Abstract: A magnetoresistive random-access memory (MRAM) is disclosed. MRAM device has a magnetic tunnel junction stack having a significantly improved performance of the free layer in the magnetic tunnel junction structure. The MRAM device utilizes a precessional spin current (PSC) magnetic layer in conjunction with a perpendicular MTJ where the in-plane magnetization direction of the PSC magnetic layer is free to rotate.

Abstract: A perpendicular synthetic antiferromagnetic (pSAF) structure and method of making such a structure is disclosed. The pSAF structure comprises a first high perpendicular Magnetic Anisotropy (PMA) multilayer and a second high PMA layer separated by a thin Ruthenium layer. Each PMA layer is comprised of a first cobalt layer and a second cobalt layer separated by a nickel/cobalt multilayer. After each of the first and second PMA layers and the Ruthenium exchange coupling layer are deposited, the resulting structure goes through a high temperature annealing step, which results in each of the first and second PMA layers having a perpendicular magnetic anisotropy.

Abstract: A method of writing data into a memory device is disclosed. The method comprises utilizing a pipeline to process write operations of a first plurality of data words addressed to a memory bank. The method further comprises writing a second plurality of data words into an error buffer associated with the memory bank wherein each data word of the second plurality of data words is either awaiting write verification associated with the memory bank or is to be re-written into the memory bank. Additionally, the method comprises monitoring an occupancy level of the error buffer and determining if the occupancy level of the error buffer has increased beyond a predetermined threshold. Subsequently, responsive to a determination that the occupancy level of the error buffer has increased beyond the predetermined threshold, increasing a write voltage of the memory bank, wherein subsequent write operations are performed at a higher write voltage.

Abstract: A memory device includes a write port, a read port, source lines, bit lines, and word lines orthogonal to the bit lines. The memory device also includes memory cells that can be arrayed in columns that are parallel to the bit lines and in rows that are orthogonal to the bit lines. The memory cells are configured so that a write by the write port to a first memory cell in a column associated with (e.g., parallel to) a first bit line and a read by the read port of a second memory cell in a column associated with (e.g., parallel to) a second, different bit line can be performed during overlapping time periods (e.g., at a same time or during a same clock cycle).

Abstract: A magnetic memory device is provided. The magnetic memory device includes: (i) a cylindrical core, (ii) a first cylindrical ferromagnetic layer that surrounds the cylindrical core, (iii) a spacer layer that surrounds the first cylindrical ferromagnetic layer, and (iv) a second cylindrical ferromagnetic layer that surrounds the spacer layer. The cylindrical core, the first cylindrical ferromagnetic layer, the spacer layer, and the second cylindrical ferromagnetic layer collectively form a magnetic tunnel junction.

Abstract: A Magnetic Tunnel Junction (MTJ) can include an annular structure and a planar reference magnetic layer disposed about the annular structure. The annular structure can include an annular non-magnetic layer disposed about an annular conductive layer, an annular free magnetic layer disposed about the annular non-magnetic layer, and an annular tunnel insulator disposed about the annular free magnetic layer. The planar reference magnetic layer can be separated from the free magnetic layer by the annular tunnel barrier layer.

Abstract: A method for correcting bit defects in an STT-MRAM memory is disclosed. The method comprises executing a read before write operation in the STT-MRAM memory, wherein the STT-MRAM memory comprises a plurality of codewords, wherein each codeword comprises a plurality of redundant bits. The read before write operation comprises reading a codeword and mapping defective bits in the codeword. Further, the method comprises replacing the defective bits in the codeword with a corresponding redundant bit and executing a write operation with corresponding redundant bits in place of the defective bits.

Abstract: A method for a photolithographic fabricating process to define pillars having small pitch and pillar size. The method includes coating a hard mask layer of a wafer with a photoresist. The wafer is exposed with a first line pattern comprising a plurality of parallel lines in a first direction. The wafer is then exposed with a second line pattern comprising a plurality of parallel lines in a second direction orthogonal to the first direction. The wafer is then developed to remove areas of the photoresist that were exposed by the first line pattern and the second line pattern resulting in a plurality of pillars.

Abstract: The various implementations described herein include methods, devices, and systems for performing operations on memory devices. In one aspect, a memory device includes: (1) a first charge storage device having a first gate with a corresponding first threshold voltage, the first charge storage device configured to store charge corresponding to one or more first bits; and (2) a second charge storage device having a second gate with a corresponding second threshold voltage, distinct from the first threshold voltage, the second charge storage device configured to store charge corresponding to one or more second bits; where the second charge storage device is coupled in parallel with the first charge storage device.

Abstract: A method for correcting bit defects in a memory array is disclosed. The method comprises determining, during a characterization stage, a resistance distribution for the memory array by classifying a state of each bit-cell in the memory array, wherein the memory array comprises a plurality of codewords, wherein each codeword comprises a plurality of redundant bits. Further, the method comprises determining bit-cells in the resistance distribution that are ambiguous, wherein ambiguous bit-cells have ambiguous resistances between being high or low bits. Subsequently, the method comprises forcing the ambiguous bit-cells to short circuits and replacing each short-circuited ambiguous bit-cell with a corresponding redundant bit from an associated codeword.

Abstract: A method for correcting bit defects in a memory array is disclosed. The method comprises determining a margin area associated with a resistance distribution for the memory array, wherein the resistance distribution comprises a distribution of bit-cell resistances for all bits comprising the memory array, wherein the margin area is a bandwidth of bit-cell resistances centered around a reference point associated with a sense amplifier, wherein the bit-cell resistances of memory bit-cells associated with the margin area are ambiguous. The method further comprises forcing the bit-cell resistances of memory bit-cells associated with the margin area to short circuits. Finally, the method comprises replacing each short-circuited memory bit-cell with a corresponding redundant bit in the codeword associated with the short-circuited memory bit-cell.

Abstract: A method of forming a transistor, according to one embodiment, includes: forming an doped material, depositing an oxide layer on the doped material, depositing a conducting layer on the oxide layer, patterning the conducting layer to form at least two word lines, depositing a nitride layer above the at least two word lines, defining at least two hole regions, at each of the defined hole regions, etching down to the doped material through each of the respective word lines, thereby creating at least two holes, depositing a gate dielectric layer on the nitride layer and in the at least two holes, depositing a protective layer on the gate dielectric layer, etching in each of the at least two holes down to the doped material, and removing a remainder of the protective layer.

Abstract: A magnetoresistive random-access memory (MRAM) is disclosed. The MRAM device includes a perpendicular magnetic tunnel junction device having a reference layer, a free layer, and a precessional spin current magnetic layer. A skyrmionic enhancement layer is provided adjacent to the precessional spin current magnetic layer. The skyrmionic enhancement layer helps to improve the response of the precessional spin current magnetic layer to applied spin polarized currents.

Abstract: A perpendicular synthetic antiferromagnetic (pSAF) structure and method of making such a structure is disclosed. The pSAF structure can be a first high perpendicular Magnetic Anisotropy (PMA) multilayer and a second high PMA layer separated by a thin Ruthenium layer. Each PMA layer can be a first cobalt layer and a second cobalt layer separated by a nickel/cobalt multilayer. After each of the first and second PMA layers and the Ruthenium exchange coupling layer are deposited, the resulting structure goes through a high temperature annealing step, which results in each of the first and second PMA layers having a perpendicular magnetic anisotropy.

Abstract: A magnetic memory element for Magnetic Random Access Memory. The magnetic memory element has improved reference layer magnetic pinning. The magnetic memory element has a magnetic free layer, a magnetic reference layer and a non-magnetic barrier layer located between the magnetic free layer and the magnetic reference layer. The magnetic reference layer has a magnetic moment that is pinned in a perpendicular orientation through exchange coupling with a synthetic antiferromagnetic structure that includes first and second magnetic structures and an antiferromagnetic exchange coupling structure located between the first and second magnetic structures. The antiferromagnetic exchange coupling structure includes a layer of Ru located between first and second layers of Pt. The Pt layers in the antiferromagnetic exchange coupling structure advantageously increases the magnetic proximity effect at both Ru interfaces, which extends the exchange coupling range of the antiferromagnetic exchange coupling layer.

Abstract: A memory device for storing data is disclosed. The memory device comprises a memory bank comprising a memory array of addressable memory cells and a pipeline configured to process read and write operations addressed to the memory bank. Further, the memory device comprises an x decoder circuit coupled to the memory array for decoding an x portion of a memory address for the memory array and a y multiplexer circuit coupled to the memory array and operable to simultaneously multiplex across the memory array based on two y portions of memory addresses and, based thereon with the x portion, for simultaneously writing a value and reading a value associated with two separate memory cells of the memory array, wherein the x decoder and the y multiplexer are implemented to provide a read port and a write port which are operable to simultaneously operate with respect to the memory array.

Abstract: A magnetic device, according to one approach, includes: a plurality of perpendicular magnetic tunnel junction (p-MTJ) cells, each p-MTJ cell having a transistor and a magnetic tunnel junction (MTJ) sensor. Moreover, each of the transistors includes a drain terminal, a source terminal, and a gate terminal. The magnetic device also includes: a first common word line coupled to the gate terminal of each transistor in a first subset of the plurality of p-MTJ cells, a first common bit line coupled to a first end of each MTJ sensor in a second subset of the plurality of p-MTJ cells, and a first common source line coupled to the drain terminal of each transistor in the first subset. A second end of each of the MTJ sensors in the second subset is coupled to the source terminal of each respective transistor in the second subset.

Abstract: Semiconductor substrate adaptor configured to adapt a substrate of a first dimension to a second dimension, such that the substrate can be properly supported by a supporting mechanism (e.g., a wafer cassette) customized for substrates of the second dimension. The substrate adaptor may be made of quartz. The combination of the substrate adaptor and a substrate fitting therein causes no perturbation in various aspects of a semiconductor process. Therefore, the substrate adaptor conveniently enables a substrate of the first dimension to be processed in the same processing equipment and conditions as a substrate of the second dimension. A vertical substrate adaptor may have a semicircular body with a semicircular cutout for accommodating a wafer and can support a wafer vertically. A horizontal substrate adaptor may have a circular body with a circular cutout for accommodating an entire wafer and supporting the wafer horizontally.

Abstract: A method for manufacturing a magnetic memory element array. A plurality of magnetic memory elements are formed on a substrate, and a dielectric fill layer such as SiO2 or SiNx is deposited over the magnetic memory element pillars. An ion milling is then performed at a high angle (at least 70 degrees) relative normal to remove topographic dielectric features from areas over the magnetic memory elements. Optionally, additional ion milling processes can be performed at increasing angles relative to normal until the dielectric material has been removed from the areas over the magnetic memory elements.

Abstract: A memory pipeline for performing a write operation in a memory device is disclosed. The memory pipeline comprises an input register operable to receive a first data word and an associated address to be written into a memory bank. The memory pipeline also comprises a pre-read register of the first pipe-stage coupled to the input register and operable to receive the first data word and the associated address from the input register and further operable to pre-read a second data word stored in the memory bank at the associated address. Finally, the memory pipeline comprises a write register of the second pipe-stage operable to receive the first data word, the associated address and mask bits from the pre-read register, wherein the write register is further operable to use information from the mask bits to write the first data word into the memory bank by changing those bits in the first data word that differ from the second data word.