Abstract: A first communication interface is a contactless communication interface for an integrated circuit. A second communication interface is coupled to a processing unit external to the integrated circuit. The transfer of data between the first communication interface and the second communication interface is made in a transfer mode using a volatile memory circuit. The volatile memory circuit is accessible simultaneously or virtually simultaneously firstly to processing circuit coupled to said first communication interface and secondly to said processing unit via said second communication interface.

Abstract: An automatic gain controller for a receiver analog frontend is provided. The automatic gain controller sets a plurality of gains for a plurality of analog frontend stages, respectively. The automatic gain controller detects a first signal level at an output of the analog frontend, determines that the first signal level is saturated and sets a first gain of a first analog frontend stage of the plurality of analog frontend stages to a first coarse gain value based on the first signal level. In response to setting the first gain, the automatic gain controller detects a second signal level at the output of the analog frontend, determines whether the second signal level is saturated and on a condition that the second signal level is not saturated, sets the first gain of the first analog frontend stage to a first fine gain value based on the second signal level.

Abstract: A shared pair of input/output cells configured to be able to be connected to a first external resonator or a second external resonator. A first oscillator and a second oscillator are coupled to the shared pair input/output cells by a switching circuit. The switching circuit is configured to be able to connect either the first oscillator or the second oscillator to the pair of input/output cells.

Abstract: A LED driving circuit includes a power factor correction circuit receiving a rectified mains voltage and providing output to a DC voltage bus, a string of LEDs connected in series, a voltage converter receiving input from the DC voltage bus and providing output to the string of LEDs, and a microcontroller. The microcontroller receives a plurality of digital feedback signals from the voltage converter, controls the voltage converter based upon a user desired brightness level and the plurality of digital feedback signals, and receive a plurality of feedback signals from the power factor correction circuit. Based on the plurality of feedback signals, the microcontroller operates the power factor correction circuit in transition mode where the user desired brightness level is above a threshold brightness, and operates the power factor correction circuit in discontinuous mode where the user desired brightness level is below the threshold brightness.

Abstract: A MEMS micromirror device includes a monolithic body of semiconductor material having a first main surface and a second main surface, with the monolithic body having an opening extending from the second main surface and including a suspended membrane of monocrystalline semiconductor material extending between the opening and the first main surface of the monolithic body. The suspended membrane includes a supporting frame and a mobile mass carried by the supporting frame and rotatable about an axis parallel to the first main surface, with the mobile mass having a width less than a width of the opening. A reflecting region extends over the mobile mass.

Abstract: Control over the operation of an electrically-controlled motor is supported by an interface circuit between the electrically-controlled motor and a near-field radio frequency communication controller. The interface circuit includes a first circuit that receives at least one control set point through a near-field radio frequency communication issued by the near-field radio frequency communication controller. A second circuit of the interface generates one or more electric signals in pulse width modulation based on the control set point.

Abstract: A microelectromechanical mirror device includes a supporting frame of semiconductor material and a plate of semiconductor material. The plate is connected to the supporting frame so as to be orientable around at least one rotation axis. A reflective layer is arranged on a first region of the plate. A piezoelectric actuation structure extends on a second region of the plate adjacent to the reflective layer. The piezoelectric actuation structure is configured to apply forces such as to modify a curvature of the plate.

Abstract: A microelectromechanical device includes a fixed structure having a frame defining a cavity, a tiltable structure elastically suspended above the cavity with main extension in a horizontal plane, a piezoelectrically driven actuation structure which can be biased to cause a desired rotation of the tiltable structure about a first and second rotation axes, and a supporting structure integral with the fixed structure and extending in the cavity starting from the frame. Lever elements are elastically coupled to the tiltable structure at a first end by elastic suspension elements and to the supporting structure at a second end by elastic connecting elements which define a lever rotation axis. The lever elements are elastically coupled to the actuation structure so that their biasing causes the desired rotation of the tiltable structure about the first and second rotation axes.

Abstract: A method includes detecting, by a first near-field communication device, the presence of a second near-field communication device. In a case where the second device is intended to be charged in near-field by the first device, the method further includes adjusting, by a control device, an impedance of an impedance matching circuit forming part of a near-field communication circuit of the first device.

Abstract: A packaged semiconductor device includes a substrate having a first surface and a second surface opposite the first surface. At least one semiconductor die is mounted at the first surface of the substrate. Electrically-conductive leads are arranged around the substrate, and electrically-conductive formations couple the at least one semiconductor die to selected leads of the electrically-conductive leads. A package molding material is molded onto the at least one semiconductor die, onto the electrically-conductive leads and onto the electrically-conductive formations. The package molding material leaves the second surface of the substrate uncovered by the package molding material. The substrate is formed by a layer of electrically-insulating material.

Abstract: An AC capacitor is coupled to a totem-pole type PFC circuit. In response to detection of a power input disconnection, the PFC circuit is controlled to discharge the AC capacitor. The PFC circuit includes a resistor and a first MOSFET and a second MOSFET coupled in series between DC output nodes with a common node coupled to the AC capacitor. When the disconnection event is detected, one of the first and second MOSFETs is turned on to discharge the AC capacitor with a current flowing through the resistor and the turned on MOSFET. Furthermore, a thyristor may be simultaneously turned on, with the discharge current flowing through a series coupling of the MOSFET, resistor and thyristor. Disconnection is detected by detecting a zero-crossing failure of an AC power input voltage or lack of input voltage decrease or input current increase in response to MOSFET turn on for a DC input.

Abstract: A wireless power circuit operable in transceiver mode and in Q-factor measurement mode includes a bridge rectifier having first and second inputs coupled to first and second terminals of a coil, and an output coupled to a rectified node. An excitation circuit coupled to the first terminal, in Q-factor measurement mode, drives the coil with a pulsed signal. A protection circuit couples the first terminal to a first node when in Q-factor measurement mode and decouples the first terminal when in transceiver mode. A controller causes the bridge rectifier to short the first and second terminals to ground during Q-factor measurement mode. A sensing circuit amplifies voltage at the first node to produce an output voltage, and in response to the voltage at the first node rising to cross a rising threshold voltage, digitizes the output voltage. The digitized output voltage is used in calculating a Q-factor of the coil.

Abstract: An electronic module includes a first die of semiconductor material including a first reflector, a second die of semiconductor material including a second reflector, and a frame including a first supporting portion and a second supporting portion parallel to one another. The first and second dies are carried, respectively, by the first and second supporting portions and are respectively arranged so that the first reflector faces the second supporting portion and the second reflector faces the first supporting portion. An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

Abstract: A piezoelectric microelectromechanical structure is provided with a piezoelectric stack having a main extension in a horizontal plane and a variable section in a plane transverse to the horizontal plane. The stack is formed by a bottom-electrode region, a piezoelectric material region arranged on the bottom-electrode region, and a top-electrode region arranged on the piezoelectric material region. The piezoelectric material region has, as a result of the variable section, a first thickness along a vertical axis transverse to the horizontal plane at a first area, and a second thickness along the same vertical axis at a second area. The second thickness is smaller than the first thickness. The structure at the first and second areas can form piezoelectric detector and a piezoelectric actuator, respectively.

Abstract: Systems and devices are provided to perform low-power digital filtering of sensor or other data based on bitwise operations. A reference sinusoid is encoded via a plurality of pulse trains, such that each pulse train includes a number of pulses n representing a value of the reference sinusoid out of a maximum possible pulses corresponding to an encoding quantization level. A circular register stores a representation of the encoded sinusoid. A set of multiple logical gate blocks are configured to multiply, via one or more bitwise operations, each of multiple bits of a received input signal with a pulse train corresponding to a value of the encoded sinusoid. A logic circuit coupled to the circular register and the set of multiple logical gate blocks is configured to generate, based on the encoded sinusoid and on the input signal, an output signal indicating an approximate value of the received input signal multiplied by the encoded sinusoid.

Abstract: A circuit includes a tank capacitor coupled between first and second nodes, and a sense resistor having a first terminal coupled to the first node and a second terminal coupled to a regulator input. A switching circuit has first and second inputs coupled to the first and second terminals of the sense resistor. A gain stage has first and second inputs capacitively coupled to first and second outputs of the switching circuit. An analog-to-digital converter receives the output of the gain stage, and receives first and second differential voltages. A reference voltage generator has a temperature independent current source coupled to source current to a reference resistor, the first differential reference voltage being formed across the reference resistor. The reference resistor and sense resistor are located sufficiently close to one another on a single common substrate such that they remain at substantially a same temperature.

Abstract: A three-dimensional photonic integrated structure includes a first semiconductor substrate and a second semiconductor substrate. The first substrate incorporates a first waveguide and the second semiconductor substrate incorporates a second waveguide. An intermediate region located between the two substrates is formed by a one dielectric layer. The second substrate further includes an optical coupler configured for receiving a light signal. The first substrate and dielectric layer form a reflective element located below and opposite the grating coupler in order to reflect at least one part of the light signal.

Abstract: A microelectromechanical gyroscope includes: a substrate; a stator sensing structure fixed to the substrate; a first mass elastically constrained to the substrate and movable with respect to the substrate in a first direction; a second mass elastically constrained to the first mass and movable with respect to the first mass in a second direction; and a third mass elastically constrained to the second mass and to the substrate and capacitively coupled to the stator sensing structure, the third mass being movable with respect to the substrate in the second direction and with respect to the second mass in the first direction.

Abstract: A structural body made of semiconductor material includes an active area housing a drain region, a body region and a source region within the body region. An electrical-isolation trench extends in the structural body to surround the active area. A first PN-junction and a second PN-junction are integrated in the structural body between the active area and the trench, respectively located on opposite sides of the active area. The first and the second PN-junctions form a first diode and a second diode, with each diode having a respective cathode electrically coupled to the drain region of the MOSFET device and a respective anode electrically coupled to the source region of the MOSFET device.