Patents Assigned to STMicroelectronics Pte Ltd
  • Image sensor device with an electromagnetic compatibility shield (EMC) and associated methods
    Patent number: 9525832
    Abstract: An image sensor device includes a base having a rectangular shape and comprising first contacts and a reference voltage contact extending along a first side thereof, a housing carried by the base, and an image sensor integrated circuit (IC) carried by the base within the housing and having an image sensing surface. A focus cell is within the housing, aligned with the image sensing surface, and includes second contacts. An electromagnetic compatibility (EMC) shield is carried by the housing and includes a top panel having an opening therein aligned with the focus cell, and side panels extending downwardly from the top panel. Conductive leads extend between one of the first contacts and a corresponding one of the second contacts. A reference conductive lead extends between the reference voltage contact and the EMC shield.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: December 20, 2016
    Assignee: STMICROELECTRONICS PTE LTD
    Inventor: Dave Alexis De La Cruz
  • Semiconductor device, semiconductor package, and method for manufacturing semiconductor device
    Patent number: 9502381
    Abstract: Embodiments of the present disclosure provide a semiconductor device, a semiconductor package, and a method for manufacturing a semiconductor device. The semiconductor device comprises: a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die; a substrate; and a non-conductive adhesive layer disposed between the electrical isolation layer and the substrate, so as to adhere the electrical isolation layer to the substrate.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: November 22, 2016
    Assignee: STMICROELECTRONICS PTE LTD
    Inventor: Jing-En Luan
  • Electronic device with redistribution layer and stiffeners and related methods
    Patent number: 9466550
    Abstract: An electronic device may include an integrated circuit (IC), electrically conductive connectors coupled to the IC, and a heat sink layer adjacent the IC and opposite the electrically conductive connectors. The electronic device may include an encapsulation material surrounding the IC and the electrically conductive connectors, a redistribution layer having electrically conductive traces coupled to the electrically conductive connectors, a stiffener between the heat sink layer and the redistribution layer, and a fan-out component between the heat sink layer and the redistribution layer and being in the encapsulation material.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: October 11, 2016
    Assignee: STMICROELECTRONICS PTE LTD
    Inventor: Jing-En Luan
  • Integrated circuit package and method of forming the same
    Patent number: 9455241
    Abstract: Aspects of the invention are directed towards an integrated circuit package and method of forming the same, and more particularly to a redistributed chip packaging for an integrated circuit. The integrated circuit package includes an integrated circuit having a protective material on at least a portion of the integrated circuit. A lead frame is coupled to the integrated circuit and a conductive layer is also coupled to the interconnect. A solder ball is coupled to the conductive layer and a passivation layer is on the conductive layer. Active and passive components are electrically coupled to the integrated circuit.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: September 27, 2016
    Assignee: STMICROELECTRONICS PTE LTD
    Inventors: Yonggang Jin, Kiyoshi Kuwabara, Xavier Baraton
  • Image sensing device with interconnect layer gap
    Patent number: 9455292
    Abstract: An image sensing device may include an interconnect layer, an image sensor IC coupled to the interconnect layer and having an image sensing surface, and an IR filter aligned with the image sensing surface opposite the interconnect layer. The image sensing device may include a flexible interconnect layer aligned with the interconnect layer and having a flexible substrate extending laterally outwardly from the interconnect layer, and electrically conductive traces on the flexible substrate. The image sensing device may also include solder bodies coupling the interconnect layer and the flexible interconnect layer and also defining a gap between the interconnect layer and the flexible interconnect layer.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: September 27, 2016
    Assignee: STMICROELECTRONICS PTE LTD
    Inventor: Jing-En Luan
  • Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming
    Patent number: 9449912
    Abstract: An integrated circuit (IC) module for an IC card includes a plurality of IC card contacts in side-by-side relation. A dielectric support layer is above the contact layer and has a plurality of openings and a first coefficient of thermal expansion (CTE). An IC die is above the dielectric support layer and includes a plurality of bond pads. A bond wire extends from a respective bond pad to a corresponding contact through an adjacent opening in the dielectric support layer. A respective body of fill material is within each opening and has a second CTE. A mold compound body is above the dielectric support layer, the bodies of fill material, and surrounding the IC die. The mold compound body has a third CTE. The first CTE is closer to the second CTE than to the third CTE.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: September 20, 2016
    Assignees: STMICROELECTRONICS PTE LTD, STMICROELECTRONICS (MALTA) LTD
    Inventors: Xueren Zhang, Kim-Yong Goh, Roseanne Duca
  • Gas sensor device with frame passageways and related methods
    Patent number: 9448216
    Abstract: A gas sensor device may include a gas sensor integrated circuit (IC) having a gas sensing surface, and bond pads adjacent to the gas sensing surface, and a frame having gas passageways extending therethrough adjacent the gas sensing surface. The gas sensor device may include leads, each having a proximal end spaced from the frame and bonded to a respective bond pad, and a distal end extending downwardly from the proximal end, and encapsulation material filling the space between the proximal ends of the leads and the frame.
    Type: Grant
    Filed: October 10, 2014
    Date of Patent: September 20, 2016
    Assignee: STMICROELECTRONICS PTE LTD
    Inventors: Yonggang Jin, Ravi Shankar
  • Microsensor with integrated temperature control
    Patent number: 9448198
    Abstract: Microsensors that include an integrated thermal energy source and an integrated temperature sensor are capable of providing localized heating and temperature control of individual sensing regions within the microsensor. Localized temperature control allows analyte detection to be carried out at the same temperatures or substantially the same temperatures at which the sensor is calibrated. By carrying out the sensing near the calibration temperature, more accurate results can be obtained. In addition, the temperature of the sensing region can be controlled so that chemical reactions involving the analyte in the sensing region occur near their peak reaction rate. Carrying out the sensing near the peak reaction rate improves the sensitivity of the sensor which is important as sensor dimensions decrease and the magnitude of the generated signals decreases.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: September 20, 2016
    Assignee: STMICROELECTRONICS PTE LTD.
    Inventors: Olivier Le Neel, Suman Cherian, Ravi Shankar
  • Absolute temperature method for disposable glucose strip
    Patent number: 9435763
    Abstract: A bio-fluid test strip includes a fluid receiving area and a contact pad area for interfacing with a fluid sensing device. The test strip includes a fluid sensing electrodes and a first temperature sensing resistor in the fluid receiving area. The test strip further includes a second temperature sensing resistor in the contact pad area. The first and second temperature sensing resistors together provide an indication of the temperature difference between the fluid sensing area and ambience.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: September 6, 2016
    Assignee: STMICROELECTRONICS PTE LTD.
    Inventors: Olivier Le Neel, Suman Cherian
  • Combo bio and temperature disposable sensor on flexible foil
    Patent number: 9437798
    Abstract: A bio-fluid sensor is formed by depositing polyimide on a glass substrate. Gold and platinum are deposited on the polyimide and patterned to form fluid sensing electrodes, signal traces, and a temperature sensor. The fluid sensor is then fixed to a flexible tape and peeled off of the glass substrate.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: September 6, 2016
    Assignee: STMICROELECTRONICS PTE LTD.
    Inventors: Olivier Le Neel, Suman Cherian, Calvin Leung, Ravi Shankar, Tien Choy Loh, Shian Yeu Kam
  • Error correction in memory devices by multiple readings with different references
    Patent number: 9430328
    Abstract: A memory device may include memory cells. The method may include receiving a request of reading a selected data word associated with a selected code word stored with an error correction code, and reading a first code word representing a first version of the selected code word by comparing a state of each selected memory cell with a first reference. The method may include verifying the first code word, setting the selected code word according to the first code word in response to a positive verification, reading at least one second code word representing a second version of the selected code word, verifying the second code word, and setting the selected code word according to the second code word in response to a negative verification of the first code word and to a positive verification of the second code word.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: August 30, 2016
    Assignees: STMICROELECTRONICS S.R.L., STMICROELECTRONICS PTE LTD
    Inventors: Antonino Conte, Kailash Khairnar
  • Integrated circuit (IC) package with thick die pad functioning as a heat sink
    Patent number: 9418920
    Abstract: An integrated circuit (IC) package includes a die pad and an IC die secured on the die pad. The IC die had outer edges aligned with outer edges of the die pad. An encapsulating material body surrounds the die pad and IC die. Leads extend outwardly from the encapsulating material body and are coupled to the IC die. Each lead has an upper surface coplanar with an upper surface of the IC die. The die pad has a lower surface exposed through the encapsulating material body, and has a thickness greater than a thickness of each of the plurality of leads.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: August 16, 2016
    Assignee: STMICROELECTRONICS PTE LTD
    Inventor: Wing Shenq Wong
  • Image sensor device with flexible interconnect layer and related methods
    Patent number: 9385153
    Abstract: An image sensor device may include an interconnect layer having an opening extending therethrough, an image sensor IC within the opening and having an image sensing surface, and an IR filter aligned with the image sensing surface. The image sensor device may include an encapsulation material laterally surrounding the image sensor IC and filling the opening, and a flexible interconnect layer coupled to the interconnect layer opposite the image sensing surface.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: July 5, 2016
    Assignee: STMICROELECTRONICS PTE LTD
    Inventor: Jing-En Luan
  • Method of making an electronic device including two-step encapsulation and related devices
    Patent number: 9379034
    Abstract: A method of making an electronic device may include positioning an integrated circuit (IC) die on an upper surface of a grid array substrate having connections on a lower surface thereof and coupling respective bond pads of the IC die to the grid array with bond wires. The method may also include forming a first encapsulating layer over the IC die and bond wires and positioning a heat spreader on the substrate above the first encapsulating layer after forming the first encapsulating layer. The method may further include forming a second encapsulating layer over the first encapsulating layer and embedding the heat spreader in the second encapsulating layer.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: June 28, 2016
    Assignee: STMICROELECTRONICS PTE LTD
    Inventors: Kim-Yong Goh, Yiyi Ma, Xueren Zhang
  • Method of processing a semiconductor wafer such as to make prototypes and related apparatus
    Patent number: 9377678
    Abstract: A method of processing a semiconductor wafer may include providing a rotatably alignable photolithography mask that includes different mask images. Each mask image may be in a corresponding different mask sector. The method may also include performing a series of exposures with the rotatably alignable photolithography mask at different rotational alignments with respect to the semiconductor wafer so that the different mask images produce at least one working semiconductor wafer sector, and at least one non-working semiconductor wafer sector.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: June 28, 2016
    Assignee: STMICROELECTRONICS PTE LTD
    Inventors: Alan Lee, Xi Ge
  • Apparatus and method to attach a wireless communication device into a semiconductor package
    Patent number: 9337111
    Abstract: A semiconductor package includes an RFID chip positioned between a first die and a second die attached to a support substrate. The RFID chip is free of electrical connections to the dice and the support substrate. The RFID chip is sized to correspond to an interposer board. Data pertaining to operating characteristics of the dice are stored to and read from the RFID chip during back-end processing to determine abnormalities and improve yield. Said data may be stored to a database corresponding to the RFID chip in the package. A method of making a semiconductor package having an RFID chip positioned between dice is provided. The package is traceable by customers via the data stored to the RFID chip and the database.
    Type: Grant
    Filed: March 29, 2013
    Date of Patent: May 10, 2016
    Assignee: STMicroelectronics Pte Ltd
    Inventor: Yohanes Bintang
  • Through via package
    Patent number: 9318459
    Abstract: An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: April 19, 2016
    Assignee: STMicroelectronics Pte Ltd.
    Inventors: How Yuan Hwang, Kah Wee Gan
  • WAFER LEVEL PACKAGING, OPTICAL DETECTION SENSOR AND METHOD OF FORMING SAME
    Publication number: 20160099373
    Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.
    Type: Application
    Filed: December 14, 2015
    Publication date: April 7, 2016
    Applicant: STMicroelectronics Pte Ltd
    Inventors: Yonggang Jin, Wee Chin Judy Lim
  • Top gate mold with particle trap
    Patent number: 9254596
    Abstract: A top-gate molding system for encapsulating semiconductor devices includes a plurality of mold cavities formed between a middle plate and a bottom plate, and a runner system formed between an upper plate and the middle plate. The runner system includes a runner with a plurality of reservoirs along its length, with a gate extending from each of the reservoirs to one of the cavities. A particle trap is positioned on the bottom of the runner between a sprue and a first one of the reservoirs, to capture contaminating particles in a flow of molding compound before the particles enter any of the reservoirs. The particle trap can be, for example, a notch or a channel extending transversely across the bottom of the runner, or a dummy reservoir upstream of the first of the plurality of reservoirs.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: February 9, 2016
    Assignee: STMICROELECTRONICS PTE LTD.
    Inventors: Jerome Teysseyre, Glenn de los Reyes
  • Camera module
    Patent number: 9258467
    Abstract: One or more embodiments are directed to optical module assemblies, such as a camera module assembly, and methods of forming same. One embodiment is directed to an optical module assembly that includes a substrate having a first surface. An optical device is secured to the first surface of the substrate and electrically coupled to the substrate. A molded body is located on the first surface of the substrate outward of the optical device. The molded body includes a first recess. A lens assembly is secured to the molded body over the first recess by an adhesive material located in the first recess. In some embodiments, the molded body of the optical module assembly further includes a second recess spaced apart from the first recess. A transparent material is secured to the molded body over the second recess by an adhesive material located in the second recess.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: February 9, 2016
    Assignee: STMicroelectronics Pte Ltd.
    Inventor: Wing Shenq Wong