Abstract: Semiconductor chips to be singulated to individual semiconductor devices are arranged onto respective adjacent areas of a mounting substrate such as a pre-molded leadframe. The mounting substrate is made of a laminar, electrically conductive sculptured structure with molded electrically insulating material. Electrically conductive side formations in the adjacent areas of the mounting substrate include first and second pads at front and back surfaces, respectively, of the mounting substrate. The first contact pads at the front surface of the substrate include narrowed portions having side recesses. The second contact pads at the back surface of the substrate include widened portions having side extensions adjacent the side recesses. The electrically insulating material extends into the side recesses to provide anchoring formations of the insulating material to the electrically conductive sculptured structure of the mounting substrate.

Abstract: Pre-molded leadframes for semiconductor devices are manufactured by molding electrically insulating material onto a laminar sculptured structure of electrically conductive material including semiconductor device component die pads. First and second die pads are coupled via a first extension from the first die pad and a second extension from the second die pad at neighboring locations on the front surface of the leadframe and a bridge formation coupling the first and second extensions at the bacpk surface of the leadframe. The bridge formation provides a sacrificial connection between the first and second extensions which is selectively removed after molding the electrically insulating material in order to decouple the first and second die pads from each other. The removal of the sacrificial connection leaves a cavity formed at the second surface of the leadframe without affecting the shape of the die pads.

Abstract: A uniform copper-tin compound layer is electrochemically deposited on a surface of a copper-based base structure. A tin-based film is then formed on the copper-tin compound layer. The uniform copper-tin compound layer provides a barrier that effectively inhibits tin whisker growth.

Abstract: A semiconductor chip is arranged on a first surface of a die pad in a substrate (leadframe) including an array of electrically conductive leads. An encapsulation of laser direct structuring (LDS) material encapsulates the substrate and the semiconductor chip. The encapsulation has a first surface, a second surface opposed to the first surface and a peripheral surface. The array of electrically conductive leads protrude from the peripheral surface with areas of the second surface of the encapsulation arranged between adjacent leads. LDS structured areas of the second surface located between adjacent leads in the array of electrically conductive leads provide a further array of electrically conductive leads exposed at the second surface. First and second electrically conductive vias extending through the encapsulation material as well as electrically conductive lines over the encapsulation material provide an electrical bonding pattern between the semiconductor chip and selected ones of the leads.

Abstract: An embodiment inertial measurement system includes: at least one motion sensor to output motion data with an output data rate (ODR) period; and a control unit coupled to the motion sensor to control operation thereof based on a power mode switching, according to which each ODR period includes: a first phase, in which the motion sensor is controlled in a condition of low power consumption; and a subsequent measurement phase, in which the motion sensor is controlled to perform measurements for generation of measurement data. The control unit adaptively adjusts the duration of the ODR period based on at least one check related to the measurement data generated during the measurement phase.

Abstract: An embodiment LED driver system comprises a power transistor configured to be selectively activated for generating a driving current for an array of LEDs, the power transistor having a first conduction terminal coupled to the array of LEDs and a second conduction terminal coupled to a reference resistor; an operational amplifier having a non-inverting input for receiving a reference voltage, an inverting input coupled to the second conduction terminal of the power transistor, and an output terminal coupled to a first conduction terminal of a transmission gate having a second conduction terminal coupled to a control terminal of the power transistor and a control terminal for receiving an enable signal; and a slew rate control unit configured to control the slew rate of the driving current.

Abstract: An integrated circuit includes a clock control circuit coupled to a reference clock signal node and a plurality of circuits including a voltage regulator, a digital circuit, and an analog circuit. The voltage regulator, in operation, supplies a regulated voltage. The clock control circuit, in operation, generates a system clock. Input/output interface circuitry is coupled to the plurality of circuits and a common input/output node. The input/output interface circuitry, in operation, selectively couples one of the plurality of circuits to the common input/output node.

Abstract: A microfluidic device for continuous ejection of fluids includes: a semiconductor body that laterally delimits chambers; an intermediate structure which forms membranes each delimiting a top of a corresponding chamber; and a nozzle body which overlies the intermediate structure. The device includes, for each chamber: a corresponding piezoelectric actuator; a supply channel which traverses the intermediate structure and communicates with the chamber; and a nozzle which traverses the nozzle body and communicates with the supply channel. Each actuator is configured to operate i) in a resting condition such that the pressure of a fluid within the corresponding chamber causes the fluid to pass through the supply channel and become ejected from the nozzle as a continuous stream, and ii) in an active condition, where it causes a deformation of the corresponding membrane and a consequent variation of the pressure of the fluid, causing a temporary interruption of the continuous stream.

Abstract: A method includes determining a number of drive pulses of equal width and amplitude that would drive LEDs with a total charge during a frame. If the width of the drive pulses is greater than a minimum-width and less than a maximum-width, the LEDs are driven with the drive pulses. If the width of the drive pulses is less than the minimum-width and an amplitude of the drive pulses is greater than a minimum-amplitude, decrement the amplitude of the drive pulses and recalculate the width of the drive pulses so each drive pulse has the decremented amplitude and recalculated width. If the amplitude of the drive pulses is equal to the minimum-amplitude, reduce the number of drive pulses and recalculate the width and amplitude of the reduced number of drive pulses. If the amplitude of the drive pulses is equal to the minimum-amplitude, the LEDs are not driven.

Abstract: An inertial structure is elastically coupled through a first elastic structure to a supporting structure so as to move along a sensing axis as a function of a quantity to be detected. The inertial structure includes first and second inertial masses which are elastically coupled together by a second elastic structure to enable movement of the second inertial mass along the sensing axis. The first elastic structure has a lower elastic constant than the second elastic structure so that, in presence of the quantity to be detected, the inertial structure moves in a sensing direction until the first inertial mass stops against a stop structure and the second elastic mass can move further in the sensing direction. Once the quantity to be detected ends, the second inertial mass moves in a direction opposite to the sensing direction and detaches the first inertial mass from the stop structure.

Abstract: An optical beam steering device and a method for beam steering are described. The optical beam steering device including: a laser source coupled to an optical phased array (OPA) The OPA includes: a beam splitter network optically coupled to the laser source and configured to split a laser beam generated by the laser source into N outputs to generate an output optical beam; a first network of first phase shifters configured to steer the output optical beam in a first direction away from a longitude direction; and a second network of second phase shifters configured to steer the output optical beam in a second direction away from the longitude direction, the second direction being opposite to the first direction.

Abstract: A manufacturing method of an electronic device includes: forming a drift layer of an N type; forming a trench in the drift layer; forming an edge-termination structure alongside the trench by implanting dopant species of a P type; and forming a depression region between the trench and the edge-termination structure by digging the drift layer. The steps of forming the depression region and the trench are carried out at the same time. The step of forming the depression region comprises patterning the drift layer to form a structural connection with the edge-termination structure having a first slope, and the step of forming the trench comprises etching the drift layer to define side walls of the trench, which have a second slope steeper than the first slope.

Abstract: A microelectromechanical gyroscope includes a support structure, a driving mass movable according to a driving axis; and an oscillating microelectromechanical loop. The microelectromechanical loop has a resonance frequency and a loop gain and includes the driving mass, a sensing interface that senses a position of the driving mass, and a gain control stage that maintains a modulus of the loop gain at a unitary value at the resonance frequency. The gain control stage includes a sampler and an transconductance operational amplifier in an open-loop configuration. The sampler acquires samples of a loop signal from the sensing interface in a first operative condition and transfers them to the transconductance operational amplifier in a second operative condition. The sampler decouples the transconductance operational amplifier from the sensing interface in the first operative condition and in the second operative condition.

Abstract: Data structure and microcontroller architecture performing binary multiply-accumulate operations using multiple partial copies of weights. Destination-register location, source-register location, and weight-register location are received. Using the weight-register location, a sub-set of the weight bits is copied a select number of times based on a filter index value that is received. Each copy of the sub-set of weights is executed in parallel. Using the source-register location, a sub-set of the input bits is selected based on the size of the sub-set of weights, wherein the sub-set of input bits is shifted one bit from a previous sub-set of input bits. XOR operation is performed on each corresponding bit in the copy of the sub-set of weights with each corresponding bit in the selected sub-set of input bits. In a corresponding destination sub-location, output of each XOR operation is aggregated with each other and with current value of the corresponding destination sub-location.

Abstract: A circuit includes an amplifier, a bias voltage node, and a first set of switches configured, based on a first reset signal having a first value, to couple first and second input nodes to the bias voltage node and to couple first and second output nodes of the amplifier. First and second feedback branches each include a respective RC network including a plurality of capacitances. The first and second feedback branches further include a second set of switches intermediate input nodes and the capacitances, and a third set of switches intermediate input nodes and the plurality of capacitances. These switches selectively couple the capacitances to the input nodes and output nodes, based on a second reset signal having a first value. The second reset signal keeps the first value for a determined time interval exceeding a time interval in which the first reset signal has the first value.

Abstract: The present disclosure is directed to at least one embodiment of a die including a sidewall having a uniform surface and an irregular surface. The uniform surface may be a scalloped surface and scallops of the scalloped surface are substantially the same size and shape relative to each other. The irregular surface has a more irregular texture as compared to the uniform surface. The irregular surface may include a plurality of randomly spaced high points and a plurality of randomly spaced low points that are between adjacent ones of the high points. In a method of manufacturing the die, a cavity is pre-formed in a substrate and a multilayer structure is formed on the substrate. The multilayer structure includes an active area that is aligned with and overlies the cavity. After the multilayer structure is formed, at least one recess is formed extending into the multilayer structure to the cavity.

Abstract: Encryption of data using a cryptographic device is protected. The protecting includes generating a first output of a first branch by encrypting a constant using a key, and generating a first output of a second branch by encrypting a constant using a key. The first output of the first branch, the first output of the second branch, and a first portion of plaintext data are XORed, generating a first portion of cypher text. A second output of the first branch is generated by encrypting the first output of the first branch using a key, and a second output of the second branch is generated by encrypting the first output of the second branch using a key. The second output of the first branch, the second output of the second branch, and a second portion of plaintext data are XORed, generating a second portion of cypher text.

Abstract: MEMS device formed in a semiconductor body which is monolithic and has a first and a second main surface. A buried cavity extends into the semiconductor body below and at a distance from the first main surface. A diaphragm extends between the buried cavity and the first main surface of the semiconductor body and has a buried face facing the buried cavity. A diaphragm insulating layer extends on the buried face of the diaphragm and a lateral insulating region extends into the semiconductor body along a closed line, between the first main surface and the diaphragm insulating layer, above the buried cavity. The lateral insulating region laterally delimits the diaphragm and forms, with the diaphragm insulating layer, a diaphragm insulating region which delimits the diaphragm and electrically insulates it from the rest of the wafer.

Abstract: System, method, and circuitry for utilizing sequential input inertial sensor data to calculate recursive features for training a machine learning algorithm or for classifying the data as a known class. The recursive feature values of a current data sample are calculating based on comparisons between the current data sample value and previous recursive feature values. The recursive features include a recursive maximum, recursive minimum, recursive peak to peak, recursive average, recursive root mean square, and recursive variance.

Abstract: An integrated electronic device including: a main body delimited by a front surface; a top conductive region extending within the main body, starting from the front surface; a first dielectric region extending on the front surface; and a barrier structure, arranged on the first dielectric region. A first aperture extends through the barrier structure and the first dielectric region; the first aperture is delimited at bottom by the top conductive region. The integrated electronic device further includes a contact structure including at least a first conductive region extending within the first aperture, in direct contact with the top conductive region and the barrier structure.