Abstract: A method for adjusting a chip mounting position, an apparatus, a medium, and an electronic device are provided. The adjustment method includes: obtaining offsets of actual mounting positions of individual chips in a first group of chips; obtaining an average offset for the actual mounting positions of the individual chips in the first group of chips according to the offsets of the actual mounting positions of the individual chips in the first group of chips; and adjusting the chip mounting position according to the average offset for the actual mounting positions of the individual chips in the first group of chips.

Abstract: Industrial blockchain enabled automation control (e.g., using a computerized tool) is enabled. For example, a system can comprise: a memory that stores executable components, a processor, operatively coupled to the memory, that executes the executable components, the executable components comprising: a minting component that, based on a manufacturing criterion associated with a product being determined to be satisfied, mints a non-fungible token associated with the product, wherein the non-fungible token comprises authenticity data representative of a birth certificate for the product, and a blockchain component that registers the non-fungible token with a blockchain.

Abstract: A computer-implemented system for a remote examination is disclosed. The computer-implemented system includes a device and a control system. The device comprises one or more slave sensors and a slave pressure system, the device configured to be manipulated while a patient performs a treatment plan. The control system comprises one or more processing devices operatively coupled to a master device and the device. The one or more processing devices are configured to receive slave sensor data from the one or more slave sensors, use a manipulation of the master device to generate a manipulation instruction, transmit the manipulation instruction, and use the manipulation instruction to cause the slave pressure system to activate.

Abstract: A network controller is configured to cause a network to implement a primary network configuration of a network and a secondary network configuration as a backup to the primary network configuration. The network controller may be configured to receive information from a plurality of nodes of a network and information related to the client data to be transmitted through the network. Based on the node information, the network controller is configured to determine available nodes and possible links in the network and then determine a topology of the network. The primary network configuration is determined based on the topology. The network controller then sends instructions to the plurality of nodes of the network to implement the primary network configuration and to switch to a secondary network configuration where a failure of the primary network configuration occurs, wherein the secondary network configuration implements mobile ad-hoc networking in the determined topology.

Abstract: A high speed food article slicing machine with a slicing station, a moveable frame supporting a food article feed mechanism frame, a food article gate, and a safety guard system for detecting an intrusion into the machine. Food articles are loaded onto a lift tray and raised to a staging position where food articles are in contact with a food article gate. The lift tray is located inline with the food article feed paths such that lateral shifting of food articles into the feed paths is not needed. Food article grippers, individually driven along feed paths by an overhead conveyor, move food articles over the food article gate towards the slicing station. The food article gate functions to assist in removal of food article end portions. The slicing machines utilizes a horizontally radiating laser intrusion detector to shut down systems when an unwanted intrusion is sensed.

Abstract: A method for forming the semiconductor structure includes: a wafer in which a semiconductor device is formed is provided; a blind hole is formed in the wafer; a first metal material is deposited in the blind hole to form a through silicon via; and a first metal material deposited on a surface of the wafer is removed, and the surface of the wafer is planarized.

Abstract: A bonded structure is disclosed. The bonded structure can include an interconnect structure. The bonded structure can also include a first die directly bonded to the interconnect structure. The bonded structure can also include a second die mounted to the interconnect structure. The second die is spaced apart from the first die laterally along an upper surface of the interconnect structure. The second die is electrically connected with the first die at least partially through the interconnect structure. The bonded structure can further include a dielectric layer that is disposed over the upper surface of the interconnect structure between the first die and the second die.

Abstract: A network computer system can monitor a plurality of mobile computing devices to determine a current location of a corresponding freight operator of a plurality of freight operators. The network computer system can record the current location of each of the plurality of freight operators in a data store of the set of memory resources. Additionally, the network computer system can repeatedly query the data store to determine when at least two freight operators of the plurality of freight operators that satisfy a set of drafting conditions. The set of drafting conditions including a proximity condition as between the at least two freight operators and a candidate commencement location in response to the determination, the network computer system can implement a drafting arrangement between the at least two freight operators.

Abstract: A state monitoring method, a state monitoring apparatus and a state monitoring system for a developing device are provided. After image information is obtained through the acquired video information of the developing device, it is determined by an analysis unit whether the image information includes nozzle anomaly information, and alarm information is issued after the nozzle anomaly information is determined. Moreover, similarity between the image information that does not include the nozzle anomaly information and second preset nozzle anomaly information is compared, and the nozzle information is stored in the analysis unit in a case that the similarity between the image information and the second preset nozzle anomaly information is greater than a first threshold.

Abstract: A method is provided for determining source match of a test system including an RF source, a vector network analyzer (VNA) and a test port. The method includes connecting a first calibration standard to the test port; generating an RF signal using the RF source, and applying the RF signal to the first calibration standard; measuring a first incident signal of the RF signal at a first receiver of the test system, and measuring a first reflected signal at a second receiver of the test system; connecting a second calibration standard to the test port; measuring a second incident signal of the RF signal at the first receiver of the test system, and measuring a second reflected signal at the second receiver of the test system; and determining the source match of the test system using the first incident and reflected signals and the second incident and reflected signals.

Abstract: A method for manufacturing a semiconductor device includes providing a semiconductor substrate including a first and second regions; forming a first dielectric layer on the semiconductor substrate; forming a temporary layer on the first dielectric layer; performing a first heat treatment process on the first dielectric layer and the temporary layer; removing the temporary layer to expose the first dielectric layer; and performing a second heat treatment process on the first dielectric layer.

Abstract: Embodiments of the disclosure provide a semiconductor structure and a method for forming the same. The semiconductor structure includes: a semiconductor substrate including a plurality of active areas and first isolation structures arranged at intervals along a first direction; gate structures located in the active areas and the first isolation structures. Top surfaces of the active areas extend beyond top surfaces of the gate structures; second isolation structures with a preset height located on surfaces of the gate structures, and the top surfaces of the second isolation structures are flush with the top surfaces of the active areas.

Abstract: The present disclosure provides a heating device and heating method for a semiconductor thermal process. The heating device includes: a first heating portion, on which a wafer to-be-heated is placed; a second heating portion, where the first heating portion and the second heating portion are arranged in parallel, and the second heating portion is configured to heat the first heating portion; and an adjustment portion, configured to adjust a vertical distance between the first heating portion and the second heating portion.

Abstract: Systems and methods are provided to perform PdM surveys using data acquisition units which screen multiple locations where equipment or structures to be evaluated are present. Video data will be acquired and processed to measure translational and vibratory motion and additional data will be collected from other camera, sensors or via data links. The motion present in the equipment or structures under test and the supplemental data will be automatically evaluated to detect suspect equipment conditions and to minimize the amount of video data maintained on the data acquisition unit and transmitted back the central PdM server for review by a PdM analyst and long term archival.

Abstract: Embodiments of the present disclosure are directed towards rotary variable differential transducers. The transducer may include a housing and an armature shaft included within the housing. The transducer may further include an input shaft configured to mate with an airplane shaft. The input shaft may be located independently from the armature shaft.

Abstract: Systems, devices and methods that facilitate non-intrusive measurement and validation of field-reversal of a core plasma by combining DFSS and blended Zeeman concepts (i.e., sub-Doppler circular dichroism spectroscopy).

Abstract: A user equipment (UE) may determine channel state information (CSI) reports with each CSI report being related to a component carrier. The UE may send a subframe with CSI report(s) on a physical uplink control channel (PUCCH). When a collision occurs in the subframe having the CSI report(s) on the PUCCH a lower priority CSI report may be dropped from the transmission.

Abstract: A guard ring structure includes: a bottom metal layer; a protection structure located on the bottom metal layer, wherein the protection structure includes an insertion portion, an interconnection portion, and a metal layer stacked in sequence from bottom to top, and the insertion portion is inserted into the nearest underlining metal layer under the interconnection.

Abstract: An industrial information hub (IDH) serves as a single industrial ecosystem platform where multiple participants can deliver repeatable and standardized services relevant to their core competencies. The IIH system is centered around the development of an ecosystem that creates and delivers value to users—including industrial enterprises, OEMs, system integrators, vendors, etc.—through the aggregation of digital content and domain expertise. The IIH system serves as a trusted information broker between the ecosystem and the OT environments of plant facilities, and provides a platform for connecting assets, contextualizing asset data and providing secure access to the ecosystem. Additionally, the IIH system provides tools and support to OEMs and other subject matter experts, allowing those experts to enable their digital assets for use in the ecosystem. The IIH system reduces the cost and risks for digital transformation of industrial assets.

Abstract: A method for forming a memory includes the following operations: a substrate and a semiconductor layer located on the substrate are formed; the semiconductor layer is patterned to form a plurality of first isolation structures and channel regions, each first isolation structure includes a first through hole and a second through hole, and a first isolation pillar located between the first through hole and the second through hole; a first filling layer filling up the first through hole and the second through hole is formed; the first isolation pillar is removed to form a third through hole located in the first filling layer; a barrier layer filling up the third through hole is formed; the channel regions are exposed by removing the first filling layer; and a gate layer covering surfaces of the channel regions is formed.