Abstract: An integrated circuit includes a semiconductor substrate, electronic components integrated in the semiconductor substrate, an electric connection structure overlying the semiconductor substrate, and an conductive region, with elongated shaped, having a first and a second end. The conductive region is formed in the electric connection structure, extends over an entire length of the substrate and is not directly electrically connected to the electronic components. A first and a second synchronization connection element are electrically coupled to the first end and to the second end, respectively, of the conductive region and have each a respective synchronization connection portion facing the coupling face.

Abstract: In an embodiment, an electronic circuit includes: an input differential pair including first and second transistors; a first pair of transistors in emitter-follower configuration including third and fourth transistors, and an output differential pair including fifth and sixth transistors. The third transistor has a control terminal coupled to the first transistor, and a current path coupled to a first output terminal. The fourth transistor has a control terminal coupled to the second transistor, and a current path coupled to a second output terminal. The fifth transistor has a control terminal coupled to the first transistor, and a first current path terminal coupled to the first output terminal. The sixth transistor has a control terminal coupled to the second transistor, and a first current path terminal coupled to the second output terminal. First and second termination resistors are coupled between the first pair of transistors and the output differential pair.

Abstract: A semiconductor device comprises at least one semiconductor die electrically coupled to a set of electrically conductive leads, and package molding material molded over the at least one semiconductor die and the electrically conductive leads. At least a portion of the electrically conductive leads is exposed at a rear surface of the package molding material to provide electrically conductive pads. The electrically conductive pads comprise enlarged end portions extending at least partially over the package molding material and configured for coupling to a printed circuit board.

Abstract: A switching circuit includes first and second half bridges supplying an electrical load via filter networks. During alternate switching sequences a first transistor pair (high-side in one half bridge and low-side in the other half bridge) is switched to a non-conductive state, and a second transistor pair (high-side in the other half bridge and low-side in the one half bridge) is switched to a conductive state. A current flow line is provided by an inductance, a first switch and a second switch between outputs of the half bridges. In a medium-high power mode, the first and second switches are in the conductive state between switching the first pair of transistors to the non-conductive state and the second pair of transistors to the conductive state. In a low or quiescent power mode, switching the first and second switches to the conductive state is refrained due to application of a longer delay.

Abstract: An optoelectronic device includes a backlight panel illuminating a display panel. The backlight panel includes an array of light emitting pixels, with each light emitting pixel including at least one subpixel formed by one or more light emitting diodes positioned on a substrate. At least one photodetector is positioned on the substrate and arranged to detect an amount of reflected light emitted by said subpixel and reflected by the display panel.

Abstract: A microelectromechanical device has a first tiltable mirror structure extending in a horizontal plane defined by first and second horizontal axes and includes a fixed structure defining a frame delimiting a cavity, a tiltable element carrying a reflecting region, elastically suspended above the cavity having first and second median axes of symmetry, elastically coupled to the frame by first and second coupling structures on opposite sides of the second horizontal axis. The first tiltable mirror structure has a driving structure coupled to the tiltable element to cause rotation around the first horizontal axis. The first tiltable mirror structure is asymmetrical with respect to the second horizontal axis and has, along the first horizontal axis, a first extension on a first side of the second horizontal axis, and a second extension greater than the first extension, on a second side of the second horizontal axis opposite to the first side.

Abstract: A method for manufacturing an electronic device based on SiC includes forming a structural layer of SiC on a front side of a substrate. The substrate has a back side that is opposite to the front side along a direction. Active regions of the electronic device are formed in the structure layer, and the active regions are configured to generate or conduct electric current during the use of the electronic device. A first electric terminal is formed on the structure layer, and an intermediate layer is formed at the back side of the substrate. The intermediate layer is heated by a LASER beam in order to generate local heating such as to favor the formation of an ohmic contact of Titanium compounds. A second electric terminal of the electronic device is formed on the intermediate layer.

Abstract: An embodiment apparatus comprises a switching-type output power stage, a modulator circuit configured for carrying out a pulse-width modulation and converting an electrical input signal into an input signal pulsed between two electrical levels, having a mean value proportional to the amplitude of the input signal, and a circuit arrangement for controlling saturation of an output signal supplied by the switching-type output power stage. The circuit arrangement comprises a pulse-remodulator circuit, between the output of the modulator circuit and the input of the switching-type output power stage, that is configured for supplying, as a driving signal to the switching-type output power stage, a respective modulated signal pulsed between two electrical levels, measuring a pulse width as pulse time interval elapsing between two consecutive pulsed-signal edges of the pulsed input signal, and, if the measurement indicates that the latter is below a given minimum value, remodulating the pulsed input signal.

Abstract: A method for presence detection in an environment to be monitored, includes generating an electric charge signal in a condition of absence of presence in the environment to be monitored. An electric charge signal is generated in an operating condition in which a person may be present in the environment. The two generated signals are processed and the results of the processing are compared. Processing the signals includes representing in a biaxial reference system the value of the charge signal considered and its derivative with respect to time, and identifying a plurality of points in the reference system. By comparing the position of the points acquired during the possible human presence with those of the base shape, a variation indicating the actual human presence may be detected. In this case an alarm signal is generated.

Abstract: Described herein is a method including measuring a current in a wire, normalizing the measured current, and comparing the normalized measured current to a control curve. The control curve is a function of a series of normalized current magnitudes and reaction times for corresponding ones of that series of normalized current magnitudes. The method further includes limiting the current in the wire based upon the comparison. The reaction times for ones of the series of normalized current magnitudes are times at which current limitation would occur if the normalized current remained at an associated normalized current magnitude.

Abstract: A method of processing an electrical signal transduced from a voice signal is disclosed. A classification model is applied to the electrical signal to produce a classification indicator. The classification model has been trained using an augmented training dataset. The electrical signal is classified as either one of a first class and a second class in a binary classification. The classifying being performed is a function of the classification indicator. A trigger signal is provided to a user circuit as a result of the electrical signal being classified in the first class of the binary classification.

Abstract: A System in Package, SiP semiconductor device includes a substrate of laser direct structuring, LDS, material. First and second semiconductor die are arranged at a first and a second leadframe structure at opposite surfaces of the substrate of LDS material. Package LDS material is molded onto the second surface of the substrate of LDS material. The first semiconductor die and the package LDS material lie on opposite sides of the substrate of LDS material. A set of electrical contact formations are at a surface of the package molding material opposite the substrate of LDS material. The leadframe structures include laser beam processed LDS material. The substrate of LDS material and the package LDS material include laser beam processed LDS material forming at least one electrically-conductive via providing at least a portion of an electrically-conductive line between the first semiconductor die and an electrical contact formation at the surface of the package molding material opposite the substrate.

Abstract: An irrigation system includes a first valve fluidly-coupled between an inlet pipe and an outlet pipe, and a second valve fluidly-coupled between the inlet pipe and a power harvester. The power harvester generates electrical power at a power output in response to fluid flowing therethrough. An energy storage unit is coupled to the power output to store generated voltage. Comparison circuitry compares the generated voltage to a threshold. Control circuitry causes the second valve to permit fluid to flow therethrough when the generated voltage is less than the threshold, causing generation of the electrical power by the power harvester when the generated voltage is less than the threshold. The comparison circuitry causes the second valve to prevent fluid flow when the generated voltage is at least equal to threshold, ceasing generation of the electrical power by the power harvester when the generated voltage is at least equal to the threshold.

Abstract: Disclosed herein is a control system for a projection system, including a first subtractor receiving an input drive signal and a feedback signal and generating a first difference signal therefrom, the feedback signal being indicative of position of a quasi static micromirror of the projection system. A type-2 compensator receives the first difference signal and generates therefrom a first output signal. A derivative based controller receives the feedback signal and generates therefrom a second output signal. A second subtractor receives the first and second output signals and generates a second difference signal therefrom. The second difference signal serves to control a mirror driver of the projection system. A higher order resonance equalization circuit receives a pre-output signal from an analog front end of the projection system that is indicative of position of the quasi static micromirror, and generates the feedback signal therefrom.

Abstract: A plastic material substrate has a die mounting location for a semiconductor die. Metallic traces are formed on selected areas of the plastic material substrate, wherein the metallic traces provide electrically-conductive paths for coupling to the semiconductor die. The semiconductor die is attached onto the die mounting location. The semiconductor die attached onto the die mounting location is electrically bonded to selected ones of the metallic traces formed on the plastic material substrate. A package material is molded onto the semiconductor die attached onto the die mounting location.

Abstract: A driving circuit for a microelectromechanical system (MEMS) gyroscope operating based on the Coriolis effect is provided. The driving circuit supplies drive signals to a mobile mass of the MEMS gyroscope to cause a driving movement of the mobile mass to oscillate at an oscillation frequency. The driving circuit includes an input stage, which receives at least one electrical quantity representing the driving movement and generates a drive signal based on the electrical quantity; a measurement stage, which measures an oscillation amplitude of the driving movement based on the drive signal; and a control stage, which generates the drive signals based on a feedback control of the oscillation amplitude. The measurement stage performs a measurement of a time interval during which the drive signal has a given relationship with an amplitude threshold, and measures the oscillation amplitude as a function of the time interval.

Abstract: An integrated device includes at least one MOS transistor having a plurality of cells. In each of one or more of the cells a disabling structure is provided. The disabling structure is configured to be in a non-conductive condition when the MOS transistor is switched on in response to a control voltage comprised between a threshold voltage of the MOS transistor and an intervention voltage of the disabling structure, or to be in a conductive condition otherwise. A system comprising at least one integrated device as above is also proposed. Moreover, a corresponding process for manufacturing this integrated device is proposed.

Abstract: First and second circuit branches are coupled between an input node and ground. Each circuit branch includes a series coupling first-fourth transistors in a current flow path with an output node. A first capacitor is coupled between a first capacitor node and a second capacitor node intermediate the first transistor and the second transistor in the first circuit branch. A second capacitor is coupled between a third capacitor node and a fourth capacitor node intermediate the first transistor and the second transistor in the second circuit branch. An inter-branch circuit block between the first and second branches includes a first inter-branch transistor coupled between the first capacitor node in the first circuit branch and the fourth capacitor node in the second circuit branch and a second inter-branch transistor coupled between the third capacitor node in the second circuit branch and the second capacitor node in the first circuit branch.

Abstract: MEMS thermoelectric generator comprising: a thermoelectric cell including one or more thermoelectric elements partially extending on a cavity of the thermoelectric cell; a thermoplastic layer extending on the thermoelectric cell and having a top surface and a bottom surface opposite to each other along a first axis, the bottom surface facing the thermoelectric cell and the thermoplastic layer being of thermally insulating material and configured to be processed through laser direct structuring, LDS, technique; a heat sink configured to exchange heat with the thermoelectric cell interposed, along the first axis, between the heat sink and the thermoplastic layer; and a thermal via of metal material, extending through the thermoplastic layer from the top surface to the bottom surface so that it is superimposed, along the first axis, on the cavity, wherein the thermoelectric cell may exchange heat with a thermal source through the thermal via.

Abstract: A LED driver chip includes driver circuits, each being coupled to a different pin and including a fault-detection circuit. Each fault-detection circuit includes a force circuit forcing current to a force node, and a sense circuit including a current sensor coupled to the force node, and a comparator comparing a voltage at the force node to a reference voltage to generate a comparison output. Control circuitry, in a pin-to-pin short detection mode, activates the force circuit of a first of the driver circuits and activates the sense circuit of a second of the driver circuits, in a pin-to-ground short detection mode, activates the force and the sense circuit of the same driver circuits. The comparison output of the comparator of the activated sense circuit, if is higher or if lower of the reference voltage, indicates if short between pin or to ground, respectively, is present.