Abstract: An integrated circuit includes several metallization levels separated by an insulating region. A hollow housing whose walls comprise metallic portions is produced within various metallization levels. A controllable capacitive device includes a suspended metallic structure situated in the hollow housing within a first metallization level including a first element fixed on two fixing zones of the housing and at least one second element extending in cantilever fashion from the first element and includes a first electrode of the capacitive device. A second electrode includes a first fixed body situated at a second metallization level adjacent to the first metallization level facing the first electrode. The first element is controllable in flexion from a control zone of this first element so as to modify the distance between the two electrodes.

Abstract: A reading circuit for a magnetic-field sensor, provided with a detection structure generating an electrical detection signal as a function of an external magnetic field, has a signal-conditioning stage, which is electrically coupled to the detection structure and generates an output signal as a function of the electrical detection signal; the reading circuit is provided with a full-scale-control stage that is able to select automatically a full-scale value for the signal-conditioning stage, as a function of the value of the external magnetic field, such as to prevent saturation of the same conditioning stage.

Abstract: A sensor package may include a source configured to emit a signal, a detector configured to receive a first reflection of the signal, and an isolator disposed between the source and the detector, where a surface of the isolator has one or more grooves configured to direct a second reflection of the signal away from the detector.

Abstract: A driving circuit for an electric motor including multiple windings includes a sensing circuit to sense motor winding currents. A motor rotation angle signal is generated from the sensed currents and motor control voltages are generated as a function of the motor rotation angle signal. The motor windings are driven with motor drive voltages obtained by injecting into the motor control voltages injection pulses. The sensed currents include both torque components and injection components. The motor rotation angle signal is generated as a function of the injection components of the sensed currents.

Abstract: The present disclosure is directed to a system that includes a sensor and a signal conditioner coupled to the sensor. The signal conditioner includes signal processing circuitry coupled to the sensor and offset cancellation circuitry. The offset cancellation circuitry includes a sign detector configured to output a high signal or a low signal based on a sign of an output signal from the signal processing circuitry, an integrator coupled to the sign detector, and a divider coupled to the integrator and to an input of the signal processing circuitry.

Abstract: A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and sensitivity, and superior durability. The miniature oxygen sensor disclosed maintains a sample of ambient air within a micro-channel formed in a semiconductor substrate. O2 molecules segregate in response to an applied magnetic field, thereby establishing a measureable Hall voltage. Oxygen present in the sample of ambient air can be deduced from a change in Hall voltage with variation in the applied magnetic field. The magnetic field can be applied either by an external magnet or by a thin film magnet integrated into a gas sensing cavity within the micro-channel. A differential sensor further includes a reference element containing an unmagnetized control sample. The miniature oxygen sensor is suitable for use as a real-time air quality monitor in consumer products such as smart phones.

Abstract: An electronic image capture device includes a first portion and a second portion. The first portion is formed by a substrate wafer provided on one side with electronic circuits and a dielectric layer with a network of electrical connections and external electrical contacts on an outer surface. The second portion includes a pixel wafer capable of generating electrical signals under the effect of light, a substrate wafer mounted to the pixel wafer and provided with electronic circuits and a dielectric layer with a network of electrical connections and external electrical contacts on an outer surface. The outer surfaces and external electrical contacts are bonded to each other so as to mount the first portion to the second portion. A connection pad extends through a hole in the pixel wafer to make electrical connection to the network of electrical connections of the second portion.

Abstract: A sensing apparatus includes a sensor and a processor. The sensor includes at least one light sensitive detector. The processor determines a first control value to control a voltage differential across the at least one light sensitive detector, and compares the first control value with a reference value associated with a reference temperature. Based on the comparison, the processor provides adjustment information for adjusting at least one output of the sensing apparatus, and an operating parameter of the sensing apparatus other than the voltage differential.

Abstract: The disclosure relates to a negative charge pump circuit including a first capacitor; a first selector switch; a second selector switch; and a control circuit designed to, in a first phase of operation, alternately control the first and second selector switches in a first configuration in which the first and second electrodes of the first capacitor are respectively linked to the first and second nodes and in a second configuration in which the first and second electrodes of the first capacitor are respectively linked to the second and third nodes. In a second phase of operation, the control circuit forces the first selector switch to link the first electrode of the first capacitor to the second node and control the second selector switch so as to alternately link the second electrode of the first capacitor to the second and to the third node.

Abstract: An integrated image sensor with backside illumination includes a pixel. The pixel is formed by a photodiode within an active semiconductor region having a first face and a second face. A converging lens, lying in front of the first face of the active region, directs received light rays towards a central zone of the active region. At least one diffracting element, having a refractive index different from a refractive index of the active region, is provided at least partly aligned with the central zone at one of the first and second faces.

Abstract: An integrated circuit chip stack includes a main integrated circuit chip and at least one auxiliary integrated circuit chip. The main integrated circuit chip contains circuit components to be protected. The auxiliary integrated circuit chip is mounted to a surface of the main integrated circuit chip and includes a metal plane connected to ground located opposite the circuit components to be protected. The auxiliary integrated circuit chip further includes at least one insulated conductive track forming a tight pattern opposite the circuit components to be protected. A detection circuit is connected to the at least one conductive track and is configured to detect interruption of the at least one insulated conductive track.

Abstract: A sensing bridge includes first and second branches in parallel, the first branch including a first resistor in series with a first switch, the second branch including a second resistor in series with a second switch. Resistances of the resistors vary with a sensed physical variable. The branches switch between first and second phases, with the first switch closed and the second switch open during the first phase, and the first switch open and the second switch closed during the second phase. A reference block generates a control signal from the resistance of the variable resistors during the first and second phases. An oscillator generates an oscillating signal during the first and second phases from the variable sense current during the first and second phases. Processing circuitry determines a value of the sensed physical value from an algebraic combination of the oscillating signal during the first and second phases.

Abstract: A capacitive element of an integrated circuit includes first and second electrodes. The first electrode is formed by a first electrically conductive layer located above a semiconductor well doped with a first conductivity type. The second electrode is formed by a second electrically conductive layer located above the first electrically conductive layer of the semiconductor well. The second electrode is further formed by a doped surface region within the semiconductor well that is heavily doped with a second conductivity type opposite the first conductivity type, wherein the doped surface region is located under the first electrically conductive layer. An inter-electrode dielectric area electrically separates the first electrode and the second electrode.

Abstract: A circuit includes a voltage converter converting a source voltage to a supply voltage at a first node as a function of a feedback voltage at a feedback node. A first output path is coupled between the first node and a second node. Feedback circuitry compares the voltage at the second node to first and second overvoltages, and selectively couples the second node to the feedback node based thereupon. Impedance circuitry is coupled between the first node and a third node. A light emitting diode (LED) chain is coupled to the third node, and is selectively turned on and off as a function of the selective coupling of the second node to the feedback node by the feedback circuitry.

Abstract: A method of manufacturing semiconductor products includes: providing a semiconductor product lead frame including a semiconductor die mounting area and an array of electrically conductive leads, molding semiconductor product package molding material, e.g., laser direct structuring material, and forming on the package molding material molded onto the lead frame electrically-conductive lines extending between the semiconductor die mounting area and the array of electrically-conductive leads.

Abstract: A method of operating a memory device includes providing a first voltage to a memory array, providing a second voltage to a peripheral logic circuit, receiving an access request, and in response to the access request, increasing a third voltage of a bit line of the memory array during a precharge phase.

Abstract: A light projection system includes a light module emitting a light beam and a movable mirror reflecting the light beam toward a surface. A graphics processing unit processes video data to compensate for a response of the light module. The response is an optical power of the light beam produced by the light module for a given forward current through the light module. A light source driver controls the light module as a function of the processed video data. Colors of the images from the video data produced on the surface by the light beam would otherwise not look as they are intended to look due to changing of the response of the light module, but the processing of the video data alters the video data such that the colors of the images from the video data produced on the surface look as they are intended to look.

Abstract: A bipolar transistor is supported by a single-crystal silicon substrate including a collector contact region. A first epitaxial region forms a collector region of a first conductivity type on the collector contact region. A second epitaxial region forms a base region of a second conductivity type. Deposited semiconductor material forms an emitter region of the first conductivity type. The collector region, base region and emitter region are located within an opening formed in a stack of insulating layers that includes a sacrificial layer. The sacrificial layer is selectively removed to expose a side wall of the base region. Epitaxial growth from the exposed sidewall forms a base contact region.

Abstract: A multi-stage ring oscillator generates an output clock signal having a frequency which is dependent on a digitally leakage current that is applied to each stage of the multi-stage ring oscillator. A magnitude of a leakage current sourced by each digitally controlled leakage current source is set by a control circuit in response to a selection signal. A calibration circuit processes a reference clock signal and the output clock signal generated by the multi-stage ring oscillator to make adjustment to the selection signal which drives a locking of a frequency of the output clock signal to a desired frequency.

Abstract: The present disclosure is directed to a primary-controlled high power factor quasi resonant converter. The converter converts an AC power line input to a DC output to power a load, generally a string of LEDs, and may be compatible with phase-cut dimmers. The power input is fed into a transformer being controlled by a power switch. The power switch is driven by a controller having a shaping circuit. The shaping circuit uses a current generator, switched resistor and capacitor to produce a reference voltage signal. The controller drives the power switch based on the voltage reference signal, resulting in a sinusoidal input current in a primary winding of the transformer, resulting in high power factor and low total harmonic distortion for the converter.