Abstract: An in-memory computation device includes a word line activation circuit that receives an input signal indicative of input values and provides activation signals each as a function of the input value. The in-memory computation device further includes a memory array, a biasing circuit generating a bias voltage and a digital detector. The memory array has memory cells coupled to a bit line and each to a word line. Each memory cell stores a computational weight. In response to an activation signal, a cell current flows through each memory cell as a function of the bias voltage, the activation signal and the computational weight. A bit line current flows through the bit line as a function of a summation of the cell currents. The digital detector is coupled to the bit line, samples the bit line current and, in response, provides an output signal.

Abstract: A method and apparatus for adaptive rectification for preventing current inversion in motor windings are provided. In the method and apparatus, first and second half bridges of a plurality of half bridges are operated to synchronously rectify and permit passage of current, through the windings of the motor, in a first direction. A change of direction of the current from the first direction to a second direction opposite the first direction is detected. In response to detecting that the current changed direction to the second direction, the first and second half bridges of the plurality of half bridges are operated to quasi-synchronously rectify and block passage of the current through the windings in the second direction.

Abstract: The present disclosure relates to a circuit for testing a random number generator adapted to delivering a series of random bits and comprising at least one test unit configured to detect a defect in the series of random bits, said test circuit being adapted to verifying whether, after the detection of a first defect by the test unit, the number of random bits, generated by the random number generator without the detection of a second defect by said unit test, is smaller than a first threshold.

Abstract: A control circuit for a multiphase buck converter includes a regulator circuit and a plurality of phase control circuits. The regulator circuit generates a regulation signal based on a feedback signal and a reference signal, and each phase control circuit receives a current sense signal and generates a respective PWM signal based on the respective current sense signal and the regulation signal. The control circuit includes a first selector circuit and a second selector circuit configured to receive a selection signal and selectively connect each phase control circuit of a subset of the phase control circuits to a PWM signal for driving a respective stage of the multiphase buck converter, and to a current sense signal provided by the respective stage of the multiphase buck converter. A selection control circuit generates the selection signal in order to connect the phase control circuits to different stages of the multiphase buck converter.

Abstract: A method of manufacturing a redistribution layer includes: forming an insulating layer on a wafer, delimited by a top surface and a bottom surface in contact with the wafer; forming a conductive body above the top surface of the insulating layer; forming a first coating region extending around and above the conductive body, in contact with the conductive body, and in contact with the top surface of the insulating layer in correspondence of a bottom surface of the first coating region; applying a thermal treatment to the wafer in order to modify a residual stress of the first coating region, forming a gap between the bottom surface of the first coating region and the top surface of the insulating layer; forming, after applying the thermal treatment, a second coating region extending around and above the first coating region, filling said gap and completely sealing the first coating region.

Abstract: An analysis unit formed by an analysis body housing an analysis chamber and having a sample inlet and a supply channel configured to fluidically connect the sample inlet to the analysis chamber. Dried assay reagents are arranged in the analysis chamber and are contained in an alveolar mass. For instance, the alveolar mass is a lyophilized mass formed by excipients and by assay-specific reagents.

Abstract: A semiconductor product includes a layer of semiconductor die package molding material embedding a semiconductor die having a front surface and an array of electrically-conductive bodies such as spheres or balls around the semiconductor die. The electrically-conductive bodies have front end portions around the front surface of the semiconductor die and back end portions protruding from the layer of semiconductor die package molding material. Electrically-conductive formations are provided between the front surface of the semiconductor die and front end portions of the electrically-conductive bodies left uncovered by the package molding material. Light-permeable sealing material can be provided at electrically-conductive formations to facilitate inspecting the electrically-conductive formations via visual inspection through the light-permeable sealing material.

Abstract: A photonic system includes a first photonic circuit having a first face and a second photonic circuit having a second face. The first photonic circuit comprises first wave guides, and, for each first wave guide, a second wave guide covering the first wave guide, the second wave guides being in contact with the first face and placed between the first face and the second face, the first wave guides being located on the side of the first face opposite the second wave guides. The second photonic circuit comprises, for each second wave guide, a third wave guide covering the second wave guide. The first photonic circuit comprises first positioning devices projecting from the first face and the second photonic circuit comprises second positioning devices projecting from the second face, at least one of the first positioning devices abutting one of the second positioning devices in a first direction.

Abstract: A first electronic component, such as a sensor having opposed first and second surfaces and a first thickness, is arranged on a support member with the second surface facing towards the support member. A second electronic component, such as an integrated circuit mounted on a substrate and having a second thickness less than the first thickness, is arranged on the support member with a substrate surface opposed the second electronic component facing towards the support member. A package molding material is molded onto the support member to encapsulate the second electronic component while leaving exposed the first surface of the first electronic component. The support member is then removed to expose the second surface of the first electronic component and the substrate surface of the substrate.

Abstract: In an embodiment a processing system includes a test circuit configured to set an address value, an upper address limit and a lower address limit to a given reference bit sequence, verify whether the upper-limit comparison signal has a respective third logic level and/or whether the lower-limit comparison signal has the respective third logic level, assert an error signal in response to determining that the upper-limit comparison signal does not have the respective third logic level or the lower-limit comparison signal does not have the respective third logic level, repeat a certain operation for each of the N bits.

Abstract: An integrated circuit includes a semiconductor substrate, a conductive layer above a front face of the substrate, a first metal track in a first metal level, and a pre-metal dielectric region located between the conductive layer and the first metal level. A metal-insulator-metal-type capacitive structure is located in a trench within the pre-metal dielectric region. The capacitive structure includes a first metal layer electrically connected with the conductive layer, a second metal layer electrically connected with the first metal track, and a dielectric layer between the first metal layer and the second metal layer.

Abstract: Disclosed herein is a method of operating a system in a test mode. When the test mode is an ATPG test mode, the method includes beginning stuck-at testing by setting a scan control signal to a logic one, setting a transition mode signal to a logic 0, and initializing FIFO buffer for ATPG test mode. The FIFO buffer is initialized for ATPG test mode by setting a scan reset signal to a logic 0 to place a write data register and a read data register associated with the FIFO buffer into a reset state, enabling latches of the FIFO buffer using an external enable signal, removing the external enable signal to cause the latches to latch, and setting the scan reset signal to a logic 1 to release the write data register and the read data register from the reset state, while not clocking the write data register.

Abstract: In accordance with embodiments, methods and systems for utilizing multiple threshold checkers are provided. A range sensor collects measurement data. The range sensor examines the measurement data based on multiple threshold checkers to determine satisfaction of a trigger condition. In response to the satisfaction of the trigger condition, the range sensor provides the measurement data to a host computing device of the range sensor.

Abstract: System, method, and circuitry for utilizing a synchronization message to create fixed transmission windows for multiple priority data in half-duplex communication systems. A first computing device includes a first master controller and a first slave radio, and a second computing device includes a second slave controller and a second master radio. The first controller and the second radio may share a transmit mode during a transmission window, and the first radio and the second controller radio may share a receive mode during that same transmission window, which are defined by the synchronization message. The first controller can transmit outbound data to the first radio, the second radio can transmit outbound data to the second controller, and the second radio can transmit inbound data to the first radio during this transmission window.

Abstract: The present disclosure is directed to transducer assemblies or device in which one or more buried cavities are present within a substrate and define or form one or more membranes along a surface of the substrate. One or more piezoelectric actuators are formed on the one or more membranes and the one or more piezoelectric actuators drive the membranes at an operating frequency with an operating bandwidth of the transducer assemblies. Each of the one or more membranes is anchored at respective portions to a main body portion of the substrate to provide robust and strong anchoring of each of the one or more membranes to push unwanted flexure modes outside the operating bandwidth of the transducer assemblies.

Abstract: An image sensor includes photodetection pixels formed inside and on top of a semiconductor substrate. An interconnection network coats a surface of the semiconductor substrate. The interconnection network includes a level of conductive vias in contact, by their lower surface, with the photodetection pixels. The conductive vias are made of doped polysilicon and have a heavier doping on their lower surface side than on their upper surface side.

Abstract: A power device for surface mounting has a leadframe including a die-attach support and at least one first lead and one second lead. A die, of semiconductor material, is bonded to the die-attach support, and a package, of insulating material and parallelepipedal shape, surrounds the die and at least in part the die-attach support and has a package height. The first and second leads have outer portions extending outside the package, from two opposite lateral surfaces of the package. The outer portions of the leads have lead heights greater than the package height, extend throughout the height of the package, and have respective portions projecting from the first base.

Abstract: An integrated circuit temperature sensor includes two diode-connected bipolar transistors having different sizes. A switching circuit selectively applies the base-emitter voltages generated across the two diode-connected bipolar transistors to the input of a buffer circuit. A control unit controls alternate switching by the switching circuit. An analog-to-digital converter has an input connected to an output of the buffer circuit. The analog-to-digital converter calculates a numeric value corresponding to a difference between the voltages generated across the two diode-connected bipolar transistors, this difference in voltages being proportional to absolute temperature.

Abstract: A manufacturing method of an anchorage element of a passivation layer, comprising: forming, in a semiconductor body made of SiC and at a distance from a top surface of the semiconductor body, a first implanted region having, along a first axis, a first maximum dimension; forming, in the semiconductor body, a second implanted region, which is superimposed to the first implanted region and has, along the first axis, a second maximum dimension smaller than the first maximum dimension; carrying out a process of thermal oxidation of the first implanted region and second implanted region to form an oxidized region; removing said oxidized region to form a cavity; and forming, on the top surface, the passivation layer protruding into the cavity to form said anchorage element fixing the passivation layer to the semiconductor body.

Abstract: A display includes a display panel and a circuit. The circuit controls the display panel according to at least one control mode such as a pulse width modulation control mode. A method for determining a state of the display includes: acquiring samples from a channel of an ambient light sensor disposed below the display panel; supplying the samples to a processing circuit; detecting, by the processing circuit and based on said samples, whether the display panel is controlled in pulse width modulation; and following detecting the pulse width modulation control mode, calculating by the processing circuit a duty cycle from the samples.