Abstract: An approach for executing a toolkit action in an IC card includes storing in the IC card one or more identifiers and corresponding toolkit actions, and passing a web page in input to a converter in the IC card. The converter is configured to identify one or more of the identifiers in the html page and related text information associated with the identifiers. The approach includes sending the toolkit actions corresponding to the identifiers identified and the related text information to an application SIM Application Toolkit (SAT) of the IC card, for displaying the text information of the web page as SIM Application Toolkit menu.

Abstract: A circuit is for monitoring the powering of a remote device through a LAN without generating an extra biasing voltage higher than the DC power supply voltage. DC voltage used for supplying the remote device is applied to the LAN line while an AC voltage is applied to the line for monitoring whether the remote device is connected to the LAN line. The DC voltage is applied to a first or “high” terminal and the AC voltage is applied to the other or “low” terminal of the LAN line through a decoupling capacitor. This arrangement allows the supplying of the remote device with a large DC voltage compatible with a fully integrated AC signal generator, disconnection detector, and PSE controller, and enhances the reliability of the recognition of whether the powered device is connected to, or disconnected from, the LAN line.

Abstract: A power supply includes a power supply circuit and a power-on circuit controlling transitioning of the power supply circuit to a turned-on state. The power-on circuit includes a code driver, a controller coupled to the power supply circuit and code driver, and a transducer to detect a wireless control signal and generate an enable signal based thereupon. A transistor has a first conduction terminal coupled to the code driver, a second conduction terminal coupled to the controller, and a control terminal coupled to the transducer to receive the enable signal so the transistor switches based thereupon. The code driver detects a code embedded in the wireless control signal based upon switching of the transistor, and generates a power on signal for the controller based upon the code. The controller causes the power supply circuit to transition from the turned-off state to the turned-on state based upon the power on signal.

Abstract: An integrated circuit controls a switch of a switching current regulator. The current regulator includes primary and secondary windings where a first and a second current flow, respectively. The switch is adapted to initiate or interrupt the circulation of the first current in the primary winding. The control integrated circuit includes a comparator configured to compare a first signal representative of the first current to a second signal and a divider circuit configured to generate the second signal as a ratio of a third signal, proportional to a voltage on the primary winding, with a voltage on a capacitor. The capacitor is charged by a further current controlled by the third signal when the second current is different from zero. The capacitor is discharged through a parallel-connected resistor when the value of said second current is substantially zero.

Abstract: An embodiment of an integrated electronic device having a body, made at least partially of semiconductor material and having a top surface, a bottom surface, and a side surface, and a first antenna, which is integrated in the body and enables magnetic or electromagnetic coupling of the integrated electronic device with a further antenna. The integrated electronic device moreover has a coupling region made of magnetic material, which provides, in use, a communication channel between the first antenna and the further antenna.

Abstract: An embodiment of a consumer electronics product having a thumbnail display feature includes a system for generating and storing thumbnails having a given size from images, such as JPEG images, for which a spatial frequency domain representation is available. The system includes a zooming processor to reduce the size of the images by zooming. The zooming processor is configured to perform both spatial frequency domain zooming to approximate the desired thumbnail size and then image pixel domain zooming to fit the desired thumbnail size. The product includes cache storage configured to store a plurality of thumbnails in a file system as free blocks in the file system, so that file system data structures are left unchanged.

Abstract: Image defects in digital images are easily detectable by the human eye but may be difficult to detect in a computer-implemented fashion. In an embodiment of a digital-image-acquisition device, defects are removed on the CFA domain before color interpolation takes place. In order to allow cancellation of couplets of defective pixels, a two pass embodiment is presented. Such embodiment presents methods and systems that can remove both couplets and singlets without damaging the image. The system includes a ring corrector that detects a defect in the ring of pixels that surround a central pixel, a singlet corrector that detects and corrects the central pixel and removes a couplet if the ring corrector is activated, whereas if the ring corrector is switched off, the singlet corrector only removes singlets, and a peak-and-valley detector that avoids overcorrection by avoiding correcting signal peaks or valleys in case of spikes or drops in signal.

Abstract: A solution for indexing electronic devices includes corresponding electronic device including a die integrating an electronic circuit, the die having at least one index including a reference defining an ordered alignment of a plurality of locations on the die and a marker for defining a value of the index according to an arrangement of the marker with respect to the reference. In one embodiment, the marker includes a plurality of markers each one arranged at a selected one of the locations, the selected location of the marker defining a value of a digit associated with a corresponding power of a base higher than 2 within a number in a positional notation in the base representing the value of the index.

Abstract: An array of LED diodes includes N channels each having LEDs coupled in series with a switch. A current driver for the array includes a processing circuit configured to detect N currents flowing respectively through the N channels of the array. The detected currents are converted by a single analog to digital converter, one at a time, into a digital word. The circuit further includes N comparator devices configured to control the N switches as result of a comparison between the digital words and respective target digital words. A memory is provided for storing the digital words received from the analog to digital converter.

Abstract: A failure diagnosis circuit includes a multiplexer and a controller. The multiplexer receives address signals, and selectively outputs one of the address signals to an addressable module in response to a selecting signal. The controller generates a first one of address signals and the selecting signal. A built-in self-test circuit generates the second address signal. The addressable module includes addressable components responsive to the address signal. The controller processes the output of the addressable module responsive to the address signal to make a failure diagnosis. The built-in self-test circuit performs signature analysis on the read out output of the addressable module.

Abstract: An embodiment of a circuit includes an input node, a generator, a combiner, a converter, and a filter. The input node is configured to receive an input signal in a first domain, and the generator is configured to generate a periodic signal in the first domain. The combiner is configured to combine the input and periodic signals into a resulting signal in the first domain, and the converter is configured to convert the resulting signal into a converted signal in a second domain. And the filter is configured to remove from the converted signal substantially all of a frequency component of the converted signal having substantially a same frequency as a frequency component of the periodic signal.

Abstract: A current driver for a string of LEDs includes a first series connection of a first transistor and a first resistance and a second series connection of a second transistor and a second resistance. The first and second series connections are coupled in parallel between the string of LEDs and a voltage reference. An operational amplifier selectively drives the first and second transistors in response to a clock signal. A switch device driven by the clock signal alternately applies a reference voltage and a respective one of the voltages across the first and second resistances to inverting and non-inverting inputs of the operational amplifier in response to the clock signal. A storage circuit is coupled to the output of the operational amplifier to store the drive signals for the first and second transistors for application to the first and second transistors in the absence of output from the operational amplifier.

Abstract: A power supply apparatus includes a power supply circuit and a power-on circuit. The power-on circuit detects a remotely transmitted control signal and causes a transition of the power supply circuit to a turned on state. The power-on circuit includes a transducer configured to provide a power-on signal in response to the remote control signal. The transducer triggers transition to the turned on state through a switch driven by the power-on signal output from the transducer and arranged to supply a power supply circuit enable signal. A DC blocking capacitor is connected between an output of the transducer and a control terminal of the switch.

Abstract: A method for integrating a set of electronic devices on a wafer (100; 200a; 200b) of semiconductor material having a main surface includes forming a plurality of trenches extending into the wafer from the main surface. At least one layer of electrically insulating material is formed within each trench. At least one layer of electrically conductive material is formed within each trench superimposed on the at least one layer of insulating material. The formation of the plurality of trenches includes forming the trenches partitioned into sub-sets of trenches. The trenches of a first sub-set are oriented along a first common direction that is different from the orientation of the trenches of a second sub-set.

Abstract: A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.

Abstract: An embodiment of the time-variant channel estimation in an OFDM transmission system envisages the operations of: a) determining the received signal vector Yj,k for one or more of R receiving antennas, j=1, . . .

Abstract: A method for real-time quantitative detection of single-type, target nucleic acid sequences amplified using a PCR in a microwell, comprising introducing in the microwell a sample comprising target nucleic acid sequences, magnetic primers, and labelling probes; performing an amplification cycle to form labelled amplicons; attracting the magnetic primers to a surface through a magnetic field to form a layer including labelled amplification products and free magnetic primers; and detecting the labelled amplification products in the layer with a surface-specific reading method.

Abstract: A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.

Abstract: One or more embodiments are directed to encapsulating structure comprising: a substrate having a first surface and housing at least one conductive pad, which extends facing the first surface and is configured for being electrically coupled to a conduction terminal at a reference voltage; a cover member, set at a distance from and facing the first surface of the substrate; and housing walls, which extend between the substrate and the cover member. The substrate, the cover member, and the housing walls define a cavity, which is internal to the encapsulating structure and houses the conductive pad. Moreover present inside the cavity is at least one electrically conductive structure, which extends between, and in electrical contact with, the cover member and the conductive pad for connecting the cover member electrically to the conduction terminal.

Abstract: An embodiment of an electronic device integrated in a chip of semiconductor material and an embodiment of a corresponding production method are proposed. The electronic device includes a capacitor having a first conductive plate, a second conductive plate, and an insulating layer for insulating the first plate from the second plate. In an embodiment of the disclosure, at least a selected one between the first plate and the second plate has a non-uniform thickness.