Patents Assigned to STMICROELECTRONICS (TOURS)
  • Publication number: 20250132690
    Abstract: The present description concerns a converter comprising an AC-DC conversion stage comprising a first thyristor, a first power supply circuit delivering a first reference voltage between a first node and a second node, and a second power supply circuit delivering a second reference voltage between third and fourth nodes, the cathode of the first thyristor being coupled to the first node of the first power supply circuit by a first switch and being connected to the fourth node, the second power supply circuit comprising a first rectifying element coupled to the second node of the first power supply circuit and coupled to the third node.
    Type: Application
    Filed: November 27, 2024
    Publication date: April 24, 2025
    Applicant: STMICROELECTRONICS LTD
    Inventor: Laurent GONTHIER
  • Patent number: 12282612
    Abstract: The present disclosure is directed to a three-dimensional interactive display system. The system detects a position of a user (e.g., the user's finger or hand) or an optical emitter device, along three different dimensions. In a case where the system detects a position of a user's finger, the user wears a passive device having angled surfaces on his or her finger to improve detection of the user's finger. In a case where the system detects the optical emitter device, the user holds the optical emitter device or wears the optical emitter device similar to the passive device. The optical emitter device emits light, and the system tracks the optical emitting device by detecting the light emitted by the optical emitter device.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: April 22, 2025
    Assignee: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
    Inventor: Jeff M. Raynor
  • Patent number: 12284248
    Abstract: The present disclosure is directed to a device and method for generating and transmitting a TDM signal including both raw data and processed data. The device includes a sensor having a time division multiplexing (TDM) interface. The TDM interface transmits both raw data and processed data in a single TDM signal by reserving one or more slots inside a TDM frame for transmission of the processed data. The sensor also embeds additional information inside a data stream of raw data by repurposing one or more of values of the raw data as an exception code, flag, or another type of notification. The device is also enabled to transmit data, and disabled when not in use in order to conserve power.
    Type: Grant
    Filed: July 27, 2023
    Date of Patent: April 22, 2025
    Assignee: STMICROELECTRONICS S.rl.
    Inventors: Alessandra Maria Rizzo Piazza Roncoroni, Matteo Quartiroli, Paola Baldrighi
  • Patent number: 12284279
    Abstract: The present disclosure relates to a cryptographic method including the execution, by a cryptographic circuit, of an algorithm applied to a scalar in order to generate an output vector, of length L+n, which digits are d0, . . . , dL+n?1, the algorithm comprising iterations i, each iteration i taking an input data value, initially equal to said scalar and an input vector of length c, which digits are d?i, . . . , d?i+c?1, where for each j?{i, . . . , i+c?1}, the digit d?j is such that: d j ? = { d j ? if ? j < L d j - m ? otherwise .
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: April 22, 2025
    Assignee: STMICROELECTRONICS (ROUSSET) SAS
    Inventor: Guilhem Assael
  • Patent number: 12278174
    Abstract: A power semiconductor device including a first and second die, each including a plurality of conductive contact regions and a passivation region including a number of projecting dielectric regions and a number of windows. Adjacent windows are separated by a corresponding projecting dielectric region with each conductive contact region arranged within a corresponding window. A package of the surface mount type houses the first and second dice. The package includes a first bottom insulation multilayer and a second bottom insulation multilayer carrying, respectively, the first and second dice. A covering metal layer is arranged on top of the first and second dice and includes projecting metal regions extending into the windows to couple electrically with corresponding conductive contact regions. The covering metal layer moreover forms a number of cavities, which are interposed between the projecting metal regions so as to overlie corresponding projecting dielectric regions.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: April 15, 2025
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Cristiano Gianluca Stella, Agatino Minotti
  • Patent number: 12278673
    Abstract: An embodiment is a method including receiving, by a first device via a mesh communication network, a first broadcast message over a first communication channel, the first broadcast message having a first hop count, receiving, by the first device via the mesh communication network, a second broadcast message over the first communication channel, and determining, by the first device, whether the second broadcast message is a consistent broadcast message as the first broadcast message, the determining including determining, by the first device, whether the first broadcast message has a same originator address as the second broadcast message, and determining, by the first device, whether the second hop count is larger than the first hop count.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: April 15, 2025
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Matteo Varesio, Alessandro Lasciandare
  • Patent number: 12278283
    Abstract: An HEMT includes a semiconductor body, which includes a semiconductor heterostructure, and a conductive gate region. The gate region includes: a contact region, which is made of a first metal material and contacts the semiconductor body to form a Schottky junction; a barrier region, which is made of a second metal material and is set on the contact region; and a top region, which extends on the barrier region and is made of a third metal material, which has a resistivity lower than the resistivity of the first metal material. The HEMT moreover comprises a dielectric region, which includes at least one front dielectric subregion, which extends over the contact region, delimiting a front opening that gives out onto the contact region; and wherein the barrier region extends into the front opening and over at least part of the front dielectric subregion.
    Type: Grant
    Filed: September 28, 2023
    Date of Patent: April 15, 2025
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Ferdinando Iucolano, Cristina Tringali
  • Patent number: 12272922
    Abstract: Electronic device comprising a support substrate having a mounting face and an electronic chip having a rear face bonded on the mounting face by a volume of adhesive, wherein the support substrate comprises a plurality of wedging elements projecting from the mounting face so as to hold the chip bearing on contact areas of the wedging elements in a position substantially parallel to the mounting face of the support substrate.
    Type: Grant
    Filed: January 9, 2024
    Date of Patent: April 8, 2025
    Assignee: STMICROELECTRONICS (GRENOBLE 2) SAS
    Inventors: Fabien Quercia, Jean-Michel Riviere
  • Patent number: 12272509
    Abstract: Methods of operating a switching device are provided. The switching device is formed in an interconnect, the interconnect including a plurality of metallization levels, and has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: April 8, 2025
    Assignee: STMICROELECTRONICS (ROUSSET) SAS
    Inventors: Christian Rivero, Pascal Fornara, Antonio Di-Giacomo, Brice Arrazat
  • Publication number: 20250111876
    Abstract: Unclonable function circuitry includes a plurality of pairs of phase-change memory cells in a virgin state, and sensing circuitry coupled to the plurality of pairs of phase-change memory cells in the virgin state. The sensing circuitry identifies a subset of the plurality of pairs of phase-change memory cells in the virgin state based on a reliability mask. Signs of differences of effective resistance values of the identified subset of the plurality of pairs of phase-change memory cells in the virgin state are sensed by the sensing circuitry. The sensing circuitry generates a string of bits based on the sensed signs of differences in the effective resistance values of the identified subset of the plurality of pairs of phase-change memory cells in the virgin state. Processing circuitry coupled to the unclonable function circuitry, in operation, executes one or more operations using the generated string of bits.
    Type: Application
    Filed: December 12, 2024
    Publication date: April 3, 2025
    Applicants: STMICROELECTRONICS S.r.l., STMICROELECTRONICS (ROUSSET) SAS
    Inventors: Antonino CONTE, Francesco LA ROSA
  • Patent number: 12265199
    Abstract: A microelectromechanical weather pattern recognition system includes: at least one movement sensor, of a MEMS type, which generates a movement signal, in the presence and as a function of at least one weather pattern to be recognized; and a recognition circuitry, which is coupled to the movement sensor and which receives the movement signal; extracts given features of the movement signal; and perform processing operations, based on the given features of the movement signal, in order to recognize the weather pattern by executing at least one, appropriately trained, machine-learning algorithm.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: April 1, 2025
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Stefano Paolo Rivolta, Lorenzo Bracco, Roberto Mura, Federico Rizzardini
  • Patent number: 12267078
    Abstract: A device includes a local oscillator, an all-digital phase-locked loop, a digital signal generator, sampling circuitry, and an interface. The local oscillator generates a local clock signal. The all-digital phase locked loop generates a sampling control signal. The ADPLL includes a phase-error detector, a digital filter and a sigma-delta modulator. The phase detector generates a phase error signal based on a loop clock signal and a received reference signal. The digital filter generates a signal indicative of a frequency ratio between a frequency of the reference clock signal and the local clock frequency based on the phase error signal. The sigma-delta modulator generates a modulated signal based on the signal indicative of the frequency ratio. The sampling control signal is based on the modulated signal. The sampling circuitry samples digital signals generated by the digital signal generator at a sampling frequency, which is a function of the sampling control signal.
    Type: Grant
    Filed: July 14, 2023
    Date of Patent: April 1, 2025
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Matteo Quartiroli, Alessandro Mecchia, Paolo Pesenti
  • Patent number: 12267190
    Abstract: Various embodiments of the present disclosure disclose decoding techniques for mitigating data corruption due to duty cycle distortion, jitter, and other distortions to a digital signal. Decoding processes, apparatuses, and systems are provided that utilize a decoding framework for improving the accuracy of output bit streams generated from digital signals. An example process receives data indicative of a digital signal, generates a signal measurement for the digital signal that includes signal length descriptive between a two rising edges of a digital signal or two falling edges of the demodulated digital signal, and generates at least one portion of an output bit stream for the digital signal based at least in part on the signal measurement.
    Type: Grant
    Filed: April 24, 2024
    Date of Patent: April 1, 2025
    Assignee: STMICROELECTRONICS INTERNATIONAL N.V.
    Inventors: Iztok Bratuz, Vinko Kunc, Maksimiljan Stiglic
  • Patent number: 12266530
    Abstract: A manufacturing method of an anchorage element of a passivation layer, comprising: forming, in a semiconductor body made of SiC and at a distance from a top surface of the semiconductor body, a first implanted region having, along a first axis, a first maximum dimension; forming, in the semiconductor body, a second implanted region, which is superimposed to the first implanted region and has, along the first axis, a second maximum dimension smaller than the first maximum dimension; carrying out a process of thermal oxidation of the first implanted region and second implanted region to form an oxidized region; removing said oxidized region to form a cavity; and forming, on the top surface, the passivation layer protruding into the cavity to form said anchorage element fixing the passivation layer to the semiconductor body.
    Type: Grant
    Filed: December 22, 2023
    Date of Patent: April 1, 2025
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Simone Rascuna', Mario Giuseppe Saggio
  • Patent number: 12266636
    Abstract: The present disclosure is directed to a package that includes a plurality of die that are stacked on each other. The plurality of die are within a first resin and conductive layer is on the first resin. The conductive layer is coupled between ones of first conductive vias extending into the first resin to corresponding ones of the plurality of die. The conductive layer and the first conductive vias couple ones of the plurality of die to each other. A second conductive via extends into the first resin to a contact pad of the substrate, and the conductive layer is coupled to the second conductive via coupling ones of the plurality of die to the contact pad of the substrate. A second resin is on and covers the first resin and the conductive layer on the first resin. In some embodiments, the first resin includes a plurality of steps (e.g., a stepped structure). In some embodiments, the first resin includes inclined surfaces (e.g., sloped surfaces).
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: April 1, 2025
    Assignee: STMICROELECTRONICS PTE LTD
    Inventor: Jing-En Luan
  • Patent number: 12259760
    Abstract: The present disclosure is directed to a device and method for lid angle detection that is accurate even if the device is activated in an upright position. While the device is in a sleep state, first and second sensor units measure acceleration and angular velocity, and calculate orientations of respective lid components based on the acceleration and angular velocity measurements. Upon the device exiting the sleep state, a processor estimates the lid angle using the calculated orientations, sets the estimated lid angle as an initial lid angle, and updates the initial lid angle using, for example, two accelerometers; two accelerometers and two gyroscopes; two accelerometers and two magnetometers; or two accelerometers, two gyroscopes, and two magnetometers.
    Type: Grant
    Filed: March 14, 2023
    Date of Patent: March 25, 2025
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Federico Rizzardini, Lorenzo Bracco
  • Patent number: 12260910
    Abstract: The present disclosure is directed to a sense amplifier architecture for a memory device having a plurality of memory cells. Groups of non-volatile memory cells store respective codewords formed by stored logic states, logic high or logic low, of the memory cells of the group. The sense amplifier architecture has a plurality of sense amplifier reading branches, each sense amplifier reading branch coupled to a respective memory cell and configured to provide an output signal, which is indicative of a cell current flowing through the same memory cell; a comparison stage, to perform a comparison between the cell currents of memory cells of a group; and a logic stage, to determine, based on comparison results provided by the comparison stage, a read codeword corresponding to the group of memory cells.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: March 25, 2025
    Assignee: STMICROELECTRONICS S.r.l.
    Inventors: Fabio Enrico Carlo Disegni, Marcella Carissimi, Alessandro Tomasoni, Daniele Lo Iacono
  • Patent number: 12262649
    Abstract: The present description concerns a device including phase-change memory cells, each memory cell including a first resistive element in lateral contact with a second element made of a phase-change material.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: March 25, 2025
    Assignee: STMICROELECTRONICS (ROUSSET) SAS
    Inventor: Philippe Boivin
  • Patent number: 12259273
    Abstract: The present disclosure relates to a sensor having pixels, each pixel having photodiodes having each a terminal coupled to a first node associated with the photodiode; and an amplifier having a first part and, for each photodiode, a second part associated with the photodiode. The first part includes an output of the amplifier and a first MOS transistor of a differential pair. Each second part includes a second MOS transistor of the differential pair having its gate coupled to the first node associated with the photodiode the second part is associated with; a first switch coupling a source of the second transistor to the first part of the amplifier; and a second switch coupling a drain of the second transistor to the first part of the amplifier.
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: March 25, 2025
    Assignees: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED, STMicroelectronics (Grenoble 2) SAS
    Inventors: Jeffrey M. Raynor, Nicolas Moeneclaey
  • Patent number: 12261059
    Abstract: The present description concerns a method of manufacturing a device comprising at least one radio frequency component on a semiconductor substrate comprising: a) a laser anneal of a first thickness of the substrate on the upper surface side of the substrate; b) the forming of an insulating layer on the upper surface of the substrate; and c) the forming of said at least one radio frequency component on the insulating layer.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: March 25, 2025
    Assignee: STMICROELECTRONICS (TOURS) SAS
    Inventor: Patrick Hauttecoeur