Abstract: The present disclosure relates to a voltage source device comprising: a voltage converter for generating a supply voltage at an output node of the voltage converter based on a feedback signal provided on a feedback line; at least one switch coupled between the output node of the voltage converter and an output terminal of the voltage source device; and at least one further switch configured to selectively couple the feedback line to: the output node of the voltage converter during a first regulation mode; and to the output terminal of the voltage source device during a second regulation mode.

Abstract: A learning method detects anomalies and is implemented on a microcontroller including at least one memory, the microcontroller being configured to receive data sets coming from at least one sensor, the memory being configured to store a maximum number of categories, a category including at least a signature and an occurrence.

Abstract: Merged-PiN-Schottky, MPS, device comprising: a substrate of SiC with a first conductivity; a drift layer of SiC with the first conductivity, on the substrate; an implanted region with a second conductivity, extending at a top surface of the drift layer to form a junction-barrier, JB, diode with the substrate; and a first electrical terminal in ohmic contact with the implanted region and in direct contact with the top surface to form a Schottky diode with the drift layer. The JB diode and the Schottky diode are alternated to each other along an axis: the JB diode has a minimum width parallel to the axis with a first value, and the Schottky diode has a maximum width parallel to the axis with a second value smaller than, or equal to, the first value. A breakdown voltage of the MPS device is greater than, or equal to, 115% of a maximum working voltage of the MPS device in an inhibition state.

Abstract: Disclosed herein is a method for manufacturing a semiconductor product package. The method includes arranging a leadframe with one or more leads such that each lead has an inner end facing a portion of a die-pad, attaching a semiconductor chip to the die-pad, attaching a first electrically conductive mass to the die-pad such that it is aligned with the inner end of a lead protruding over the die-pad, attaching an electrical component to the first electrically conductive mass such that a longitudinal axis of the electrical component is arranged traverse to the die-pad, and coupling a second electrically conductive mass between a termination of the electrical component and the inner end of the lead.

Abstract: A DC-DC boost converter includes an input receiving an input voltage and an output producing an output voltage. A switching stage is formed by a low-side transistor arranged between a switching node and a ground node, and a high-side transistor arranged between the switching node and the output. The high-side transistor includes a body diode having an anode coupled to the switching node and a cathode coupled to the output. The converter is controlled in an asynchronous operation mode where the low-side transistor is driven alternately to a conductive state and a non-conductive state, and the high-side transistor is driven steadily to a non-conductive state. A variable load circuit is selectively coupled between the two output terminals when the converter is in the asynchronous operation mode in order to sink a load current having a value that is a function of a value of the input voltage.

Abstract: MEMS gyroscope, having a first movable mass configured to move with respect to a fixed structure along a first drive direction and along a first sense direction, transverse to the first drive direction; a first drive assembly, coupled to the first movable mass and configured to generate a first alternate drive movement; a first drive elastic structure, coupled to the first movable mass and to the first drive assembly, rigid in the first drive direction and compliant in the first sense direction; a second movable mass, configured to move with respect to the fixed structure in a second drive direction parallel to the first drive direction and in a second sense direction parallel to the first sense direction; a second drive assembly, coupled to the second movable mass and configured to generate a second alternate drive movement in the second drive direction; and a second drive elastic structure, coupled to the second movable mass and to the second drive assembly, rigid in the second drive direction and compliant

Abstract: The present disclosure is directed to an electronic device including a semiconductor body having a first electrical conductivity and provided with a front side; an active area of the semiconductor body, accommodating the source and gate regions of the electronic device and configured to accommodate, in use, a conductive channel of the electronic device; and an edge region of the electronic device, surrounding the active area. The edge region accommodates at least in part: i) an edge termination region, having a second electrical conductivity opposite to the first electrical conductivity, extending into the semiconductor body at the front side; and ii) a gate connection terminal of conductive material, electrically coupled to the gate region, extending on the front side partially superimposed on the edge termination region and capacitively coupled with a portion of the semiconductor body adjacent and external to the edge termination region.

Abstract: A switching regulator circuit has a switching transistor actuated during a switching on phase of a duty cycle. The current flowing through an inductor of the switching regulator circuit is determined from sensing a transistor current flowing through the switching transistor during switching on phase and selectively charging a capacitor of a switched capacitor circuit dependent on a current sense signal during the switching on phase.

Abstract: A transformer of the symmetric-asymmetric type includes comprising a primary inductive circuit and a secondary inductive circuit formed in a same plane by respective interleaved and stacked metal tracks. A first crossing region includes a pair of connection plates facing one another, with each connection plate having a rectangular shape that is wider than the metal tracks, and diagonally connected to tracks of the secondary inductive circuit.

Abstract: A radio-frequency receiver includes built-in-self-test (BIST) circuitry which generates a self-test signal. A local oscillator signal is divided. A self-test oscillation signal is generated, based, at least in part, on the frequency-divided local oscillation signal. The self-test signal is generated based on the self-test oscillation signal. The BIST circuitry includes a divider, which divides the self-test oscillation signal. The frequency-divided local oscillation signal and the divided self-test oscillation signal are used to perform one or more of generating the self-test oscillation signal and controlling the generation of the self-test oscillation signal. The radio-frequency receiver may be an automotive radar receiver.

Abstract: A system for detecting a presence in an environment to be monitored includes an electrostatic charge variation sensor, a vibration sensor, and an environmental pressure sensor. A processing unit is configured to acquire, from the electrostatic charge variation sensor, an electrostatic charge variation signal, and detect in the electrostatic charge variation signal, first signal characteristics indicative of the presence of a subject in the environment to be monitored. The processing unit further validates the detection of presence of the subject using the vibration and pressure signals provided by the other sensors.

Abstract: A voltage supply circuit and a method for controlling a voltage supply circuit are provided. The voltage supply circuit includes a positive charge pump stage that generates a positive voltage and a negative charge pump stage that generates a negative voltage. The voltage supply circuit also includes a control stage that compares a voltage representative of the negative voltage with a reference voltage and causes a slope of the positive voltage to decrease when the voltage representative of the negative voltage exceeds the reference voltage.

Abstract: The present description concerns a package for an electronic device. The package including a plate and a lateral wall, separated by a layer made of a bonding material and at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated.

Abstract: A device includes a first circuit that includes a near-field emission circuit, a second circuit, and a hardware connection linking the first circuit to the second circuit. The hardware connection is dedicated to a priority management between the first circuit and the second circuit. In addition, priority management information can be communicated between a near-field emission circuit and a second circuit. The communicating occurs between a dedicated hardware connection connecting the near-field emission circuit to the second circuit.

Abstract: A frame includes leadframe units arranged in a matrix. Each leadframe unit has a die pad and tie bars connected to and extending from the die pad. Each tie bar includes an internal tie bar portion and an external tie bar portion. The internal tie bar portion of at least one tie bar includes a cut separating a part of the internal tie bar portion from the external tie bar portion. An out-of-plane bend in that part forms a mold flow control structure.

Abstract: An electronic system includes a control circuit to provide a binary control signal alternating between a first binary state during first phases and a second binary state during second phases; a screen controlled by the control signal, the screen emitting light during each first phase, and to not emit any light during each second phase; a light sensor under the screen or along the edge of the screen, and providing a measurement signal representative of a quantity of light received by the sensor during a measurement phase or a plurality of consecutive measurement phases; and a synchronization device to synchronize each measurement phase with a second phase.

Abstract: A method of operating an electronic device includes generating scramble control codes. The scramble codes are generated by generating a random number, shifting the random number to produce a shifted random number, generating control signals by selecting different subsets of the shifted random number, and generating scramble control words by selecting different subsets of the random number based upon the control signals. The method further includes receiving a password comprised of sub-words and scrambling those sub-words according to the scramble control codes, retrieving a verification word comprised of sub-words and scrambling those sub-words according to the scramble control codes, and comparing the scrambled sub-words of the password to the scrambled sub-words of the verification word to thereby authenticate an external device that provided the password.

Abstract: In various embodiments, the present disclosure provides semiconductor devices, packages, and methods. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and an encapsulant on the die pad and the lead. A plurality of cavities extends into at least one of the die pad or the lead to a depth from a surface of the at least one of the die pad or the lead. The depth is within a range from 0.5 ?m to 5 ?m. The encapsulant extends into the plurality of cavities. The cavities facilitate improved adhesion between the die pad or lead and the encapsulant, as the cavities increase a surface area of contact with the encapsulant, and further increase a mechanical interlock with the encapsulant, as the cavities may have a rounded or semi-spherical shape.

Abstract: The device has a first support element forming a first thermal dissipation surface and carrying a first power component; a second support element forming a second thermal dissipation surface and carrying a second power component, a first contacting element superimposed to the first power component; a second contacting element superimposed to the second power component; a plurality of leads electrically coupled with the power components through the first and/or the second support elements; and a thermally conductive body arranged between the first and the second contacting elements. The first and the second support elements and the first and the second contacting elements are formed by electrically insulating and thermally conductive multilayers.

Abstract: A first RF-to-DC circuit receives a radiofrequency signal and produces a first converted signal delivered to an energy storage circuit. A second RF-to-DC circuit, which is a down-scaled replica of the first RF-to-DC circuit, produces a second converted signal from the radiofrequency signal that is indicative of an open-circuit voltage of the first RF-to-DC circuit. The first RF-to-DC section includes N sub-stages, with a sub-set of sub-stages being selectively activatable. A window comparison of the second converted signal generates a first signal and a second signal indicative of whether the second converted signal is within a range of values proportional to a voltage reference signal. The sub-set of sub-stages is selectively deactivated, respectively activated, when the performed window comparison has a first result, respectively, a second result.