Abstract: Device comprising processing means (MT), transmission channels (VE1, . . . VEn), an antenna array for transmitting signals comprising a number of antennas (A11 . . . A1n) respectively associated with the transmission channels, a number of digital-analogue converters (DAC) and a number of phase-shifting means (MD1, . . . MDn) respectively associated with the antennas, said phase-shifting means (MD1, . . . MDn) being placed between the processing means (MT) and the digital-analogue converters (DAC) and including digital all-pass filters of FIR type (PT), the processing means comprising control means (MC) configured to adjust the coefficients and/or the order of the all-pass filters of FIR type.

Abstract: A complementary read-only memory (ROM) cell includes a transistor; and a bit line and a complementary bit line adjacent to the transistor; wherein a drain terminal of the transistor is connected to one of the bit line and the complementary bit line based on data programmed in the ROM cell.

Abstract: A cinematic parameter computing method of a satellite navigation system, including: receiving signals at a receiving apparatus from a plurality of satellites; processing said signals to provide received data; computing a first cinematic parameter value of said receiving apparatus according to a first computational method using said received data; computing a second cinematic parameter value of said receiving apparatus according to a second computational method using said received data and computing a distance value representing a difference between said first and second cinematic parameter values. The distance value is compared with a reference value providing a comparison result data and selecting one of first and second computational methods based on said comparison result data.

Abstract: An integrated magnetic-field sensor designed to detect an external magnetic field, comprising a first magnetoresistive structure for detecting the external magnetic field, the first magnetoresistive structure including first magnetoresistive means having a main axis of magnetization and a secondary axis of magnetization set orthogonal to one another. The magnetic-field sensor further comprises a magnetic-field generator, including a first portion configured for generating a first magnetic field having field lines in a first field direction, and a second portion, which is coplanar and is connected to the first portion, configured for generating a second magnetic field having field lines in a second field direction, the first magnetoresistive means being configured so that the main axis of magnetization extends parallel to the first field direction, and the secondary axis of magnetization extends parallel to the second field direction.

Abstract: A method of manufacturing a modular semiconductor subassembly: providing at least one semiconductor subassembly having a modular sidewall element of modular dimensions and a semiconductor substrate base element coupled to the modular sidewall element that has at least one semiconductor element with a layout sized to be accommodated by modular dimensions of the modular sidewall element. If a modular package protective cover is to be used: providing the modular package protective cover configured to accommodate the semiconductor subassembly in accordance with a modular design; securing the semiconductor subassembly in the modular package protective cover to create a modular package assembly; and mounting the modular package assembly to a core, with a base side of the semiconductor substrate base element in contact with the core; otherwise: mounting the at semiconductor subassembly to the core, with the base side of the semiconductor substrate base element in contact with the core.

Abstract: A shadow hardware system and method is provided. The shadow hardware system provides an interface between an access device and shadowed devices. Shadowed devices are devices that the shadow hardware system provides an interface to the access device although the shadowed device may not actually be present or available to the access device, such as implementing a disk drive as flash memory. The access device, such as a host processor, issues requests to a disk drive and the shadow hardware system converts the requests to requests suitable for the flash memory. A shadow remapper redirects the requests to shadow registers and notifies the shadow controller of the pending request. The shadow controller accesses the shadow registers and modifies the registers (if necessary) before forwarding the registers to the actual hardware devices. Any suitable device may be shadowed.

Abstract: A first circuit has a reset input. A second circuit is configured to be reset and provide an output. A test circuit is configured to test the first circuit and second circuit. The test circuit is configured such that a fault with the first circuit and said second circuit is determined in dependence on an output of the first circuit.

Abstract: An integrated image sensor capable of determining the distance to objects contained in a scene including at least a set of first pixels and a set of second pixels, the first and second pixels being alternately distributed in an array, the first pixels having a different angular aperture than the second pixels.

Abstract: A memory circuit includes a memory cell configured to be re-writable. A write enable circuit is configured to enable writing a signal via a pair of bit lines to the memory cell depending on a write signal. A charge supply circuit is configured to supply a charge to at least one of the pair of bit lines. A charge supply controller is configured to control the charge supply circuit to disable the supply of charge and couple the write enable circuit to at least one of the pair of bit lines after a first determined period following the reception of the write signal.

Abstract: A process for making an integrated circuit, a wafer level integrated circuit package or an embedded wafer level package includes forming copper contact pads on a substrate or substructure. The substructure may include devices and the contact pads may be used for forming electrical couplings to the devices. For example, copper plating may be applied to a substructure and the copper plating etched to form copper contact pads on the substructure. An etching process may be applied to remove barrier layer material on the substructure, such as adjacent to the copper pads. For example, a hydrogen peroxide etch may be applied to remove titanium-tungsten from a surface of the substructure. The pads are again etched to remove barrier layer etchant, byproducts and/or oxide from the pads. Contamination control steps may be performed, such as quick-dump-and-rinse (QDR) and spin-rinse-and-dry (SRD) processing.

Abstract: A sync signal generator for a capacitive sensor includes a charge amplifier having an input for coupling to an inactive receive line in the capacitive sensor, a first comparator having a first input for receiving a first threshold voltage, a second input coupled to an output of the charge amplifier, and an output for providing a first sync signal, and a second comparator having a first input for receiving a second threshold voltage, a second input coupled to the output of the charge amplifier, and an output for providing a second sync signal. The charge amplifier includes an operational amplifier having a feedback circuit including a capacitor and a switch. The first threshold voltage is provided by a first digital-to-analog converter, and the second threshold voltage is provided by a second digital-to-analog converter.

Abstract: A circuit including a first oscillator configured to oscillate at a first frequency; a second oscillator configured to oscillate at a second frequency, the second frequency being different from and one of a harmonic or sub-harmonic of the first frequency; and a coupling between the first oscillator and the second oscillator configured to injection lock at least one of the first oscillator and second oscillator to the other of the first oscillator and second oscillator.

Abstract: A process for manufacturing semiconductor packages is provided, that includes drilling blind apertures in a reconstituted wafer, adhering a dry film resist on the wafer over the apertures, and patterning the film to expose a space around each of the apertures. The apertures and spaces are then filled with conductive paste by wiping a quantity of the paste across a surface of the film so that paste is forced into the spaces and apertures. The spaces around the apertures define contact pads whose thickness is constrained by the thickness of the film, preferably to about 10 ?m or less. To prevent paste from trapping air pockets in the apertures, the wiping process can be performed in a chamber from which much or all of the air has been evacuated. After curing the paste, the wafer is thinned from the back to expose the cured paste in the apertures.

Abstract: An optical range finder includes a light source adapted to produce illumination which impinges on a target. A detector receives a reflection of the illumination from the target, and a range code generator generates from the detected reflection a range code indicative of the range of the target from the range finder for each pulse. A signal processor receive plural range codes over a predetermined interval. A content addressable memory is used to count how many identical range codes are received during the predetermined interval. An identification is then made of the range code with the highest count, and that range code with the highest count is output as indicative of the range of the target from the range finder.

Abstract: A current generator includes a thermistor configured to receive an input current, a reference resistor of a value substantially corresponding to a resistance of said thermistor at a reference temperature, a current mirror configured to generate a mirrored current proportional to said input current, a feedback circuit configured to generate an output compensation current proportional to a difference between voltages on said reference resistor and on said thermistor, and a first adder configured to force through said reference resistor a difference current between said mirrored replica current and said output compensation current.

Abstract: A circuit including a switch controlling a capacitive element intended to receive an A.C. voltage, and a diode in parallel with the switch.

Abstract: A monitoring device is for monitoring physical characteristics of a building material. The monitoring device is buried inside a block of the building material, and has a sensor to sense physical characteristics thereof. The sensor transmits a signal representative of the physical characteristics.

Abstract: One or more digital video frames are interpolated using motion compensated temporal interpolation (MCTI). The quality of motion vectors corresponding to object motion between the two adjacent second video frames is detected. An average of forward motion vectors and an average of backward motion vectors representing motion of the object are compared by calculating the absolute value difference of the averaged forward and backward motion vectors to detect the quality of the motion vectors and a control signal is generated corresponding to the detected quality. Customized Image segmentation based on a first mode of image processing, a second mode of image processing or a combination of the first and second modes of image processing is then performed based on the detected accuracy to generate the interpolated frame.

Abstract: An integrated image sensor capable of determining the distance to objects contained in a scene, including a pixel array, each pixel in the array being associated with a microlens and being formed of an assembly of sub-pixels, each including a photosensitive area.

Abstract: Signal synchronizing systems and methods are disclosed. A signal synchronizing system includes a sequential logic circuit to receive an input signal and to generate a plurality of intermediate signals from the input signal based on a clock signal. A logic circuit combines the intermediate signals to generate an output signal. A signal receiver includes a microcontroller and a signal synchronizer coupled to the microcontroller. The signal synchronizer includes a sequential logic circuit to receive an input signal from a transmitter and to generate a plurality of intermediate signals from the received input signal based on a clock signal. A logic circuit combines the intermediate signals to generate an output signal.