Abstract: An integrated circuit includes an array of memory cells arranged in a plurality of sectors. Each sector includes a plurality of distinct random access memory resources able to be accessed differently in different modes. Peripheral circuitry is commonly shared by at least some of the sectors for addressing and reading/writing data. A respective dedicated controllable power supply line is coupled to each sector.

Abstract: An embodiment of a MOS device resistant to ionizing-radiation, has: a surface semiconductor layer with a first type of conductivity; a gate structure formed above the surface semiconductor layer, and constituted by a dielectric gate region and a gate-electrode region overlying the dielectric gate region; and body regions having a second type of conductivity, formed within the surface semiconductor layer, laterally and partially underneath the gate structure. In particular, the dielectric gate region is formed by a central region having a first thickness, and by side regions having a second thickness, smaller than the first thickness; the central region overlying an intercell region of the surface semiconductor layer, set between the body regions.

Abstract: A voltage regulator including an output stage to generate an output voltage based upon a control voltage determined as a function of a difference between a reference voltage and a voltage representative of the output voltage. A sense resistor is coupled in series with the output stage and an auxiliary power stage is coupled in parallel with the output stage and cooperates therewith to supply a load as a function of a voltage drop across the sense resistor. A scaled replica stage of the output stage is controlled by the control voltage to generate a replica voltage of the output voltage. A bias network biases the scaled replica stage and output stage with identical currents to keep constant bias voltages. The output stage, the auxiliary power stage, the scaled replica stage, and the bias network each have high voltage transistors.

Abstract: A device for controlling the frequency of resonance of an oscillating micro-electromechanical system includes: a microstructure, having a first body and a second body, which is capacitively coupled to the first body and elastically oscillatable with respect thereto at a calibratable frequency of resonance, a relative displacement between the second body and the first body being detectable from outside; and an amplifier coupled to the microstructure for detecting the relative displacement. DC decoupling elements are arranged between the amplifier and the microstructure.

Abstract: A memory device may include an array of addressable three-level cells, a coding circuit being input with three-bit strings and generating corresponding ternary strings based upon a code, and a program circuit being input with the ternary strings and storing them in respective pairs of three-level cells. The memory device also may include a read circuit reading stored ternary strings in the respective pairs of three-level cells, and a decoding circuit being input with the stored ternary strings and generating corresponding strings of three bits based upon the code.

Abstract: A method and system for making error corrections on digital information coded as symbol sequences, for example digital information stored in electronic memory systems or transmitted from and to these systems is described, provides the transmission of sequences incorporating a portion of error corrector code allowing the sequence which is more probably the original transmitted through the calculation of an error syndrome using a parity matrix to be restored when received. Advantageously according to embodiments of the invention, the error code incorporated in the original sequence belongs to a non Boolean group.

Abstract: A voltage regulator connected to a memory cell is configured by identifying at least a first and a second operation regions of the cell and associating the first and second operation regions with respective first and second operation conditions of the memory cell. An operative condition of the memory cell involved in a programming operation is detected, and at least a configuration signal of the regulator according to said detected operative condition is generated, this configuration signal taking a first and a second value associated with the first and second operation conditions.

Abstract: Basic redundancy information is non-volatily stored in a reserved area of an addressable area of a memory array, and is copied to volatile storage therein at every power-on of the memory device. The unpredictable though statistically inevitable presence of failed array elements in such a reserved area of the memory array corrupts the basic redundancy information established during the test-on wafer (EWS) phase of the fabrication process. This increases the number of rejects, and lowers the yield of the fabrication process. This problem is addressed by writing the basic redundancy data in the reserved area of the array with an ECC technique using a certain error correction code. The error correction code may be chosen among majority codes 3, 5, 7, 15 and the like, or the Hamming code for 1, 2, 3 or more errors, as a function of the fail probability of a memory cell as determined by the EWS phase during fabrication.

Abstract: The capacitive coupling between two adjacent bitlines of a NAND memory device may be exploited for boosting the voltage of bitlines that are not to be programmed in order to inhibit program operations on them. The even (odd) bitlines that include cells not to be programmed are biased with a first voltage for inhibiting them from being programmed while the even (odd) bitlines that include cells to be programmed are grounded. The adjacent odd (even) bitlines are biased at the supply voltage or at an auxiliary voltage for boosting the bias voltage of the even (odd) bitlines above the supply voltage. The bias voltage of the even (odd) bitlines that include cells not to be programmed is boosted because of the relevant parasitic coupling capacitances between adjacent bitlines.

Abstract: Transmission of multicast packets over a local area network is controlled by: identifying the condition where only a single receiver exists within the local area network for a given multicast group of packets, and allowing, upon occurrence of that condition, Automatic Repeat Request of the packets multicast towards said single receiver. A preferred field of application is wireless local area networks for use in a home environment.

Abstract: An address counter for a nonvolatile memory device includes a cascade of cells. Each cell includes an address counting flip-flop that is updated to a value of every newly counted address bit, or latches a column address bit value input by an external user of the memory device during ALE cycles for addressing a start memory location on a selected page. Each cell further includes an additional address loading flip-flop for loading the column address bit value input during ALE cycles for addressing the start memory location on the selected page during the ALE cycles. A logic circuit updates the address counting flip flop to the address bit value during a read confirm cycle in a read sequence, and during a first data input cycle in a program sequence.

Abstract: A charge pump system is provided that includes at least one first pump for generating a first working voltage, a second pump for generating a second working voltage, and a third pump for generating a third working voltage. The first pump is connected to an internal supply voltage reference that can having a limited value, and has an output terminal connected to the second and third pumps so as to supplying them with the first working voltage as their supply voltage. A method is also provided for managing the generation of voltages to be used with such a charge pump system.

Abstract: The method prevents oxidation or contamination phenomena of conductive interconnection structures in semiconductor devices and includes providing a layer of semiconductor or oxide base, a conductive layer or stack on the base layer, and an antireflection coating (ARC) layer on the conductive layer or stack. The method provides a thin dielectric covering layer on the antireflection coating layer to fill or cover the microfissures existing in the antireflection coating layer.

Abstract: A class AB operational amplifier is provided that includes first and second input transistors respectively coupled between first and second internal nodes and a first common node, first and second input stage load transistors diode connected and respectively coupled between a first voltage reference and the first and second internal nodes, first and second output transistors coupled in series between the first voltage reference and a second voltage reference, a tail current generator coupled between the first common node and the second voltage reference, an adaptive bias block coupled between the first and second voltage references and coupled to the first common node, and a positive feedback network coupled between the first voltage reference and the first and second internal nodes. Also provided is an integrated circuit having at least one such operational amplifier.

Abstract: A method for manufacturing an integrated electronic device. The method includes providing an SOI substrate having a semiconductor substrate, an insulating layer on the semiconductor substrate, and a semiconductor starting layer on the insulating layer; epitaxially growing the starting layer to obtain a semiconductor active layer on the insulating layer for integrating components of the device, and forming at least one contact trench extending from an exposed surface of the starting layer to the semiconductor substrate before the step of epitaxially growing the starting layer, wherein each contact trench clears a corresponding portion of the starting layer, of the insulating layer and of the semiconductor substrate, the epitaxial growing being further applied to the cleared portions thereby at least partially filling the at least one contact trench with semiconductor material.

Abstract: A process for manufacturing an organic mask for the microelectronics industry, including forming an organic layer on a substrate; forming an inorganic mask on the organic layer; and etching selectively the organic layer through the inorganic mask. Furthermore, forming the inorganic mask includes forming at least a first auxiliary layer of a first inorganic material on the organic layer; forming a mask layer of a second inorganic material different from the first inorganic material on the first auxiliary layer; and shaping the mask layer using a dual-exposure lithographic process.

Abstract: An asynchronous set-reset circuit device for testing activity performed by an Automatic Test Patterns Generation tool may include a pair of logic gates having at least two inputs each, and a logic gate structure coupled upstream from the pair of logic gates. The logic gate structure may be for driving one respective input of the pair of logic gates and may have inputs receiving a pair of test command signals. The asynchronous set-reset circuit device may also include a plurality of feedback connections between outputs of the pair of logic gates and respective inputs of the logic gate structure.

Abstract: A monitoring device for an electric motor has in input a signal representing zero crossings of the back-electromotive force of the motor and comprises a monitor that detects the signal in first periods of time arranged around instants of time in which the zero crossings are expected. The device comprises a setting circuit that sets second periods of time that are less than the first periods of time and each second period of time is centered on the instant of time in which the zero crossing is expected. The monitor comprises a detector that tests whether each actual zero crossing occurs inside the second period of time and a controller that modifies by a quantity the subsequent period of electric revolution time between two consecutive expected instants of zero crossing if said actual zero crossing occurs outside the second period of time.

Abstract: A power converter having a noise component and a modulator configured to vary a frequency of the noise component of the power converter on the basis of a digital signal to be transmitted.

Abstract: A sensing circuit is provided. The sensing circuit is adapted to determine when a cell current flowing trough a selected memory cell exceeds a reference current during an evaluation phase of a sensing operation. The sensing circuit is adapted to be coupled to at least one selected memory cell through a respective bit line. The sensing circuit includes: an access circuit node adapted to be coupled to the bit line; precharging circuitry adapted to be activated in a precharge phase of the sensing operation preceding the evaluation phase, so as to bring a voltage of said access circuit node to a reference voltage; a reference circuit node coupled to the access circuit node and arranged to receive the reference current.