Abstract: A method of designing a desired modular assembly: determining a package outline of a modular package assembly; determining seating plane and overall package length characteristics; calculating minimum package height of the modular package assembly; designing the dimensions and the configuration of semiconductor subassemblies by receiving semiconductor subassembly user input design data at the design tool, each semiconductor subassembly of the one or more semiconductor subassemblies comprising a modular sidewall element and a semiconductor substrate base element coupled to the modular sidewall element, the semiconductor substrate base element having at least one semiconductor element with a layout sized to be accommodated by modular dimensions of the modular sidewall element and the semiconductor substrate base element configured to form a base of the semiconductor subassembly; and incorporating the configuration and dimensions of the modular package assembly and the one or more semiconductor subassemblies int

Abstract: Front-side integrated parts of integrated-circuit chips are produced at locations on a substrate wafer. The front-side parts have a front side. A support wafer having a bearing side is mounted with the bearing side on top of said front-side parts. The support wafer includes at least one weak surface layer. This weak surface layer is attached to the substrate wafer using a retaining adhesive. In one implementation, the weak surface layer is attached to a front surface of the wafer. In another implementation, the weak surface layer is attached to a peripheral edge of the wafer. After attaching the support wafer, back-side integrated parts of the integrated-circuit chips are produced on the substrate wafer. The weak surface layer is then destroyed so as to demount the support wafer from the substrate wafer.

Abstract: PCR device (1) comprising at least a chamber (2), the chamber (2) being delimited on one side by a PCR substrate (3) at least partially covered by a polyelectrolyte coating (4) forming hydrophilic regions. The polyelectrolyte coating comprises at least one layer facing the chamber (2), the layer being a negatively charged polyelectrolyte layer. Further a hydrophobic polymer layer may be applied onto the PCR substrate facing the chamber forming hydrophobic regions delimiting the hydrophilic regions. Further a method for passivating a PCR substrate comprising the step of applying a polyelectrolyte is provided for.

Abstract: A method and apparatus for recovering a content signal from media stream protected by a digital rights management (DRM) system. A content access device includes a network interface configured to receive the protected media stream from a remote content provider via a network and a plurality of distinct DRM components corresponding to DRM systems supported by the content access device. A content extraction unit is operable to select a DRM component of the plurality of DRM components and execute the selected DRM component to recover a content signal from the protected media stream. When a search engine is used to discover available content, a list of references to available content is presented to the user, the presentation being dependent upon whether or not the content is protected by a DRM system supported by the content access device.

Abstract: A millimeter wave transceiver including a plate forming an interposer having its upper surface supporting an interconnection network and having its lower surface intended to be assembled on a printed circuit board by bumps; an integrated circuit chip assembled on the upper surface of the interposer; antennas made of tracks formed on the upper surface of the interposer; and reflectors on the upper surface of the printed circuit board in front of each of the antennas, the effective distance between each antenna and the reflector plate being on the order of one quarter of the wavelength, taking into account the dielectric constants of the interposed materials.

Abstract: A capacitive power supply including: a first capacitive element and a first resistive element in series between a first terminal of a power switch and at least one rectifying element having a second terminal connected to a first electrode of at least one second capacitive element for providing a D.C. voltage; and a bidirectional switch in parallel on the resistor.

Abstract: An embodiment comprises and apparatus having an image capture device with an image axis and a gyroscope operable to indicate the orientation of the image axis. An embodiment of a capsule endoscopy system comprises an imaging capsule and an external unit. The imaging capsule may comprise an image capture device having an image axis and a gyroscope operable to indicate the orientation of the image axis. The external unit may comprise a gyroscope operable to indicate an orientation of a subject and a harness wearable by a subject and operable to align the gyroscope with the subject. The imaging capsule may send and image to an external unit for processing and display, and the external unit may provide for calculation of the image-axis orientation relative to the body.

Abstract: A moving device to move across a surface including a motor rolling motion apparatus is disclosed. The moving device is coupled to the motor and has a body with an outer surface. A dense population of fibrils protrudes from the outer surface, with each fibril having a free-end termination configured to establish adhesion to the surface by inter-molecular Van der Waals forces.

Abstract: A MEMS transducer has a micromechanical sensing structure and a package. The package is provided with a substrate, carrying first electrical-connection elements, and with a lid, coupled to the substrate to define an internal cavity, in which the micromechanical sensing structure is housed. The lid is formed by: a cap layer having a first surface and a second surface, set opposite to one another, the first surface defining an external face of the package and the second surface facing the substrate inside the package; and a wall structure, set between the cap layer and the substrate, and having a coupling face coupled to the substrate. At least a first electrical component is coupled to the second surface of the cap layer, inside the package, and the coupling face of the wall structure carries second electrical-connection elements, electrically connected to the first electrical component and to the first electrical-connection elements.

Abstract: A semiconductor subassembly, a modular sidewall element having modular dimensions that accommodates placement of the semiconductor subassembly in a modular layout and a semiconductor substrate base element coupled to the modular sidewall element. The semiconductor substrate base element has at least one semiconductor element with a layout sized to be accommodated by modular dimensions of the modular sidewall element and the semiconductor substrate base element configured to form a base of the semiconductor subassembly.

Abstract: Phase shifting circuitry is provided for phase shifting at least one of first and second quadrature components of a data signal. The circuitry includes a first phase shifter adapted to phase shift, by a first phase angle, the first quadrature component by adding together weighted versions of the first and second quadrature components.

Abstract: A reading circuit for a magnetic-field sensor, provided with a detection structure generating an electrical detection signal as a function of an external magnetic field, has a signal-conditioning stage, which is electrically coupled to the detection structure and generates an output signal as a function of the electrical detection signal; the reading circuit is provided with a full-scale-control stage that is able to select automatically a full-scale value for the signal-conditioning stage, as a function of the value of the external magnetic field, such as to prevent saturation of the same conditioning stage.

Abstract: A thermometer coded line is configured to convert a time interval to a digital code for subsequent processing in order to output a value representative of said time interval. A digital peak detector is coupled to receive output from the thermometer coded line, the detector operating for correction of an undesired code of said digital code in order to ensure a valid output of said value. A majority logic circuit is coupled between the thermometer coded line and the digital peak detector, the logic circuit operating for correction of undesired code of said digital code in order to ensure the valid output of said value. The detector functions to correct any undesired code not corrected by, or introduced by, the logic circuit.

Abstract: An imaging device includes at least one photosite formed in a semiconducting substrate and fitted with a filtering device for filtering at least one undesired radiation. The filtering device is buried in the semiconducting substrate at a depth depending on the wavelength of the undesired radiation.

Abstract: A circuit for generating a reference voltage including: a first current source in series with a first bipolar transistor, between a first and a second terminal of application of a power supply voltage; a second current source in series with a second bipolar transistor and a first resistive element, between said first and second terminals, the junction point of the first resistive element and of the second bipolar transistor defining a third terminal for providing the reference voltage; a follower assembly having an input terminal connected between the first current source and the first bipolar transistor, and having an output terminal connected to a base of the second bipolar transistor; and a resistive dividing bridge between the output terminal of the follower assembly and said second terminal, the midpoint of this dividing bridge being connected to a base of the first bipolar transistor.

Abstract: Integrated-circuit chips are fabricated according to a process wherein weak portions are formed in a substrate wafer surrounding a plurality of locations. An integrated-circuit chip is defined at each location by destroying the weak portions so as to singulate integrated-circuit chips.

Abstract: A comparator having first and second stages can provide component offset compensation and improved dynamic range. The first stage can receive first and second input signals and produce first and second output signals. The second stage can be coupled to the first stage to receive the first and second output signals at first and second input terminals of the second stage. The second stage can provide a voltage to the first and second terminals that differs from the supply voltage by less than a voltage of a diode drop. The comparator is operable to receive input voltages that reach the supply voltage.

Abstract: Disclosed is a photonic integrated circuit having a plurality of lenses and a method for making the same. The photonic integrated circuit is comprised of optical circuitry fabricated over an underlying circuitry layer. In some embodiments, the optical circuitry includes a dielectric material having recesses disposed within, layers of a light waveguide material deposited within the recesses, and lenses disposed over each layer of waveguide material. The underlying circuitry layer may include, for example, a semiconductor wafer as well as circuitry fabricated during front end of line (FEOL) semiconductor manufacturing such as, for example, sources, gates, drains, interconnects, contacts, resistors, and other circuitry that may be manufactured during FEOL processes. The underlying circuitry layer may also include circuitry manufactured during back end of line semiconductor manufacturing processes such as, for example, interconnect structures, metallization layers, and contacts.

Abstract: A user controlled device, movable into a plurality of positions of a three-dimensional space, includes a MEMS acceleration sensor to detect 3D movements of the user controlled device. The device, such as a mouse, sends control signals correlated to the detected positions to an electrical appliance, such as a computer system. A microcontroller processes the output signals of the MEMS acceleration sensor to generate the control signals, such as screen pointer position signals and “clicking” functions.

Abstract: A proximity detector may include an array of single photon avalanche diodes (SPADs) and an illumination source. Illumination from the illumination source may be reflected by a target to the array of single photon avalanche diodes. The SPADs may be operable to detect events. A number of events detected may be dependent on a level of illumination incident on the SPADs. The proximity detector may then determine a quality metric and calculate an output when the quality metric is at a predetermined level. A related method may include regulating the quality of the data on which such a proximity detector apparatus calculates its output.