Abstract: Method of estimating a position variation of a motion of an apparatus between a first instant and a second instant, said motion including a rotation of the apparatus and said position variation, said position variation including a position and a velocity, wherein estimating said position variation comprises performing a particles filtering for estimating said position and velocity from the probabilistic-weighted average of the particles, said particles filter using a known estimation of said rotation and being parameterized for taking into account a quality of said rotation estimation.

Abstract: A method determines a movement of an apparatus between capturing first and second images. The method includes testing model hypotheses of the movement by for example a RANSAC algorithm, operating on a set of first points in the first image and assumed corresponding second points in the second image to deliver the best model hypothesis. The testing includes, for each first point, calculating a corresponding estimated point using the tested model hypothesis, determining the back-projection error between the estimated point and the second point in the second image, and comparing each back projection error with a threshold. The testing comprises for each first point, determining a correction term based on an estimation of the depth of the first point in the first image and an estimation of the movement between the first and second images, and determining the threshold associated with the first point by using said correction term.

Abstract: An ESD protection device includes a MOS transistor connected between a first terminal and a second terminal and having a gate region, source/drain region and a well region electrically coupled by a resistive-capacitive circuit configured to control turn on of the MOS transistor in response to an ESD event. The resistive-capacitive circuit has a common part with at least one of the source, gate or drain regions of the MOS transistor and includes a capacitive element and a resistive element. A first electrode of the capacitive element is formed by the resistive element and a second electrode of the capacitive element is formed by at least a portion of a semiconductor film within which the source/drain region is formed.

Abstract: Local variability of the grain size of work function metal, as well as its crystal orientation, induces a variable work function and local variability of transistor threshold voltage. If the metal nitride for the work function metal of the transistor gate is deposited using a radio frequency physical vapor deposition, equiaxed grains are produced. The substantially equiaxed structure for the metal nitride work function metal layer (such as with TiN) reduces local variability in threshold voltage.

Abstract: A color image sensor including an array of pixels is formed in a semiconductor layer having a back side that receives an illumination. Insulated conductive walls penetrate into the semiconductor layer from the back side and separate the pixels from one another. For each pixel, a color pixel penetrates into from 5 to 30% of a thickness of the semiconductor layer from the back side and occupies at least 90% of the surface area delimited by the walls. An electrically-conductive layer extends from the lateral wall of the filter all the way to the walls.

Abstract: Various embodiments provide an optimized image filter. The optimized image and video obtains an input image and selects a target pixel for modification. Difference values are then determined between the selected target pixel and each reference pixel of a search area. Subsequently, a weighting function is used to determine weight values for each of the reference pixels of the search area based on their respective difference value. The selected target pixel is then modified by the optimized image filter using the determined weight values. A new target pixel in an apply patch is then selected for modification. The new target pixel is modified using the previously determined weight values reassigned to a new set of reference pixels. The previously determined weight values are reassigned to the new set of reference pixels based on each of the new set of reference pixels' position relative to the new target pixel.

Abstract: A method of manufacturing a heat pipe, including the steps of: forming in a substrate a cylindrical opening provided with a plurality of ring-shaped recessed radially extending around a central axis of the opening; arranging in the recesses separate ring-shaped strips made of a material catalyzing the growth of carbon nanotubes; and growing carbon nanotubes in the opening from said ring-shaped strips.

Abstract: A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.

Abstract: An autocorrective writing to a multiport static random access memory device is performed on at least one multiport static random access memory cell circuit. A first datum is written to the multiport static random access memory cell circuit and a second datum stored in the circuit is read from the multiport static random access memory cell subsequent to writing. The first and second data are compared. In response to the results of that comparison, an operation to rewriting the first datum to the circuit along with application of a write assist mechanism is selectively performed.

Abstract: A synchronous retention flip-flop circuit includes a first circuit module powered by an interruptible power source and a second circuit module powered by a permanent power source. The first circuit module includes a first latch circuit and a second latch circuit which are configured to store at least one datum while the interruptible power source is supplying power. A transmission circuit operates to deliver the at least one datum to the second circuit module before an interruption of the interruptible power source. The second circuit module preserves the at least one datum during the interruption. Following an end of the interruption, a restoring circuit transfers the at least one datum from the second circuit module to the first circuit module via a single one of the first and second latch circuits.

Abstract: Electrostatic discharge (ESD) protection is provided by a circuit including a resistor having a first terminal and a second terminal, a zener diode having a cathode terminal directly connected to said first terminal and an anode terminal directly connected to a third terminal, and a clamp diode having a cathode terminal directly connected to said second terminal and an anode terminal directly connected to said third terminal.

Abstract: A reference clock signal of at least one module clock signal associated with each module is delivered. A measurement period is generated and a module whose consumption is to be determined is selected. The frequency of the at least one module clock signal associated with the selected module reduced during the measurement period. A measurement of a first consumption of the device is made in the measurement period. A measurement of a second consumption of the device is made outside the measurement period. The consumption of the selected module is determined from the first and measured first and second consumptions.

Abstract: A method is for making a photonic chip including EO devices having multiple thicknesses. The method may include forming a first semiconductor layer over a semiconductor film, forming a second semiconductor layer over the first semiconductor layer, and forming a mask layer over the second semiconductor layer. The method may include performing a first selective etching of the mask layer to provide initial alignment trenches, performing a second etching, aligned with some of the initial alignment trenches and using the first semiconductor layer as an etch stop, to provide multi-level trenches, and filling the multi-level trenches to make the EO devices having multiple thicknesses.

Abstract: In some embodiments, a phase locked loop includes a voltage-controlled oscillator whose output is fed back to a first input of a phase comparator via a fractional divider controlled by a delta-sigma modulator. The method of doubling the frequency of the initial reference signal of the phase locked loop involves generating, from the initial reference signal and the output signal furnished by the voltage-controlled oscillator, a secondary reference signal having edges of a first type synchronized with each of the rising and falling edges of the initial reference signal and edges of a second type between the edges of the first type, and a furnishing of the secondary reference signal at a second input of the phase comparator operating on the edges of the first type.

Abstract: A control method for real-time scene detection by a wireless communication apparatus equipped with at least one environmental measurement sensor is disclosed. A temporal adjustment of the instants of activation of the detection is based on measurement values delivered by the at least one environmental measurement sensor at instants of measurement.

Abstract: A substrate contact land for a first MOS transistor is produced in and on an active zone of a substrate of silicon on insulator type using a second MOS transistor without any PN junction that is also provided in the active zone. A contact land on at least one of a source or drain region of the second MOS transistor forms the substrate contact land.

Abstract: An electro-optic device may include a photonic chip having an optical grating coupler at a surface. The optical grating coupler may include a first semiconductor layer having a first base and first fingers extending outwardly from the first base. The optical grating coupler may include a second semiconductor layer having a second base and second fingers extending outwardly from the second base and being interdigitated with the first fingers to define semiconductor junction areas, with the first and second fingers having a non-uniform width. The electro-optic device may include a circuit coupled to the optical grating coupler and configured to bias the semiconductor junction areas and change one or more optical characteristics of the optical grating coupler.

Abstract: A communications device includes a transmission chain coupled to an antenna a receiver chain coupled to the antenna. The receiver chain includes an amplifier device having an input coupled to the antenna. A controlled switching circuit is included in the amplifier device and is operable to selectively disconnect conduction terminals of an amplifying transistor from power supply terminals when the transmission chain is operating to pass a transmit signal to the antenna.

Abstract: An attenuator having an impedance that is controllable by a first setpoint signal is coupled to a transmission line. A matching circuit having an impedance that is controllable by a second setpoint signal is also coupled to the transmission line. A transformer circuit block also coupled to the transmission line has a complex impedance. A control circuit sets the first and second setpoint signals so as to control a conjugate impedance relationship between the variable impedances presented by the attenuator and matching circuit relative to the complex impedance of the transformer circuit.

Abstract: An integrated electronic device includes a semiconductive film above a buried insulating layer that is situated above a supporting substrate. An active zone is delimited within the semiconductive film. A MOS transistor supported within the active zone includes a gate region situated above the active zone. The gate region includes a rectilinear part situated between source and drain regions. The gate region further includes a forked part extending from the rectilinear part. A raised semiconductive region situated above the active zone is positioned at least partly between portions of the forked part. A substrate contact for the transistor is electrically coupled to the raised semiconductive region.