Abstract: A photonic integrated circuit comprises a silicon nitride waveguide, an electro-optic modulator formed of a III-nitride waveguide structure disposed on the silicon nitride waveguide, a dielectric cladding covering the silicon nitride waveguide and electro-optic modulator, and electrical contacts disposed on the dielectric cladding and arranged to apply an electric field to the electro-optic modulator.

Abstract: A storage device minimizes HPB entry inactivation resulting from data associated with hot reads being retrieved from multiple HPB sub-regions covering a logical-to-physical table. The storage device may support the HPB feature and a multiple HPB sub-region mode. The storage device includes a controller that tracks a hit count associated with a logical block address in a read command. The controller determines that the hit count has reached a hit threshold and updates a hit table to identify logical block address pages associated with hit counts that have reached the hit threshold across HPB sub-regions covering a logical-to-physical table. The controller transmits the hit table to a host device to be stored in an HPB cache on the host device and to be used by the host device for read commands sent from the host device to the storage device.

Abstract: Various illustrative aspects are directed to a data storage device, method, and one or more processing devices that are configured to: select a seek time model from a plurality of seek time models based at least in part on an operational characteristic of an access command, the operational characteristic relating to an off-track susceptibility of executing the access command; determine an access time for the access command using the selected seek time model; and select a next access command for execution based on the determined access time for the access command and determined access times for other ones of a plurality of access commands.

Abstract: A wearable device may compress the skin of a user when worn, which may affect values determined using sensors of the device. To determine the effect of skin compression on the values, a time-of-flight signal, images, or frames of video data that depict a portion of the body having indentations from wearing the device may be acquired. Characteristics of the images, such as shadows associated with the indentations, may be processed using a machine learning algorithm or mathematical function to determine a depth of various portions of the indentations. Depth data from the time of flight signal may be used to refine or modify these determined depths. The amount of skin compression associated with the indentations may be used to modify signals acquired using sensors, or output a recommendation for a band or other method for securing the device.

Abstract: Direct-bonded lamination for improved image clarity in optical devices is provided. An example process planarizes and plasma-activates optical surfaces to be laminated together, then forms direct bonds between the two surfaces without an adhesive or adhesive layer. This process provides improved optics with higher image brightness, less light scattering, better resolution, and higher image fidelity. The direct bonds also provide a refractory interface tolerant of much higher temperatures than conventional optical adhesives. The example process can be used to produce many types of improved optical components, such as improved laminated lenses, mirrors, beam splitters, collimators, prism systems, optical conduits, and mirrored waveguides for smartglasses and head-up displays (HUDs), which provide better image quality and elimination of the dark visual lines that are apparent to a human viewer when conventional adhesives are used in conventional lamination.

Abstract: A cloud-based edge-as-as-service (EaaS) system allows edge gateways to be easily configured and deployed on the cloud for collection, contextualization, and egress of industrial data to downstream applications, including analytic applications, work order management systems, or visualization systems. The EaaS system uses predefined device profiles to automatically discover relevant data items on plant floor devices and present these data items to a user. Model configuration interfaces served by the EaaS system allow the user to map selected data items to predefined models for organizing or contextualizing the selected data, and for egressing the contextualized data to the target applications. These model configurations can be deployed on the cloud platform as edge gateways that use the resulting information models to collect and contextualize relevant items of device data during runtime and to export the modeled data to the target application.

Abstract: Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects are provided. An example optical interconnect joins first and second optical conduits. A first direct oxide bond at room temperature joins outer claddings of the two optical conduits and a second direct bond joins the inner light-transmitting cores of the two conduits at an annealing temperature. The two low-temperature bonds allow photonics to coexist in an integrated circuit or microelectronics package without conventional high-temperatures detrimental to microelectronics. Direct-bonded square, rectangular, polygonal, and noncircular optical interfaces provide better matching with rectangular waveguides and better performance. Direct oxide-bonding processes can be applied to create running waveguides, photonic wires, and optical routing in an integrated circuit package or in chip-to-chip optical communications without need for conventional optical couplers.

Abstract: A method of manufacturing an insert system for footwear includes assembling electronic components. The electronic components include a sensor array having physiological sensors. Each physiological sensor includes a first high resistance layer configured to be in contact with a second high resistance layer when no force is applied to the sensor. The method further includes positioning the sensor array between a first layer and a base layer. An insert system for footwear includes a first layer, a base layer, a sensor array between the first and base layers, and a circuit board. The sensor array includes physiological sensors. Each physiological sensor includes a first high resistance layer in contact with a second high resistance layer when no force is applied to the sensor. The circuit board can transmit signals external to the system to trigger an alert being issued to a user, based on an output of the sensor array.

Abstract: A suspension assembly for a magnetic storage device. The suspension assembly includes a base plate, a load beam, and a flexure. A hinge of the load beam is configured to flex so that a distal end portion of the load beam moves relative to the base plate. The flexure includes a hinge portion and fixed portions adjacent the hinge portion. Each one of the fixed portions of the flexure includes a first layer and a second layer. The first layer is interposed between the second layer and the load beam. The hinge portion of the flexure includes the second layer but does not include the first layer. A thickness of the second layer of the hinge portion of the flexure is less than a thickness of the second layers of the fixed portions of the flexure.

Abstract: Maintaining the security of biometric data is an utmost priority. Biometric data is secured using one or more techniques. With one technique, biometric input such as images of a user's palm is used to generate first primary data (PD). The original biometric input is deleted from temporary secure storage while the first PD is securely stored. The first PD may then be processed later to determine a second PD. The first PD may then be deleted, and the second PD subsequently used. With another technique, biometric input or a PD may be processed by a first model to determine first secondary data (SD) that is representative of features of a particular user within a first embedding space. Later the PD may be processed by a second model to determine a second SD in a second embedding space. The first SD is deleted, and the second SD subsequently used.

Abstract: Disclosed are a semiconductor structure, a memory and a method for operating the memory. The semiconductor structure includes: a substrate; a first gate structure and a second gate structure that are located on a surface of the substrate and have a same thickness smaller than a preset thickness; and a first doped area and a second doped area that are located in the substrate and are respectively located on two sides of the first gate structure. The first gate structure forms a selection transistor with the first and second doped areas; an orthographic projection of the second gate structure on the substrate is at least partially overlapped with the second doped area. The second gate structure and the second doped area form an antifuse bit structure. A breakdown state and a non-breakdown state of the antifuse bit structure are configured to represent different stored data.

Abstract: Apparatus and methods for removing and/or destroying support structures associated with objects fabricated using additive manufacturing techniques are presented herein. Structural supports may be used during an additive manufacturing process to prevent deformation of a build piece (e.g., three dimensional (3D) printed structure). In some examples, a build piece may be manufactured such that the structural supports are internal to the completed build piece. However, removing the structural supports may reduce the weight of the build piece and reduce the amount of debris trapped within the build piece. Thus, certain aspects of the disclosure are directed to a hose including a bendable and elongated tube member as well as a fracturing member configured to fracture an internal support structure within an additively manufactured part.

Abstract: Disclosed are devices, methods and/or systems for use in protecting items and/or structures that are exposed to, submerged and/or partially submerged in aquatic environments from contamination and/or fouling due to the incursion and/or colonization by specific types and/or kinds of biologic organisms and/or plants, including the protection from micro- and/or macro-fouling for extended periods of time of exposure to aquatic environments.

Abstract: The present disclosure relates to an encapsulation adhesive film for a solar cell, comprising a transparent layer in contact with a cell sheet, and a first adhesive film layer in contact with the transparent layer, wherein raw materials of the first adhesive film layer comprise the following components: a resin and a colored filler with a mass ratio of 3 to 25:1, a cross-linking agent accounting for 0.1% to 5% of the total mass of the resin and the colored filler, an auxiliary cross-linking agent accounting for 0.1% to 1% of the total mass of the resin and the colored filler, a coupling agent accounting for 0.1% to 1% of the total mass of the resin and the colored filler, a light stabilizer accounting for 0.1% to 1% of the total mass of the resin and the colored filler, and a photo initiator accounting for 0.1% to 5% of the total mass of the resin and the colored filler. The present disclosure can effectively prevent a white substance from overflowing.

Abstract: Direct bonded stack structures for increased reliability and improved yields in microelectronics are provided. Structural features and stack configurations are provided for memory modules and 3DICs to reduce defects in vertically stacked dies. Example processes alleviate warpage stresses between a thicker top die and direct bonded dies beneath it, for example. An etched surface on the top die may relieve warpage stresses. An example stack may include a compliant layer between dies. Another stack configuration replaces the top die with a layer of molding material to circumvent warpage stresses. An array of cavities on a bonding surface can alleviate stress forces. One or more stress balancing layers may also be created on a side of the top die or between other dies to alleviate or counter warpage. Rounding of edges can prevent stresses and pressure forces from being destructively transmitted through die and substrate layers. These measures may be applied together or in combinations in a single package.

Abstract: Systems and methods are disclosed for capturing and interpreting data streams between an instrument and a controlling device. A processor is configured to receive a data stream sent by the instrument to the controlling device and identify data frames in the stream. The processor is configured to search for a bit pattern in the stream, identify bits corresponding to a message length of a first presumed data frame based on a location relative to the bit pattern, and identify a second presumed data frame in the data stream based on the message length of the first presumed data frame. The processor is further configured to identify a second instance of the bit pattern, increase a count, continue scanning, extract and store instrument measurement data or operational metadata from the identified data frames, and analyze or interpret the captured data and metadata for visualization or alerts.

Abstract: A three-dimensional CAD/CAM system includes: a primitive generation unit using a differential polyhedron model being a set including coordinate values and normal vectors of triangle vertices, and curved line elements including start/end points being the triangle vertices and tangent vectors at the start/end points to form a curved surface by connecting sides of the differential polyhedron and form a closed surface by connecting curved surfaces with a curved surface boundary line; a storage unit storing CSG data representing a solid model in CSG representation by a tree structure of set operations of the primitives; a dexel generation unit determining an intersection point between the solid model and a straight line from the intersection point between the closed surface of the primitive and the straight line by a set operation based on the CSG data; and an NC data generation unit for positioning a tool on the basis of the dexel.