Abstract: A micro-electro-mechanical device is formed by a fixed structure having a cavity. A tiltable structure is elastically suspended over the cavity and has a main extension in a tiltable plane and is rotatable about a rotation axis parallel to the tiltable plane. A piezoelectric actuation structure includes first and second driving arms carrying respective piezoelectric material regions and extending on opposite sides of the rotation axis. The first and the second driving arms are rigidly coupled to the fixed structure and are elastically coupled to the tiltable structure. During operation, a stop structure limits movements of the tiltable structure with respect to the actuation structure along a planar direction perpendicular to the rotation axis. The stop structure has a first planar stop element formed between the first driving arm and the tiltable structure and a second planar stop element formed between the second driving arm and the tiltable structure.

Abstract: A power semiconductor device including a first and second die, each including a plurality of conductive contact regions and a passivation region including a number of projecting dielectric regions and a number of windows. Adjacent windows are separated by a corresponding projecting dielectric region with each conductive contact region arranged within a corresponding window. A package of the surface mount type houses the first and second dice. The package includes a first bottom insulation multilayer and a second bottom insulation multilayer carrying, respectively, the first and second dice. A covering metal layer is arranged on top of the first and second dice and includes projecting metal regions extending into the windows to couple electrically with corresponding conductive contact regions. The covering metal layer moreover forms a number of cavities, which are interposed between the projecting metal regions so as to overlie corresponding projecting dielectric regions.

Abstract: In an embodiment, a circuit includes N sensing channels. Each channel includes a first main sensing node and a second redundancy sensing node paired therewith. N analog-to-digital converters (ADCs) are coupled to the first sensing nodes, with digital processing circuits coupled to the N ADCs. A pair of multiplexers are coupled to the second sensing nodes and to the N ADCs with a further ADC coupled to the output of the second multiplexer. An error checking circuit is coupled to the outputs of the second multiplexer and the further ADC to compare, at each time window in a sequence of N time windows, a first digital value and a second digital value resulting from conversion to digital of: an analog sensing signal at one of the first sensing nodes, and an analog sensing signal at the second sensing node paired with the selected one of the first sensing nodes.

Abstract: A microelectromechanical device includes a fixed structure defining a cavity with a tiltable structure that is elastically suspended in the cavity. A piezoelectrically driven actuation structure, interposed between the tiltable structure and the fixed structure, is biased for causing rotation of the tiltable structure about a first rotation axis belonging to a horizontal plane in which the tiltable structure rests. The actuation structure includes a pair of driving arms carry respective regions of piezoelectric material and are elastically coupled to the tiltable structure on opposite sides of the first rotation axis through respective elastic decoupling elements. The elastic decoupling elements exhibit stiffness in regard to movements out of the horizontal plane and compliance to torsion about the first rotation axis.

Abstract: An integrated circuit includes a reconfigurable stream switch and an arithmetic circuit. The stream switch, in operation, streams data. The arithmetic circuit has a plurality of inputs coupled to the reconfigurable stream switch. In operation, the arithmetic circuit generates an output according to AX+BY+C, where A, B and C are vector or scalar constants, and X and Y are data streams streamed to the arithmetic circuit through the reconfigurable stream switch.

Abstract: A device including a sensor is disclosed. In one embodiment, the sensor includes a thermal infrared sensor or a sensor based on CMOS-SOI-MEMS technology (also referred to as “TMOS”). The sensor is capable of performing at least two functions at the same time. The first is remote temperature measurement and the second is presence detection. The sensor passively collects infrared information and a microprocessor coupled to the sensor determines the temperature as well as presence.

Abstract: In an embodiment a circuit includes drive circuitry configured to be coupled to a control terminal of an electronic switch and configured to apply a discharge signal to the control terminal causing the electronic switch to become conductive and provide an electrical discharge path for an energized element, a sensing node configured to be coupled to the control terminal and configured to sense a voltage at the control terminal and a feedback network coupled between the sensing node and the drive circuitry, wherein the feedback network includes a comparator circuit coupled to the sensing node and configured to compare the voltage at the control terminal and sensed at the sensing node with a reference threshold and to provide a comparison signal having a first value and a second value, respectively, in response to the voltage at the control terminal being higher or lower than the reference threshold, and wherein the drive circuitry is configured to produce the discharge signal as a function of the comparison sig

Abstract: A thermally-isolated-metal-oxide-semiconducting (TMOS) sensor has inputs coupled to first and second nodes to receive first and second bias currents, and an output coupled to a third node. A tail has a first conduction terminal coupled to the third node and a second conduction terminal coupled to a reference voltage. A control circuit applies a control signal to a control terminal of the tail transistor based upon voltages at the first and second nodes so that a common mode voltage at the first and second nodes is equal to a reference common mode voltage. A differential current integrator has a first input terminal coupled to the second node and a second input terminal coupled to the first node, and provides an output voltage indicative of an integral of a difference between a first output current at the first input terminal and a second output current at the second input terminal.

Abstract: A MEMS tri-axial accelerometer is provided with a sensing structure having: a single inertial mass, with a main extension in a horizontal plane defined by a first horizontal axis and a second horizontal axis and internally defining a first window that traverses it throughout a thickness thereof along a vertical axis orthogonal to the horizontal plane; and a suspension structure, arranged within the window for elastically coupling the inertial mass to a single anchorage element, which is fixed with respect to a substrate and arranged within the window, so that the inertial mass is suspended above the substrate and is able to carry out, by the inertial effect, a first sensing movement, a second sensing movement, and a third sensing movement in respective sensing directions parallel to the first, second, and third horizontal axes following upon detection of a respective acceleration component.

Abstract: A system for detecting and evaluating environmental quantities and events is formed by a detection and evaluation device and a mobile phone, connected through a wireless connection. The device is enclosed in a containment casing housing a support carrying a plurality of inertial sensors and environmental sensors. A processing unit is coupled to the inertial sensors and to the environmental sensors. A wireless connection unit, is coupled to the processing unit and a wired connection port, is coupled to the processing unit. A programming connector is coupled to the processing unit and is configured to couple to an external programming unit to receive programming instructions of the processing unit. A storage structure is coupled to the processing unit and a power-supply unit supplied power in the detection and evaluation device. The mobile phone stores an application, which enables a basicuse mode, an expert use mode, and an advanced use mode.

Abstract: A method of controlling a half-bridge circuit includes receiving an analog feedback signal proportional to an output of the half-bridge circuit, comparing the received analog feedback signal with a threshold value, selecting a digital feedback signal based on a result of the comparing, comparing the digital feedback signal with a digital reference signal to generate a digital error signal, integrating the digital error signal to generate an integration error signal, downscaling the integral error signal to generate a downscaled integration signal, sampling the downscaled integration signal to generate a sampled integration signal, and generating pulsed signals from the sampled integration signal to provide an input to the half-bridge circuit.

Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.

Abstract: A semiconductor die is arranged on a substrate and an encapsulation of laser direct structuring (LDS) material is molded onto the semiconductor die. A through mold via (TMV) extends through the encapsulation. This TMV includes a collar section that extends through a first portion of the encapsulation from an outer surface to an intermediate level of the encapsulation, and a frusto-conical section that extends from a bottom of the collar section through a second portion of the encapsulation. The collar section has a first cross-sectional area at the intermediate level. The first end of the frusto-conical section has a second cross-section area at the intermediate level. The second cross-sectional area is smaller than the first cross-sectional area. The TMV can have an aspect ratio which is not limited to 1:1.

Abstract: In accordance with an embodiment, a system includes an oscillator equipped circuit having an oscillator control circuit configured to be coupled to an external oscillator and a processing unit comprising a clock controller. The clock controller includes an interface circuit configured to exchange handshake signals with the oscillator control circuit, a security circuit configured to receive the external oscillator clock signal and configured to select the external oscillator clock signal as the system clock, and a detection block configured to detect a failure in the external oscillator clock signal. Upon detection of the failure, a different clock signal is selected as the system clock and the interface circuit to interrupts a propagation of the external oscillator.

Abstract: A method for operating a differential memory includes: operating a main memory module differentially while executing a first program; copying first logic data from a first submodule of the main memory module to an auxiliary memory module; storing third logic data associated with a second program in a second submodule of the main memory module by overwriting second logic data associated with the first program, while maintaining the first logic data contained in the first submodule of the main memory module unaltered, where the second logic data are complementary to the first logic data; when a request for reading the first logic data is received during the storing of the third logic data in the second submodule of the main memory module, reading the first logic data from the auxiliary memory module; and executing the first or second programs by operating the main memory module in single-ended mode.

Abstract: A vehicle such as a motor car (V) equipped with a radio equipment (14) is provided with a rearview camera 5 (10). Video frames from the rearview camera (10) are received at the radio equipment (14) and transmitted to a mobile communication device (S) such as a smart phone equipped with a video screen (S1) so that video frames from the rearview camera (10) are displayed on the 10 video screen (S1) of the mobile communication device (S).

Abstract: Charge pump stages are coupled between flying capacitor pairs and arranged in a cascaded between a bottom voltage line and an output voltage line. Gain stages apply pump phase signals having a certain amplitude to the charge pump stages via the flying capacitors. A feedback signal path from the output voltage line to the bottom voltage line applies a feedback control signal to the bottom voltage line. Power supply for the gain stages is provided by a voltage of the feedback control signal in order to control the amplitude of the pump phase signals. An asynchronous logic circuit generates the switching drive signals for the gain stages with a certain switching frequency which is a function of a logic supply voltage derived from the voltage of the feedback control signal.

Abstract: In an embodiment, a digital output driver circuit comprises an output stage having first and second transistors. A drive stage is configured to drive control terminals of the first and second transistors and comprising switching circuitry and current generator circuitry. In a first configuration, the driver circuit is configured to connect a control terminal of the second transistor to the reference node to turn off the second transistor; and connect a first capacitance to the current generator circuitry and to a control terminal of the first transistor to turn on the first transistor. In a second configuration, the driver circuit is configured to turn off the first transistor and connect the control terminal of the second transistor to the current generator circuitry and to the second capacitance to turn on the second transistor.

Abstract: Embodiments of the present disclosure relate to a semiconductor package, a method of forming the package and an electronic device. For example, the semiconductor package may comprise a first substrate assembly comprising a first surface and a second surface opposite the first surface. The semiconductor package may also comprise one or more chips connected or coupled to the first surface of the first substrate assembly by a first thermally and electrically conductive connecting material. In addition, the semiconductor package further comprises a second substrate assembly comprising a third surface and a fourth surface opposite the third surface, the third surface and the first surface being arranged to face each other, and the third surface being connected to one or more chips by a second thermally and electrically conductive connecting material. At least one of the first surface and the third surface is shaped to have a stepped pattern to match a surface of the one or more chips.

Abstract: A digital-to-analog converter (DAC) includes a switching network and built-in-self-test (BIST) circuitry. The DAC, in operation, generates analog output signals in response to input codes of a set of input codes of the DAC. The BIST circuitry sequentially applies codes of a determined subset of codes of the set of input codes to test the plurality of switches. The determined subset of codes has fewer codes than the set of input codes. The BIST circuitry detects failures of switches of the plurality of switches based on responses of the DAC to the applied codes. In response to detecting a failure of a switch, the BIST generates a signal indicating a failure of the switching network.