Abstract: Disclosed herein is an electronic device including a sensing layer including a plurality of sense lines, and a plurality of single ended charge converter circuits each receiving input from a corresponding one of the plurality of sense lines. The electronic device also includes a plurality of current mirror circuits, each respectively mirroring output from one of the plurality of single ended charge converter circuits so as to produce two substantially identical outputs for each of the plurality of single ended charge converter circuits. There may be a plurality of subtractor circuits coupled to the plurality of current mirror circuits, with each of the plurality of subtractor circuits configured to output a voltage that is a function of a difference between outputs from two of the plurality of current mirror circuits associated with adjacent ones of the sense lines.

Abstract: Disclosed herein is a touch screen controller that calculates a variance of an island in acquired touch data values. Where the variance exceeds a variance threshold, the island is validated as a representing touch. Where the variance does not exceed the variance threshold, whether the island represents a touch or a hover is determined by calculating a sharpness by applying weights to nodes of the island, where neighboring nodes adjacent to a peak node are weighted less than non-neighboring nodes not adjacent to the peak node. An island strength threshold is determined as a function of a product of the variance and the sharpness. It is determined that the island represents a touch where a highest touch data value of the island is greater than the island strength threshold, and a hover where the highest touch data value of the island is less than the island strength threshold.

Abstract: An occurrence of a first set of n periods of a frequency-shift-keying (FSK)-modulated waveform is counted, where n is an integer number. The n periods of the FSK-modulated waveform in the first set have a first time duration. An occurrence of a second set of n periods of the waveform is counted. The n periods of the waveform in the second set have a second time duration. The first time duration is determined based on the counting of the first set of n periods. The second time duration is determined based on the counting of the second set of n periods. A difference between the first time duration and the second time duration is compared to a threshold. Changes in frequency of the waveform are detected based on the comparing of the difference between the first time duration and the second time duration to the threshold.

Abstract: An optical device for detecting a first chemical species and a second chemical species contained in a specimen, which includes: a first optical sensor, which may be optically coupled to an optical source through the specimen and is sensitive to radiation having a wavelength comprised in a first range of wavelengths; and a second optical sensor, which may be optically coupled to the optical source through the specimen and is sensitive to radiation having a wavelength comprised in a second range of wavelengths, different from the first range of wavelengths.

Abstract: Methods and structures for forming strained-channel finFETs are described. Fin structures for finFETs may be formed in two epitaxial layers that are grown over a bulk substrate. A first thin epitaxial layer may be cut and used to impart strain to an adjacent channel region of the finFET via elastic relaxation. The structures exhibit a preferred design range for increasing induced strain and uniformity of the strain over the fin height.

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

Abstract: Embodiments are directed to power conversion circuits including a bypass circuit for bypassing an inrush current limiting resistor. In one embodiment, a power conversion circuit is provided that includes a bridge rectifier, a current limiting resistor, a controllable current switching device, and a driver. The current limiting resistor has a first terminal coupled to an output terminal of the bridge rectifier and a second terminal coupled to an electrical ground. The controllable current switching device has conduction terminals coupled in parallel with respect to the current limiting resistor. The driver is coupled between the first terminal of the current limiting resistor and a control terminal of the current switching device, and the driver controls an operation of the current switching device based on a current through the current limiting resistor.

Abstract: A gyroscope includes: a mass, which is movable with respect to a supporting body; a driving loop for keeping the mass in oscillation according to a driving axis; a reading device, which supplying an output signal indicating an angular speed of the body; and a compensation device, for attenuating spurious signal components in quadrature with respect to a velocity of oscillation of the mass. The reading device includes an amplifier, which supplies a transduction signal indicating a position of the mass according to a sensing axis. The compensation device forms a control loop with the amplifier, extracts from the transduction signal an error signal representing quadrature components in the transduction signal, and supplies to the amplifier a compensation signal such as to attenuate the error signal.

Abstract: A MEMS sensor has at least a movable element designed to oscillate at an oscillation frequency, and an integrated measuring system coupled to the movable element to provide a measure of the oscillation frequency. The measuring system has a light source to emit a light beam towards the movable element and a light detector to receive the light beam reflected back from the movable element, including a semiconductor photodiode array. In particular, the light detector is an integrated photomultiplier having an array of single photon avalanche diodes.

Abstract: A microchip has a rear face attached to a front mounting face of a support plate. An encapsulation cover for the microchip is mounted to the support plate. The encapsulation cover includes a front wall, a peripheral wall extending from the front wall and an inside partition extending from the front wall and between opposite sides of the peripheral wall. The inside partition passes locally above the microchip to delimit two cavities. A bonding material is interposed between encapsulation cover and the support plate and microchip. An end part of the inside partition of the cover, adjacent to the front face of the microchip, include an accumulation and containment recess that is configured to at least partly receive the bonding material.

Abstract: A MEMS pressure sensor packaged with a molding compound. The MEMS pressure sensor features a lead frame, a MEMS semiconductor die, a second semiconductor die, multiple pluralities of bonding wires, and a molding compound. The MEMS semiconductor die has an internal chamber, a sensing component, and apertures. The MEMS semiconductor die and the apertures are exposed to an ambient atmosphere. A method is desired to form a MEMS pressure sensor package that reduces defects caused by mold flashing and die cracking. Fabrication of the MEMS pressure sensor package comprises placing a lead frame on a lead frame tape; placing a MEMS semiconductor die adjacent to the lead frame and on the lead frame tape with the apertures facing the tape and being sealed thereby; attaching a second semiconductor die to the MEMS semiconductor die; attaching pluralities of bonding wires to form electrical connections between the MEMS semiconductor die, the second semiconductor die, and the lead frame; and forming a molding compound.

Abstract: A device includes a matrix of active pixels, with each active pixel having an OLED diode having a cathode to receive a cathode voltage, and a control circuit coupled to an anode of the OLED diode. The device also includes at least one dummy pixel having a dummy OLED diode having a cathode to receive the cathode voltage, and an anode, and a dummy control circuit coupled to the anode of the OLED diode and having a power supply terminal. The dummy OLED diode and the dummy control circuit are substantially similar to the OLED diode and the control circuit. First regulation circuitry is configured to deliver a reference current to the power supply terminal to thereby generate a voltage, and second regulation circuitry is configured to regulate the cathode voltage so as to maintain the voltage at the power supply terminal at a given level.

Abstract: A sensor chip is mounted on a PCB and electrically connected to a SOC mounted on the PCB via at least one conductive trace. The sensor chip includes configuration registers storing and outputting configuration data, and a PLD receiving digital data. The PLD performs an extraction of features of the digital data in accordance with the configuration data, and the configuration data includes changeable parameters of the extraction. A classification unit processes the extracted features of the digital data so as to generate a context of an electronic device into which the sensor chip is incorporated relative to its surroundings, the processing being performed in using a processing technique operating in accordance with the configuration data. The configuration data also includes changeable parameters of the processing technique. The classification unit outputs the context to data registers for storage.

Abstract: Many integrated circuit die are fabricated on a wafer. Each die includes integrated functional circuitry with an array of fuse elements that are visible to optical inspection. An electrical wafer sort is performed to test the integrated functional circuitry of each die. The array of fuse elements for each die on the wafer are programmed through the electrical wafer sort process with data bits defining a die identification that specifies a location of the die on the wafer. The die is then encapsulated in a package. In the event of package failure, a decapsulation is performed to access the die. Optical inspection of the array of fuse elements is then made to extract the die identification.

Abstract: An integrated circuit package with improved reliability and methods for creating the same are disclosed. More specifically, integrated circuit packages are created using one or more sacrificial layers that provide support for ink printed wires prior to package processing, but are removed during package processing. Once each of the sacrificial layers is removed, molding compound is placed around each ink printed wire, which may have a substantially rectangular cross section that can vary in dimension along a length of a given wire. While substantially surrounding each wire in and of itself improves reliability, removing non-conductive paste, fillets, or other adhesive materials also minimizes adhesion issues between the molding compound and those materials, which increases the bond of the molding compound to the package and its components. The net result is a more reliable integrated circuit package that is less susceptible to internal cracking and wire damage.

Abstract: A half-bridge converter is controlled by a circuit including a differential circuit receiving a reference signal and a feedback signal which is a function of an output signal from the converter. The half-bridge converter includes high-side and low-side electronic switches. A comparator generates a PWM-modulated signal for controlling the converter as a function of the duty cycle of the PWM-modulated signal in response to a signal at an intermediate node between the high-side and low-side electronic switches and an output of the differential circuit. A gain circuit block coupled between the intermediate node and the input of the comparator applies a ramp signal to the input of the comparator which is a function of the signal at the intermediate node. A variable gain is applied by the gain circuit block in order to keep a constant value for the duty cycle of said PWM-modulated signal irrespective of converter operation.

Abstract: An imaging cell includes a skimming gate transistor coupled between a photosensitive charge node and an intermediate node and a transfer gate transistor coupled between the intermediate node and a sense node. The skimming gate transistor includes a vertical gate electrode structure formed by a first capacitive deep trench isolation extending into a substrate and a second capacitive deep trench isolation extending into the substrate. A channel of the skimming gate transistor is positioned between the first and second capacitive deep trench isolations. Each capacitive deep trench isolation is formed by a trench that is lined with an insulating liner and filled with a conductive or semiconductive material.

Abstract: Various embodiments provide an optical lens that includes wafer level diffractive microstructures. In one embodiment, the optical lens includes a substrate, a microstructure layer having a first refractive index, and a protective layer having a second refractive index that is different from the first refractive index. The microstructure layer is formed on the substrate and includes a plurality of diffractive microstructures. The protective layer is formed on the diffractive microstructures. The protective layer provides a cleanable surface and encapsulates the diffractive microstructures to prevent damage and contamination to the diffractive microstructures. In another embodiment, the optical lens includes a substrate and an anti-reflective layer. The anti-reflective layer is formed on the substrate and includes a plurality of diffractive microstructures.

Abstract: Disclosed herein is a micro-electro mechanical (MEMS) device including a substrate, and a MEMS mirror stack on the substrate. A first bonding layer seals against ingress of environmental contaminants and mechanically anchors the MEMS mirror stack to the substrate. A cap layer is formed on the MEMS mirror stack. A second boding layer seals against ingress of environmental contaminants and mechanically anchors the cap layer to the MEMS mirror stack.

Abstract: Various embodiments provide a reaction chamber including a support, a receptacle, and a sponge. The support includes a plurality of bars that are spaced from each other by a plurality of openings. Each of the bars has side surfaces that are slanted or tilted downward such that melted material may readily flow through the openings. The support is covered with a coating of silicon carbide to prevent materials from adhering to the support. The receptacle underlies the support and is configured to collect any melted material that is drained through the openings of the support. The sponge is positioned in the receptacle and under the support. The sponge is configured to absorb any melted material that is collected by the receptacle.