Abstract: A LIDAR optical unit includes a photonic-integrated-circuit (PIC) affixed to a carrier. The PIC includes an input coupler and an array of output couplers, with a switchable optical network connecting the input coupler to different selected ones of the array of output couplers. A laser source is mounted to the PIC adjacent the input coupler such that laser light generated by the laser source is injected into the input coupler. An optical stack is mounted to the PIC adjacent the array of output couplers to receive laser light extracted from the switchable optical network by the array of output couplers. The optical stack includes an array of microlenses positioned so that a bottom surface thereof is mounted to the PIC, and an array of microprisms is stacked on the array of microlenses so that a bottom surface thereof is mounted to a top surface of the array of microlenses.

Abstract: A differential piezoelectric actuator-system includes an inductor and driver-circuit having switches for transferring energy between first and second actuators and the inductor, and between a voltage-supply node and the inductor. Control circuitry determines whether a next phase in which to operate the driver-circuit is a first charging-phase or a first recovery-phase. The first charging-phase includes operating the switches in: a first sub-phase to transfer energy from the first actuator to the inductor; a second sub-phase to transfer energy from the voltage supply node to the inductor; and a third sub-phase to transfer energy from the inductor to the second actuator. The first recovery-phase includes operating the switches in: a first sub-phase to transfer energy from the first actuator to the inductor; a second sub-phase to transfer energy from the inductor to the voltage supply node; and a third sub-phase to transfer energy from the inductor to the second actuator.

Abstract: A differential piezoelectric actuator-system includes an inductor and driver-circuit having switches for transferring energy between first and second actuators and the inductor, and between a voltage-supply node and the inductor. Control circuitry determines whether a next phase in which to operate the driver-circuit is a first charging-phase or a first recovery-phase. The first charging-phase includes operating the switches in: a first sub-phase to transfer energy from the first actuator to the inductor; a second sub-phase to transfer energy from the voltage supply node to the inductor; and a third sub-phase to transfer energy from the inductor to the second actuator. The first recovery-phase includes operating the switches in: a first sub-phase to transfer energy from the first actuator to the inductor; a second sub-phase to transfer energy from the inductor to the second actuator; and a third sub-phase to transfer energy from the inductor to the voltage supply node.

Abstract: An embodiment pulse generator circuit comprises a first electronic switch coupled between first and second nodes, and a second electronic switch coupled between the second node and a reference node. An LC resonant circuit comprising an inductance and a capacitance is coupled between the first and reference nodes along with charge circuitry comprises a further inductance in a current flow line between a supply node and an intermediate node in the LC resonant circuit. Drive circuitry of the electronic switches repeats, during a sequence of switching cycles, charge time intervals, wherein the capacitance in the LC resonant circuit is charged via the charge circuit, and pulse generation time intervals, wherein a pulsed current is provided to the load via the first and second nodes. The charge and pulse generation time intervals are interleaved with oscillation time intervals where the LC resonant circuit oscillates at a resonance frequency.

Abstract: An in-memory computation (IMC) circuit includes a memory array formed by memory cells arranged in row-by-column matrix. Computational weights for an IMC operation are stored in the memory cells. Each column includes a bit line connected to the memory cells. A biasing circuit is connected between each bit line and a corresponding column output. A column combining circuit combines and integrates analog signals at the column outputs of the biasing circuits. Each biasing circuit operates to apply a fixed reference voltage level to its bit line. Each biasing circuit further includes a switching circuit that is controlled to turn on for a time duration controlled by asps comparison of a coefficient data signal to a ramp signal to generate the analog signal dependent on the computational weight. The ramp signal is generated using a reference current derived from a reference memory cell.

Abstract: A method of operating a control device includes performing an open load test or a current leakage test. The open load test includes activating a first current and then a second current and sensing with the first current and the second current activated, respectively, a first voltage drop and a second voltage drop between charge distribution pins and charge sensing pins of the control device. Respective differences are calculated between the first voltage drop and the second voltage drop sensed with the first current and the second current activated, respectively. These differences are compared with respective thresholds and an open circuit condition is declared as a result of the differences calculated reaching these thresholds.

Abstract: Semiconductor devices of the type currently referred to as a System in a Package (SiP) and having embedded therein a transformer are produced by embedding at least one semiconductor chip in an insulating encapsulation at a first portion thereof. Over a second portion thereof at least partly non-overlapping with the first portion, a stacked structure is formed including multiple layers of electrically insulating material as well as respective patterns of electrically conductive material. The respective patterns of electrically conductive material have: a planar coil geometry for providing electrically conductive coils such as the windings of a transformer and a geometrical distribution providing electrically conductive connections to one or more semiconductor chips.

Abstract: A semiconductor chip has a top metal layer with a passivation over an outer surface and including a first region and a second region. The passivation is fully removed from the first region and a contact layer for electrical wafer sorting probes is formed over the first region having the passivation fully removed therefrom. The passivation is initially only partly removed from the second region to protect the top met layer. Later, a remaining portion of the passivation is fully removed at the second region. Then, top metal layer at the second region provides a growth region for growing electrically conductive material over the second region.

Abstract: A low-drop out voltage regulator includes a pass element arranged between an input terminal and an output terminal, a feedback network configured to produce a feedback voltage derived from an output voltage, and an error amplifier configured to drive the pass element as a function of a difference between the feedback voltage and a reference voltage. An output transistor coupled in series with the pass element is controlled by a mode selection circuit. In response to assertion of a mode selection signal, the mode selection circuit turns on the output transistor to sink a current with a controlled magnitude from the output node. In response to de-assertion of the mode selection signal, the mode selection circuit sinks a current with a controlled magnitude from a control terminal of the output transistor to turn off the output transistor at a controlled rate.

Abstract: A semiconductor die mounting substrate, such as a pre-molded leadframe, is provided with die pads, wherein each die pad has opposed first and second surfaces as well as tie bars projecting therefrom. Semiconductor dice are mounted at the first surface of the die pads. A molding encapsulation material surrounds the semiconductor dice mounted at the first surface of the die pads to produce semiconductor devices, with the semiconductor devices being mutually coupled via the tie bars. The tie bars are then cut transverse to their longitudinal direction at an intermediate singulation location to singulate the semiconductor devices into individual semiconductor devices. The tie bars have a hollowed-out portion with a channel-shaped cross-sectional profile at the intermediate singulation location. Easier-to-cut tie bars can be provided without impairing their stiffness in comparison with tie bars having full rectangular/square cross-sectional shapes.

Abstract: A back end of line (BEOL) structure for an integrated circuit chip includes a last metal structure providing a bonding pad. A passivation structure over the bonding pad includes a first opening extending exposing an upper surface of the bonding pad. A conformal nitride layer extends over the passivation structure and is placed in contact with the upper surface of the bonding pad. An insulator material layer covers the conformal nitride layer and includes a second opening that extends through both the insulator material layer and the conformal nitride layer. A foot portion of the conformal nitride layer on the upper surface of the bonding pad is self-aligned with the second opening.

Abstract: A semiconductor device includes a support substrate with leads arranged therearound, a semiconductor die on the support substrate, and a layer of laser-activatable material molded onto the die and the leads. The leads include proximal portions facing towards the support substrate and distal portions facing away from the support substrate. The semiconductor die includes bonding pads at a front surface thereof which is opposed to the support substrate, and is arranged onto the proximal portions of the leads. The semiconductor device has electrically-conductive formations laser-structured at selected locations of the laser-activatable material.

Abstract: A system includes lighting devices coupled to output supply pins, a microcontroller circuit, and a driver circuit, which receives data therefrom, and switches coupled in series to the lighting devices. The driver circuit includes output supply pins and selectively propagates a supply voltage to the output supply pins to provide respective pulse-width modulated supply signals at the output supply pins. The driver circuit computes duty-cycle values of the pulse-width modulated supply signals as a function of the data received from the microcontroller circuit. The lighting devices include at least one subset coupled to the same output supply pin. The microcontroller individually controls the switches via respective control signals to individually adjust a brightness of the lighting devices in the at least one subset of lighting devices.

Abstract: A microelectromechanical gyroscope includes a support structure, a driving mass movable according to a driving axis; and an oscillating microelectromechanical loop. The microelectromechanical loop has a resonance frequency and a loop gain and includes the driving mass, a sensing interface that senses a position of the driving mass, and a gain control stage that maintains a modulus of the loop gain at a unitary value at the resonance frequency. The gain control stage includes a sampler and an transconductance operational amplifier in an open-loop configuration. The sampler acquires samples of a loop signal from the sensing interface in a first operative condition and transfers them to the transconductance operational amplifier in a second operative condition. The sampler decouples the transconductance operational amplifier from the sensing interface in the first operative condition and in the second operative condition.

Abstract: An integrated circuit with a hot-plug protection circuit includes input pins and an output pin. The input pins are electrically coupled to a common node in the hot-plug protection circuit via respective electrical connections. The integrated circuit includes clamping circuitry coupled between the common node and the output pin, the clamping circuitry activatable as a result of a voltage spike applied across the clamping circuitry. The plurality of electrical connections and the clamping circuitry provide respective current discharge paths between the input pins in the input pins and the output pin, the respective current discharge paths configured to become conductive as a result of a voltage spike applied to any of the input pins in the plurality of input pins being transferred to the common node via the respective electrical connection in the plurality of electrical connections electrically coupling said any of said input pins to the common node.

Abstract: A DC-DC switching converter includes power switches selectively coupling an output terminal with a first voltage or with a second voltage. A driver stage is coupled with the power switches for driving the power switches. A driver control stage is coupled with the driver stage for controlling the operation of the driver stage. An output current sensing circuit is coupled with the output terminal and with the driver control stage, and is configured to sense a sign of an output current delivered by the DC-DC switching converter at the output terminal and to generate control signals for the driver control stage. The driver control stage controls the operation of the driver stage according to states of the control signals received from the output current sensing circuit, for selectively delaying the activation of the power switches depending on the sensed sign of the output current.

Abstract: A method to detect a vocal command, the method including: analyzing audio data received from a transducer configured to convert audio into an electric signal and analyzing the data using a first neural network. The method also includes detecting a keyword from the audio data using the first neural network on the edge device, the first neural network being trained to recognize the keyword. The method further includes activating a second neural network after the keyword is identified by the first neural network and analyzing the audio data using the second neural network, the second neural network being trained to recognize a set of vocal commands. The method to detect a vocal command may also include detecting the vocal command word using the second neural network.

Abstract: A method includes driving a selected motor winding to be in a tri-state during a time interval having a finite time length value of a time window, sensing a zero-crossing (ZC) of an oscillating back electromotive force induced in the motor winding during the time window in which the motor winding is in the tri-state, and producing a ZC sensing signal, which has a first edge at a first time instant at the sensed ZC and a second edge at a second time instant separated from the first time instant by a half oscillation of the oscillating back electromotive force, detecting a phase of a current flowing in the motor winding at a time instant time-shifted with respect to the second time instant of the second edge of the ZC sensing signal, and adjusting the finite time length value based on the detected phase of the current.

Abstract: A warped semiconductor die is attached onto a substrate such as a leadframe by dispensing a first mass of die attach material onto an area of the substrate followed by dispensing a second mass of die attach material so that the second mass of die attach material provides a raised formation of die attach material. For instance, the second mass may be deposited centrally of the first mass. The semiconductor die is placed onto the first and second mass of die attach material with its concave/convex shape matching the distribution of the die attach material thus effectively countering undesired entrapment of air.

Abstract: Uncompensated upper and lower reference-currents are generated for first and second branches of a high-frequency half-bridge within an interleaved-totem-pole PFC.