Abstract: Methods to test functional memory interface logic of a core under test utilize a built-in-self-test (BIST) controller to generate test sequences, and a clock-gating circuit to selectively supply the test sequences to a memory input or memory output on the core under test. After an initial data initialization of the core under test at BIST mode, an at-speed functional mode is utilized to capture a desired memory output.

Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.

Abstract: A method of forming a composite material includes photo-initiating a polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice. Unpolymerized monomer is removed from the polymer microlattice. The polymer microlattice is coated with a metal. The metal-coated polymer microlattice is dispersed in a polymer matrix.

Abstract: One example includes a method for validating a circuit design. The method includes providing a set of coded rules. Each of the coded rules can define conditions for circuit cells to qualify the circuit design as being radiation-hardened. The method also includes accessing a circuit design netlist associated with the circuit design from a circuit design database. The method also includes evaluating each of the circuit cells in the circuit design netlist with respect to each of the coded rules. The method further includes providing a circuit evaluation report comprising an indication of failure of a set of the circuit cells with respect to one or more of the coded rules in response to the evaluation.

Abstract: Described examples provide microelectronic devices and fabrication methods, including fabricating a contact structure by forming a titanium or titanium tungsten barrier layer on a conductive feature, forming a tin seed layer on the barrier layer, forming a copper structure on the seed layer above the conductive feature of the wafer or die, heating the seed layer and the copper structure to form a bronze material between the barrier layer and the copper structure, removing the seed layer using an etching process that selectively removes an exposed portion of the seed layer, and removing an exposed portion of the barrier layer.

Abstract: A system comprises a substrate. The substrate comprises a lead. The system also comprises a solder barrier formed on the lead. The solder barrier is to contain a solder bump within a solder area on the lead. The system further includes a solder bump in the solder area and a die having an active surface coupled to the solder bump.

Abstract: A packaged integrated circuit (IC) includes a leadframe including a die pad. The packaged IC also includes a first circuit on the die pad, the first circuit having a region. The packaged IC also includes a second circuit on the first circuit, the second circuit being spaced from the region by a gap. The packaged IC also includes an attachment layer between the first and second circuits, the attachment layer and the first and second circuits enclosing at least a part of the gap over the region. The packaged IC also includes a mold compound encapsulating the first and second circuits, the attachment layer, and the at least part of the gap.

Abstract: A radar transceiver includes a phase shifter that is controlled to apply an induced phase shift in a first subset of chirp signals of a frame of chirp signals, which also includes a second subset of chirp signals in which no phase shift is applied. Other circuitry generates digital signals based on received reflected signals, which are based on transmitted signals. Processing circuitry performs a Fast Fourier Transform (FFT) on a first subset of digital signals, corresponding to the first subset of chirp signals, to generate a first range-Doppler array, and performs a FFT on the second subset of digital signals, corresponding to the second subset of chirp signals, to generate a second range-Doppler array; identifies peaks in the first and second range-Doppler arrays to detect an object; and compares a phases of peaks at corresponding positions in the first and second range-Doppler arrays to determine a measured phase shift between the two peaks.

Abstract: A voltage converter, including an input adapted to couple to a voltage source and a transformer including a primary coil and a secondary coil. Primary side circuitry, including a first switching circuit, is coupled to the primary coil. A second switching circuit is coupled between a first terminal and a second terminal of the secondary coil, and configured to selectively close to short circuit the first terminal to the second terminal.

Abstract: In some examples, a circuit includes a capacitor having a first terminal and a second terminal, the first terminal coupled to a voltage supply terminal of the circuit. The circuit also includes a transistor having a transistor gate, a transistor drain, and a transistor source, the transistor source coupled to ground and the transistor drain coupled to an input terminal of the circuit. The transistor is configured to conduct responsive to a gate signal received at the transistor gate, the gate signal based on a signal provided at the second terminal of the capacitor. The circuit also includes a Schmitt trigger having a Schmitt trigger input coupled to the transistor drain.

Abstract: In some examples, this description provides for an apparatus. The apparatus includes a power switch having a power switch source configured to receive an input voltage, a power switch drain, and a power switch gate. The apparatus also includes a current sense component coupled to the power switch. The apparatus also includes a current limiting circuit coupled to the power switch gate, the power switch drain, and the current sense component. The apparatus also includes an over-current protection (OCP) circuit coupled to the power switch source, the power switch drain, and the power switch gate. The apparatus also includes an output voltage (VOUT) clamp coupled to the power switch drain and the power switch gate.

Abstract: A method includes receiving, by a peripheral device, a first connection request from a first central device; providing, by the peripheral device, a first indication of an anchor point time to the first central device before establishing a first wireless connection with the first central device; and responding, by the peripheral device, to the first connection request and establishing the first wireless connection using a first anchor point based on the first indication.

Abstract: A pulse width modulator circuit with circuitry for providing a first and second pulse width modulation signal with dead time periods between the first and second pulse width modulation signals, an input for receiving a signal representative of a current in a load adapted to be driven in response to the first and second pulse width modulation signals, and circuitry coupled to the input for adjusting the dead time periods in response to the signal representative of a current.

Abstract: Methods, apparatus, systems and articles of manufacture to trim temperature sensors are disclosed. An example method includes: sampling a first value indicative of a temperature of a first die of a multi-chip module (MCM) with a first temperature sensor, the first die including a first transistor having a channel including a first material; and calibrating a second temperature sensor configured to sample a second value indicative of a temperature of a second die including a second transistor have a second channel including a second material, the calibrating based on the first value.

Abstract: Described embodiments include a fault monitoring system comprising a fault logic circuit having a fault logic input adaptable to be coupled to sensor inputs, and first and second fault logic outputs. The fault logic circuit compares a plurality of data values provided by respective sensor inputs to respective fault thresholds, and provides respective fault signals at the first fault logic output responsive to a fault event in which a respective data value exceeds its respective fault threshold. A timer has a timer input coupled to the reset output, and a timer output. A data register has a first data register input coupled to the write control output, a second data register input coupled to the timer output, and a data register output. The data register receives fault data that includes an event identifier, a timer value, and a timer expiration indicator.

Abstract: Techniques for controlling a low-dropout (LDO) voltage regulator. In an example, an LDO voltage regulator circuit includes an amplifier having an output coupled to a transistor. First and second inputs of the amplifier are coupled to a power supply node via first and second resistors, respectively. The transistor gate is coupled to the amplifier output, the transistor source is coupled to the second input of the amplifier, and the transistor drain is coupled to a reference voltage node. The second resistor is variable based on the amplifier output and a reference voltage from the reference voltage node. In an example, the reference voltage node is connectable to ground via a reference resistor connected in parallel with a noise-filtering capacitor, which causes a reference current to flow through the transistor. The reference current is adjusted based on the drain-to-source voltage of the transistor.

Abstract: In one example, a method comprises: receiving a voltage from a power converter, and generating a comparison result representing a comparison between the voltage and a voltage threshold. The method further comprises providing one of a first current reference or a second current reference to the power converter responsive to the comparison result, in which the first and second current references represent different current levels.

Abstract: High-speed data communication devices, e.g., repeaters, interfacing between a host and a peripheral operate such that high-speed components except for a host-side squelch detector are set or maintained in a deactivated state during an idle period of a micro frame. In an example, a start of a micro frame is detected on a data bus during a first time period. In a second time period after the first time period, the high-speed communication device determines whether at least one data packet is contained in the micro frame. When it is determined during the second time period that no data packet is contained in the micro frame, active components, except a squelch detector, are controlled to be inactive during a third time period after the second time period.

Abstract: A method for error handling in a geometric correction engine (GCE) is provided that includes receiving configuration parameters by the GCE, generating, by the GCE in accordance with the configuration parameters, output blocks of an output frame based on corresponding blocks of an input frame, detecting, by the GCE, a run-time error during the generating, and reporting, by the GCE, an event corresponding to the run-time error.

Abstract: A streaming engine employed in a digital data processor specifies a fixed read only data stream. An address generator produces virtual addresses of data elements. An address translation unit converts these virtual addresses to physical addresses by comparing the most significant bits of a next address N with the virtual address bits of each entry in an address translation table. Upon a match, the translated address is the physical address bits of the matching entry and the least significant bits of address N. The address translation unit can generate two translated addresses. If the most significant bits of address N+1 match those of address N, the same physical address bits are used for translation of address N+1. The sequential nature of the data stream increases the probability that consecutive addresses match the same address translation entry and can use this technique.