Abstract: An integrated MOSFET device is formed in a body of silicon carbide and with a first type of conductivity. The body accommodates a first body region, with a second type of conductivity; a JFET region adjacent to the first body region; a first source region, with the first type of conductivity, extending into the interior of the first body region; an implanted structure, with the second type of conductivity, extending into the interior of the JFET region. An isolated gate structure lies partially over the first body region, the first source region and the JFET region. A first metallization layer extends over the first surface and forms, in direct contact with the implanted structure and with the JFET region, a JBS diode.

Abstract: In an embodiment, a device comprises a memory, which, in operation, stores data samples associated with a plurality of data sensors, and circuitry, coupled to the memory, wherein the circuitry, in operation, generates synchronized output data sets associated with the plurality of data sensors. Generating a synchronized output data set includes: determining a reference sample associated with a sensor of the plurality of sensors; verifying a timing validity of a data sample associated with another sensor of the plurality of sensors; identifying a closest-in-time data sample associated with the another sensor of the plurality of sensors with respect to the reference sample; and generating the synchronized output data set based on interpolation.

Abstract: A driving circuit is implemented for a driving resonator stage of a MEMS gyroscope including at least a first and a second electrode and a movable mass The driving circuit includes a synchronization stage which receives an electrical position signal indicative of the position of the movable mass and generates a reference signal phase- and frequency-locked with the electrical position signal; a driving stage which generates, on the basis of the reference signal, a first and a second driving signal, which are applied to the first and, respectively, the second electrodes, so that the movable mass is subject to a first and a second electrostatic force which cause the movable mass to oscillate.

Abstract: The MEMS device has: a sensor body having a functional structure configured to transduce a physical or chemical quantity into a corresponding electrical quantity; and a cap bonded to the sensor body and having a first cavity overlying the functional structure. The cap has a supporting portion and a cover portion that form the first cavity. The supporting portion is bonded to the sensor body. The cover portion is bonded to the supporting portion and has an inner wall delimiting on a side the first cavity and facing the functional structure. The MEMS device further has a first coating that extends within the first cavity on the inner wall of the cover portion.

Abstract: Tray for containing electronic components formed by a bearing body, substantially planar, having a first and a second face. First holding structures extend from the first face of the bearing body and second holding structures extend from the second face of the bearing body. Each second holding structure is aligned with a respective first holding structure in a vertical direction perpendicular to the first and the second faces of the bearing body. Each first holding structure is formed by first protrusions mutually spaced by first spaces and arranged along a first closed line; each second holding structure is formed by second protrusions mutually spaced by second spaces and arranged along a second closed line. Each second protrusion is aligned, in parallel with the vertical direction, with the first spaces and each first protrusion is aligned, in parallel with the vertical direction, with the second spaces.

Abstract: A frequency modulation MEMS triaxial gyroscope, having two mobile masses; a first and a second driving body coupled to the mobile masses through elastic elements rigid in a first direction and compliant in a second direction transverse to the first direction; and a third and a fourth driving body coupled to the mobile masses through elastic elements rigid in the second direction and compliant in the first direction. A first and a second driving element are coupled to the first and second driving bodies for causing the mobile masses to translate in the first direction in phase opposition. A third and a fourth driving element are coupled to the third and fourth driving bodies for causing the mobile masses to translate in the second direction and in phase opposition. An out-of-plane driving element is coupled to the first and second mobile masses for causing a translation in a third direction, in phase opposition.

Abstract: A packaged semiconductor device includes a substrate having a first surface and a second surface opposite the first surface. At least one semiconductor die is mounted at the first surface of the substrate. Electrically-conductive leads are arranged around the substrate, and electrically-conductive formations couple the at least one semiconductor die to selected leads of the electrically-conductive leads. A package molding material is molded onto the at least one semiconductor die, onto the electrically-conductive leads and onto the electrically-conductive formations. The package molding material leaves the second surface of the substrate uncovered by the package molding material. The substrate is formed by a layer of electrically-insulating material.

Abstract: System, method, and circuitry for generating a linker model for use by a toolchain associated with a programmable computing device. One or more regions in the memory resources available to the programmable computing devices is defined for used by an application executing on the programmable computing device. One or more sections is defined for those regions for use by the application. Resource boundaries are generated for the application based on the defined regions and the defined sections. A user is enabled to modify the defined regions or the defined sections or the generated resource boundaries. A linker model is then generated based on the available memory resources, the defined regions, the defined sections, and the generated resource boundaries. This linker model is then utilized to generate a linker script for the programmable computing device based the linker syntax compatible with a toolchain linker for the programmable computing device.

Abstract: Disclosed herein is a debug system including a host computer, a microcontroller, and a debug probe for interface therebetween for performing debug trace operations. The debug probe samples the current drawn by the microcontroller. The debug probe and host computer cooperate so as to acquire and accurately align trace data and the samples of the current drawn by the microcontroller. Techniques for performing this alignment are described herein and enable for accurate inferences to be drawn about the current drawn by the microcontroller during different program operations.

Abstract: In an embodiment, a method for controlling a synchronous rectifier (SR) transistor of a flyback converter includes: determining a first voltage across conduction terminals of the SR transistor; asserting a turn-on signal when a body diode of the SR transistor is conducting current; asserting a turn-off signal when current flowing through the conduction terminals of the SR transistor decreases below a first threshold; generating a gating signal based on an output voltage of the flyback converter and on the first voltage; turning on the SR transistor based on the turn-on signal and on the gating signal; and turning off the SR transistor based on the turn-off signal.

Abstract: A bridge rectifier and associated control circuitry collectively form a “regtifier” which rectifies an input time varying voltage and regulates the rectified output voltage produced without the use of a traditional voltage regulator. To accomplish this, the gate voltages of transistors of the bridge rectifier that are on during a given phase may be modulated via analog control (to increase the on-resistance of those transistors) or via pulse width modulation (to turn off those transistors prior to the end of the phase). The transistors of the bridge rectifier that would otherwise be off during a given phase may be turned on to help dissipate excess power and thereby regulate the output voltage. This modulation is based upon both a voltage feedback signal and a current feedback signal.

Abstract: A memory array includes memory cells forming a data word location accessed in response to a word line signal. A data sensing circuit configured to sense data on bit lines associated with the memory cells. The sensed data corresponds to a current data word stored at the data word location. A data latching circuit latches the sensed data for the current data word from the data sensing circuit. A data modification circuit then performs a mathematical modify operation on the current data word to generate a modified data word. The modified data word is then applied by a data writing circuit to the bit lines for writing back to the memory cells of the memory array at the data word location. The operations are advantageously performed within a single clock cycle.

Abstract: An embodiment sensor includes a hybrid waveguide. The hybrid waveguide includes a first dielectric optical waveguide lying on and in contact with a dielectric support layer; a first surface waveguide optically coupled to the first dielectric optical waveguide, parallel to the first dielectric optical waveguide, and lying on the dielectric support layer. The first surface waveguide has a lateral surface configured to guide a surface mode. The hybrid waveguide includes a cavity intended to be filled with a dielectric fluid, separating laterally the first dielectric optical waveguide from the lateral surface of the first surface waveguide.

Abstract: A system basis chip is described. The system basis chip comprises a power supply circuit configured to receive an input voltage and generate a plurality of voltages, and a control circuit. Specifically, the power supply circuit is configured to selectively switch on a first and a second voltage of the voltages as a function of a control signal. The control circuit measures a resistance value of an external resistor connected to a terminal and selects one of a plurality of configurations as a function of the measured resistance value, wherein a first configuration indicates that said first voltage should be switched on before said second voltage and a second configuration indicates that said second voltage should be switched on before said first voltage. Accordingly, the control circuit may generate the control signal in order to switch on in sequence the first and the second voltage according to the selected configuration.

Abstract: A sensor includes pixels supported by a substrate doped with a first conductivity type. Each pixel includes a portion of the substrate delimited by a vertical insulation structure with an image sensing assembly and a depth sensing assembly. The image sensing assembly includes a first region of the substrate more heavily doped with the first conductivity type and a first vertical transfer gate completely laterally surrounding the first region. Each of the depth sensing assemblies includes a second region of the substrate more heavily doped with the first conductivity type a second vertical transfer gate opposite a corresponding portion of the first vertical transfer gate. The second region is arranged between the second vertical transfer gate and the corresponding portion of the first vertical transfer gate.

Abstract: A MEMS inertial sensor includes a supporting structure and an inertial structure. The inertial structure includes at least one inertial mass, an elastic structure, and a stopper structure. The elastic structure is mechanically coupled to the inertial mass and to the supporting structure so as to enable a movement of the inertial mass in a direction parallel to a first direction, when the supporting structure is subjected to an acceleration parallel to the first direction. The stopper structure is fixed with respect to the supporting structure and includes at least one primary stopper element and one secondary stopper element. If the acceleration exceeds a first threshold value, the inertial mass abuts against the primary stopper element and subsequently rotates about an axis of rotation defined by the primary stopper element. If the acceleration exceeds a second threshold value, rotation of the inertial mass terminates when the inertial mass abuts against the secondary stopper element.

Abstract: The present description concerns an integrated circuit including, between first and second terminals having a first voltage applied therebetween, a load configured to execute instructions, a circuit for delivering a digital signal having at least two bits from a binary signal and a current output digital-to-analog converter controlled by the digital signal and coupled between the first and second terminals in parallel with the load.

Abstract: An electronic device such as an e-fuse includes analog circuitry configured to be set to one or more self-test configurations. To that effect the device has self-test controller circuitry in turn including: an analog configuration and sensing circuit configured to set the analog circuitry to one or more self-test configurations and to sense test signals occurring in the analog circuitry set to such self-test configurations, a data acquisition circuit configured to acquire and convert to digital the test signals sensed at the analog sensing circuit, and a fault event detection circuit configured to check the test signals converted to digital against reference parameters. The device includes integrated therein a self-test controller configured to control parts or stages of the device to configure circuits, acquire data and control test execution under the coordination of a test sequencer.

Abstract: A bridge rectifier is controlled by control circuitry to act a “regtifier” which both regulates and rectifies without the use of a traditional voltage regulator. To accomplish this, the gate voltages of transistors of the bridge that are on during a given phase may be modulated to dissipate excess power. Gate voltages of transistors of the bridge that are off during the given phase may alternatively or additionally be modulated to dissipate excess power. The regtifier may act as two half-bridges that each power a different voltage converter, with those voltage converters powering a battery. The voltage converters may be switched capacitor voltage converters that switch synchronously with switching of the two half-bridges as they perform rectification.

Abstract: An integrated circuit includes a continuous time delta sigma analog-to-digital converter (CTDS ADC) and a test circuit for testing the CTDS ADC. The test circuit converts multibit digital reference data to a single-bit digital stream. The test circuit then passes the single-bit digital stream to a finite impulse response digital-to-analog converter (FIR DAC). The FIR DAC converts the single-bit digital stream to an analog test signal. The analog test signal is then passed to the CTDS ADC. The CTDS ADC converts the analog test signal to digital test data. The test circuit analyzes the digital test data to determine the accuracy of the CTDS ADC.