, such as airplane and industrial turbines.

Abstract: A radio frequency (RF) filter circuit for rejecting one or more spurious components of an input signal has a first resonator circuit including a first capacitor and a first coupled inductor pair of a first inductor and a second inductor, and a second resonator circuit with a second capacitor and a second coupled inductor pair of a third inductor and a fourth inductor. First and second resonator coupling capacitors are connected to the first resonator circuit and the second resonator circuit. A first port and a second port are connected to the first resonator circuit and the second resonator, with the filtered signal of the input signal passed through both the first resonator circuit and the second resonator circuit being output.

Abstract: Fast envelope tracking systems are provided herein. In certain embodiments, an envelope tracking system for a power amplifier includes a switching regulator and a differential error amplifier configured to operate in combination with one another to generate a power amplifier supply voltage for the power amplifier based on an envelope of a radio frequency (RF) signal amplified by the power amplifier. The envelope tracking system further includes a differential envelope amplifier configured to amplify a differential envelope signal to generate a single-ended envelope signal that changes in relation to the envelope of the RF signal. Additionally, the differential error amplifier generates an output current operable to adjust a voltage level of the power amplifier supply voltage based on comparing the single-ended envelope signal to a reference signal.