Patents Assigned to Texas Instruments
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Patent number: 10368094Abstract: A method for luma-based chroma intra-prediction in a video encoder or a video decoder is provided that includes filtering reconstructed neighboring samples of a reconstructed down sampled luma block, computing parameters ? and ? of a linear model using the filtered, reconstructed neighboring samples of the reconstructed down sampled luma block and reconstructed neighboring samples of a corresponding chroma block, wherein the linear model is PredC[x,y]=?·RecL?[x,y]+?, wherein x and y are sample coordinates, PredC is predicted chroma samples, and RecL? is samples of the reconstructed down sampled luma block, and computing samples of a predicted chroma block from corresponding samples of the reconstructed down sampled luma block using the linear model and the parameters.Type: GrantFiled: July 31, 2017Date of Patent: July 30, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventor: Madhukar Budagavi
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Patent number: 10366958Abstract: A packaged multichip device includes a first IC die with an isolation capacitor utilizing a top metal layer as its top plate and a lower metal layer as its bottom plate. A second IC die has a second isolation capacitor utilizing its top metal layer as its top plate and a lower metal layer as its bottom plate. A first bondwire end is coupled to one top plate and a second bondwire end is coupled to the other top plate. The second bondwire end includes a stitch bond including a wire approach angle not normal to the top plate it is bonded to and is placed so that the stitch bond's center is positioned at least 5% further from an edge of this top plate on a bondwire crossover side compared to a distance of the stitch bond's center from the side opposite the bondwire crossover side.Type: GrantFiled: December 28, 2017Date of Patent: July 30, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Thomas Dyer Bonifield, Jeffrey Alan West, Byron Lovell Williams
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Patent number: 10362994Abstract: A bio-sensing device (and method) calibrates a time period used to make bio-physical measurements. The device initiates a light source sense phase followed by a first ambient sense phase and a second ambient sense phase. In the light source sense phase, the device is configured to receive a digital value indicative of current through a photodetector while the light source circuit is enabled and in each of the first and second ambient sense phases, the device is configured to receive digital values while the light source circuit is disabled. The device iteratively varies the time period between the phases until the digital value received during the first ambient sense phase is within a threshold of the digital value received during the second ambient sense phase. It then applies the same time separation between the light source sense phase and the ambient phase thereby equalizing the magnitude of the ambient light in the two phases.Type: GrantFiled: October 20, 2016Date of Patent: July 30, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Hussam Ahmed, Jagannathan Venkataraman, Sandeep Kesrimal Oswal, Antoine Lourdes Praveen Aroul, Hari Babu Tippana, Anand Hariraj Udupa
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Patent number: 10365761Abstract: A capacitive sensing methodology is suitable for sensing touch position along a sensor track based on touch capacitance based on touch position and touch pressure. The method is operable with a capacitive sensor including first and second capacitive sensor electrodes juxtaposed in a complementary configuration to define the sensor track, the complementary first and second sensor electrodes configured such that, as touch position moves along the sensor track, the electrode capacitance CSA of one sensor electrode monotonically decreases, and the electrode capacitance CSB of the complementary other sensor electrode monotonically increases, so that the touch capacitance corresponds to a combination of CSA and CSB. Pressure-compensated touch position data is generated from touch position information generated based on position and pressure functions, where the position function generates position information based on CSA and CSB, and the pressure function generates pressure information based on CSA and CSB.Type: GrantFiled: March 30, 2015Date of Patent: July 30, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventor: Dongtai Liu
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Patent number: 10366471Abstract: A method of de-mosaicing pixel data from an image processor includes generating a pixel block that includes a plurality of image pixels. The method also includes determining a first image gradient between a first set of pixels of the pixel block and a second image gradient between a second set of pixels of the pixel block. The method also includes determining a first adaptive threshold value based on intensity of a third set of pixels of the pixel block. The pixels of the third set of pixels are adjacent to one another. The method also includes filtering the pixel block in a vertical, horizontal, or neutral direction based on the first and second image gradients and the first adaptive threshold value utilizing a plurality of FIR filters to generate a plurality of component images.Type: GrantFiled: November 11, 2016Date of Patent: July 30, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Shashank Dabral, Mihir Narendra Mody, Denis Beaudoin, Niraj Nandan, Gang Hua
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Patent number: 10368412Abstract: In described examples, a circuit for controlling a light emitting diode (LED) includes a switch control circuit to generate a first control signal for a first switch coupled in parallel with the LED. The switch control circuit generates the first control signal responsive to a magnitude of loop current through the first switch relative to a first reference signal. A switch driver generates a second control signal for a second switch coupled to the first switch via an inductor. The first switch driver generates the second control signal responsive to the magnitude of the loop current through the first switch relative to the first reference signal.Type: GrantFiled: December 29, 2017Date of Patent: July 30, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: John Peter Fenske, Muhammad Roshanali Rajabali, Jeffrey Scott Farris
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Patent number: 10366987Abstract: Described example embodiments include an integrated circuit having a first channel area with a first FET formed in a semiconductor substrate, the substrate providing a contact to the drain. A second channel area includes a second FET formed in the semiconductor substrate. A pilot FET couples to the first FET in a current mirror configuration. A third FET has a conductivity opposite the first and second FETs and couples to the source of the pilot FET. An op amp includes an output coupled to the gate of the third FET. Signals from the drain of the second FET and the source of the pilot FET couple to the inverting input of the op amp. Signals from the source of the first FET and the drain of the first FET couple to the non-inverting input of the op amp. Methods and additional apparatus are disclosed.Type: GrantFiled: July 15, 2016Date of Patent: July 30, 2019Assignee: Texas Instruments IncorporatedInventors: David J. Baldwin, Hector X. Roman, Md. Abidur Rahman
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Patent number: 10368069Abstract: A method is provided that includes receiving a coded largest coding unit in a video decoder, wherein the coded largest coding unit includes a coded coding unit structure and a plurality of coded quantization parameters, and decoding the coded largest coding unit based on the coded coding unit structure and the plurality of coded quantization parameters.Type: GrantFiled: October 10, 2016Date of Patent: July 30, 2019Assignee: Texas Instruments IncorporatedInventors: Minhua Zhou, Mehmet Umut Demircin, Madhukar Budagavi
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Patent number: 10366947Abstract: A lead frame sheet of flat no-lead lead frames having a semiconductor die on a die pad, terminals, and plastic encapsulation except on a back side of the sheet to provide an exposed thermal die pad, exposed side walls, and exposed back sides of the terminals. A solder wetable metal or metal alloy plating layer is on the back side and on the exposed the walls of the terminals. The exposed thermal pad and the back side of the terminals each include a contact region which lacks the plating layer.Type: GrantFiled: February 21, 2017Date of Patent: July 30, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Reynaldo Corpuz Javier, Alok Kumar Lohia, Andy Quang Tran
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Patent number: 10368093Abstract: A method of compressing digital image data is provided that includes selecting an entropy code for encoding a line of pixels in the digital image data, wherein the entropy code is selected from a plurality of variable length entropy codes, using spatial prediction to compute a pixel predictor and a pixel residual for a pixel in the line of pixels, and selectively encoding the pixel residual using one of the entropy code or run mode encoding.Type: GrantFiled: November 21, 2016Date of Patent: July 30, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Ying Chen, Madhukar Budagavi, Minhua Zhou
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Patent number: 10365678Abstract: An method comprising activating an internal switch within a packaged electronic device to connect to a reference ground of an internal voltage source to a first input of an analog front end, receiving an external ground potential voltage at a first package pin of the packaged electronic device, generating a zero detector output signal for the packaged electronic device at a second package pin, activating the internal switch to connect the first input of the analog front end to the internal voltage source, receiving a second voltage level at the first package pin that generates a second output signal that matches the zero detector output signal, and receiving trim instructions to trim an internal voltage generated by the internal voltage source to a voltage level that is closer to a target voltage level.Type: GrantFiled: May 8, 2018Date of Patent: July 30, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Maciej Piotr Jankowski, Peng Cao
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Patent number: 10363861Abstract: One example includes a communication system. The system includes a data transmitter configured to generate a digital communication signal and a data receiver configured to receive the digital communication signal. The system also includes a pulse-width distortion (PWD) correction circuit arranged between the data transmitter and the data receiver and being configured to adjust at least one timing parameter associated with the communication signal.Type: GrantFiled: October 4, 2018Date of Patent: July 30, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Anant Shankar Kamath, Divyasree J.
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Patent number: 10366944Abstract: Described examples include a device including a semiconductor die having a first surface with bond pads and an opposite second surface attached to a substrate by an adhesive layer covering at least a portion of the surface area of the second surface. The adhesive layer includes first zones composed of a first polymeric compound and adding up to a first portion of the surface area, and second zones composed of a second polymeric compound and adding up to a second portion of the surface area, the first zones and the second zones being contiguous. The first polymeric compound has a first modulus and the second polymeric compound has a second modulus greater than the first modulus.Type: GrantFiled: May 8, 2018Date of Patent: July 30, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Rongwei Zhang, Vikas Gupta
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Patent number: 10367511Abstract: A system (and associated method) includes an input flip-flop, a counter, and a clock tree. The input flip-flop includes a clock input terminal configured to be coupled to a device clock, or a clock generated from a phase-locked loop, and a data input terminal configured to be coupled to a first reference signal. The input flip-flop is configured to use the device clock to latch the reference signal to produce a latched reference signal. The counter is configured to count pulses of the device clock starting upon detection of the latched reference signal and to output a second reference signal comprising a pulse for every L pulses of the device clock. The clock tree is configured to divide down the device clock to generate a first output clock. The clock tree is configured to be synchronized by a pulse of the second reference signal.Type: GrantFiled: July 16, 2018Date of Patent: July 30, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Shagun Dusad, Visvesvaraya Pentakota, Mark Baxter Weaver, William Bright, Jiankun Hu
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Patent number: 10359321Abstract: An integrated circuit and method are provided for accurately measuring the temperature of a die of the integrated circuit. Pairs of diodes are driven with different currents in order to generate a series of thermal voltages. The ADC measures the series of thermal voltages against an external reference voltage. Based on these thermal voltage measurements, the ADC calculates the die temperature. The different currents used to generate the series of thermal voltages are selected at specific ratios to each other in order to promote the ability of the ability of the ADC to calculate the die temperature using standard components and logic of an ADC. These thermal voltages are generated and measured using integrated components of the die for which a temperature measurement is being provided, thus reducing several sources of inaccuracies in conventional die temperature measurement techniques. Addition embodiments are provided for detecting defective diodes based on comparisons of the thermal voltage outputs.Type: GrantFiled: October 28, 2015Date of Patent: July 23, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dimitar Trifonov, Habib Sami Karaki
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Patent number: 10362322Abstract: A method and apparatus for encoding and decoding video data, including context encoding or decoding portions of an array of transform coefficients and bypass encoding or decoding a sign indicator for significant transform coefficients in an array related to a block of an image.Type: GrantFiled: October 17, 2016Date of Patent: July 23, 2019Assignee: Texas Instruments IncorporatedInventors: Madhukar Budagavi, Mehmet U. Demircin, Vivienne Sze
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Patent number: 10361095Abstract: A method of fabricating an integrated circuit (IC) includes depositing an aluminum-containing metal interconnect layer at a first temperature over a semiconductor device having a plurality of transistors. The metal interconnect layer is annealed at a maximum annealing temperature that is less than the first temperature. The metal interconnect layer is patterned after the annealing, thereby interconnecting the transistors.Type: GrantFiled: May 16, 2018Date of Patent: July 23, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Abbas Ali, Dhishan Kande, Qi-Zhong Hong, Young-Joon Park, Kyle McPherson
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Patent number: 10361627Abstract: An integrated circuit. The integrated circuit comprises a timebase generator and a switch mode direct current-to-direct current (DC-to-DC) voltage converter coupled to the timebase generator. The timebase generator comprises a first linear feedback shift register (LFSR), a signal generator having an input coupled to an output of the first LFSR; and a digital divider comprising a second LFSR and a programmable digital divider, wherein a clock input of the programmable digital divider is coupled to an output of the signal generator, wherein an output of the programmable digital divider is coupled to a clock input of the first LFSR and is coupled to a clock input of the second LFSR, and wherein an output of the second LFSR is coupled to a program input of the programmable digital divider.Type: GrantFiled: September 12, 2018Date of Patent: July 23, 2019Assignee: Texas Instruments IncorporatedInventor: Joerg Erik Goller
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Patent number: 10362326Abstract: Motion compensation requires a significant amount of memory bandwidth, especially for smaller prediction unit sizes. The worst case bandwidth requirements can occur when bi-predicted 4×8 or 8×4 PUs are used. To reduce the memory bandwidth requirements for such smaller PUs, methods are provided for restricting inter-coded PUs of small block sizes to be coded only in a uni-predictive mode, i.e., forward prediction or backward prediction. More specifically, PUs of specified restricted sizes in bi-predicted slices (B slices) are forced to be uni-predicted.Type: GrantFiled: March 6, 2017Date of Patent: July 23, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventor: Minhua Zhou
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Patent number: 10361098Abstract: A multi-level leadframe including three bonding levels and one exposed level. Each of the three bonding levels and the one exposed level is positioned in a different horizontal plane, with each bonding level providing a bonding site vertically positioned relative to the horizontal plane of the exposed level, with each bonding site coupled to a package lead at the exposed level. Bonding sites located at first and second bonding levels can be located in a common, outer row, along a common, vertical plane, and bonding sites located at a third bonding level can be located in a separate, inner row, along a separate vertical plane. A third level bonding site can be coupled to a first level bonding site with a multiple level electrical lead conductor that vertically spans a second bonding level. A two-step etch process from a single sheet conductor is provided to manufacture the multi-level leadframe.Type: GrantFiled: December 20, 2017Date of Patent: July 23, 2019Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Dolores Babaran Milo, Cherry Lyn Marquez Aranas