Abstract: To address a desire to run 3D applications based on the OpenGL standard on OpenGL|ES mobile devices such as cellular telephones, one must be able to translate function calls between OpenGL and OpenGL|ES. In supporting this translation, and so as to ensure proper data state for the continued execution of the OpenGL application, global GL states which might be changed by an OpenGL|ES function used during translation are stored. The OpenGL to OpenGL|ES translation is then effectuated by substituting appropriate OpenGL|ES commands for OpenGL commands, and passing OpenGL|ES APIs for OpenGL|ES implementation. Thereafter, the global GL states which were previously saved are restored such that the performed translation does not adversely impact continued execution of the OpenGL configured application. This translation process supports OpenGL to OpenGL|ES translation with respect to a number of OpenGL APIs as well as some known extensions.

Abstract: A circuit comprises a frequency divider configured to receive an oscillating signal generated by an oscillator and to divide the oscillating signal into a clock signal, wherein the division ratio of the frequency divider is set to a value equal to one of: the integer part of the resonant frequency of the oscillator and the integer part of the resonant frequency of the oscillator plus 1. The circuit further comprises a control element which switchable connects or disconnects a calibration element to alter the frequency of the oscillation signal input to the frequency divider based on a number of oscillations that have transpired in the oscillating signal.

Abstract: A process for manufacturing a MEMS device, wherein a bottom silicon region is formed on a substrate and on an insulating layer; a sacrificial region of dielectric is formed on the bottom region; a membrane region, of semiconductor material, is epitaxially grown on the sacrificial region; the membrane region is dug down to the sacrificial region so as to form through apertures; the side wall and the bottom of the apertures are completely coated in a conformal way with a porous material layer; at least one portion of the sacrificial region is selectively removed through the porous material layer and forms a cavity; and the apertures are filled with filling material so as to form a monolithic membrane suspended above the cavity. Other embodiments are directed to MEMS devices and pressure sensors.

Abstract: An integrated MEMS structure includes a driving assembly anchored to a substrate and actuated with a driving movement. A pair of sensing masses suspended above the substrate and coupled to the driving assembly via elastic elements is fixed in the driving movement and performs a movement along a first direction of detection, in response to an external stress. A coupling assembly couples the pair of sensing masses mechanically to couple the vibration modes. The coupling assembly is formed by a rigid element, which connects the sensing masses and has a point of constraint in an intermediate position between the sensing masses, and elastic coupling elements for coupling the rigid element to the sensing masses to present a first stiffness to a movement in phase-opposition and a second stiffness, greater than the first, to a movement in phase, of the sensing masses along the direction of detection.

Abstract: A switch for switching video signals in a set top box between a first interface for connecting the set top box to a television, a second interface for connecting the set top box to a video playback device, and decoding circuitry for decoding a video stream, the set top box including a processor having a low power mode in which the decoding circuitry is inactive, the switch including detection circuitry arranged to detect, while the processor is in the low power mode, activity on a video input line of one of the first and second interfaces, and arranged to output an activation signal to switching circuitry in the switch to activate a loop through between the first and second interfaces when activity is detected.

Abstract: A package includes a die and at least one further die. The die has an interface configured to receive a transaction request from the further die via an interconnect and to transmit a response to the transaction request to said further die via the interconnect. The die also has mapping circuitry which is configured to allocate to the received transaction a local source identity information as source identity information, the local source identity information comprising one of a set of reusable local source identity information. This ensures the order of transactions tagged with a same original source identity and target and allows transactions tagged with different source identifiers to be processed out of order.

Abstract: A capacitance-to-digital converter for an extended range of capacitances includes a reference capacitor and one or more offset capacitors. Electrical charge accumulated in the offset capacitors is used to at least partially cancel the charge accumulated in a sensed capacitance to facilitate matching with a charge accumulated in the reference capacitor. The residual charge is passed to an integrator, the output from which is quantized and used to control switching of the capacitors. Immunity to tonal external noises and improved conversion speed are achieved by controlling the capacitor switching with a spread spectrum clock. The capacitance-to-digital converter may be used, for example, for sensing of the capacitances of capacitive elements in touch and proximity displays or other user interfaces.

Abstract: An oscillator circuit including a first capacitor provided with a first terminal; a resistor provided with a reference terminal; a first current generator provided with a connection terminal; a second current generator provided with a second connection terminal. Further, the circuit includes a switching matrix between the first and second generators and resistor and the at least one first capacitor.

Abstract: A method for searching a digital transmission having unknown carrier and symbol frequencies in a modulated reception signal, includes performing successive trials of several carrier and symbol frequencies, using decreasing values of the symbol frequency, demodulating the reception signal with the tried carrier frequency, filtering the demodulated signal in a band having a width corresponding to the currently tried symbol frequency, and producing samples of the filtered signal. For each currently tried symbol frequency, forming a complex indicator having a real component and an imaginary component established from the successive samples of the filtered signal such that they have cyclostationary properties and that one of the components tends to cancel when the other component tends towards a relative maximum, building the spectrum of the variation of the complex indicator, searching for a singular spike in the spectrum, and determining the real symbol frequency from the frequency of the spike.

Abstract: The method for improving the visual perception of a digital image may comprise dividing the digital image into repetitive areas, and modifying the tone curve and/or the histogram of each area to improve the visual perception of the corresponding area. Lastly, the joins between adjacent areas may be smoothed.

Abstract: In one embodiment, a method for converting an analog input value to a digital output value is disclosed. A successive approximation is performed. The analog input is quantized to a first quantized value, which is converted to a first analog value using a DAC. The first analog value is subtracted from the analog input value to form a first residue. The first residue is quantized to form a second quantized value, and a second residue is formed by converting the second quantized value to a second analog value using the DAC and subtracting the second analog value from the first residue value. The second residue is then quantized to form a third quantized value. The first, second and third quantized values are converted into a digital output value. The first, second and third quantized values each have at least three levels.

Abstract: A touch sensor includes a substrate having a substrate surface and first electrode sets. Each first electrode set has a plurality of electrodes formed over the substrate surface and arranged in a row along a first direction, the electrodes being transparent and formed of a first material, the first material being electrically conductive and light transmissive. Each first electrode set also has connection elements. Each connection element provides an electrical connection between a pair of adjacent ones of the plurality of electrodes. The connection elements are formed of a second material having a smaller specific electric resistance than the first material. Each of the connection elements comprises a first portion, a second portion and a third portion. The third portion provides an electrical connection between the first portion and the second portion.

Abstract: A semiconductor device may have a thickness, such that the semiconductor devices are not flexible, and may be bonded and electrically coupled on a flexible substrate. After this bonding, the semiconductor device may be thinned so as to be rendered flexible.

Abstract: The electronic circuit includes a transistor having a gate terminal, a source terminal and a drain terminal. A resistor has a first terminal connected to the gate terminal and has a second terminal connected to an auxiliary pad. When the electronic circuit is operating in a test phase and is configured for receiving a test signal for performing the test of the transistor, the auxiliary pad is electrically floating. When the electronic circuit is operating in a normal phase and is configured for receiving a supply voltage, the auxiliary pad is electrically connected to a voltage value smaller than the sum of the voltage value of the source terminal with the threshold voltage value of the transistor.

Abstract: An embodiment for manufacturing an electronic circuit forms at least one first structure on a semiconductor substrate, determines at least one electrically defined characteristic of the at least one first structure, selects a reticle corresponding to the measured characteristic, and forms at least one additional structure on the semiconductor substrate with the selected reticle.

Abstract: A method of controlling an electronic charge retention circuit for time measurement, including at least a first capacitive element, the dielectric of which has a leakage, and at least a second capacitive element, the dielectric of which has a higher capacitance than the first, the two elements having a common electrode defining a floating node that can be connected to an element for measuring its residual charge, in which a charge retention period is programmed or initialized by injecting or extracting charges via the first element.

Abstract: The method includes an interference deduction mode for reducing interferences between a wideband device and a narrowband device. The method is performed within the wideband device and includes detecting an emission from and/or a reception performed by the narrowband device; determining from the detection step a group of at least one sub-carrier having frequencies interfering with the narrowband devices; and frequency shifting at least a part of frequency band of the wideband device including the group of at least one interfering sub-carriers with a chosen frequency shift such that at least a part of frequency band of the narrowband device is excluded from the frequency band of the wideband device.

Abstract: A method of power point tracking for operating a photovoltaic power plant, which includes a DC-DC converter of the output voltage of a panel having a power switch driven by a PWM control signal of variable duty-cycle generated by a PWM control circuit, in discontinuous conduction mode or continuous conduction mode depending on the current load of the converter, is implemented by low cost analog circuits. The method does not require the use of any analog-to-digital conversion, digital processing or storage resources and may use a single voltage sensor.

Abstract: A semiconductor package includes a substrate, a stiffener ring coupled to the substrate and configured to form a well with the substrate, and a die positioned in the well. A thermal interface is positioned on the die. A heat spreader is coupled to the stiffener ring so that a portion of the heat spreader is positioned in the well and the thermal interface thermally couples the heat spreader to the die. The portion of the heat spreader positioned in the well adds rigidity to the semiconductor package and facilitates the use of thin dies.

Abstract: A device and method to compensate for distortions of amplitude that afflict systems for communicating through capacitive coupling. A circuit includes a first transmitter stage, a first receiver stage, and a first coupling capacitor, coupled between the first transmitter stage and the first receiver stage. The first receiver stage includes a calibration amplifier of a variable-gain type coupled between the first coupling capacitor and an output of the electronic circuit. The electronic circuit includes a reference channel formed by: a transmission calibration stage; a reception calibration stage; and a reference capacitor coupled between the transmission calibration stage and the reception calibration stage.