Patents Assigned to Xilinx, Inc.
-
Patent number: 8000519Abstract: A method of evaluating an inline inspection recipe compares the capture rate of metal pattern defects in bounding boxes arising from failed electrical test vectors to the capture rate after the bounding box is shifted. A difference between the first and second capture rates indicates whether the inline inspection recipe is valid for capturing killer defects, or if the inline inspection recipe needs to be adjusted. In a particular example, the electrical test vectors are directed at a selected patterned metal layer of an FPGA (M6), and the metal pattern defect data for the selected patterned metal layer is mapped to the bounding box determined by the electrical test vector.Type: GrantFiled: April 4, 2007Date of Patent: August 16, 2011Assignee: Xilinx, Inc.Inventors: Yongjun Zheng, David Mark, Joe W. Zhao, Felino Encarnacion Pagaduan
-
Patent number: 8001171Abstract: A pipeline Fast Fourier Transform (“FFT”) architecture for a programmable device is described. A first Radix-2 butterfly stage is coupled to receive a first input, configured to provide a first output responsive thereto, and configured to truncate at least one Least Significant Bit of the first output. A delay and swap stage is coupled to receive the first output and configured to provide a second output. A second Radix-2 butterfly stage is coupled to receive the second output and a second input, configured to provide a third output responsive thereto, and configured to truncate at least one Most Significant Bit of the third output. The first Radix-2 butterfly stage and the second Radix-2 butterfly stage are implemented in digital signal processing slices of a programmable device.Type: GrantFiled: May 31, 2006Date of Patent: August 16, 2011Assignee: Xilinx, Inc.Inventors: James M. Simkins, Vasisht Mantra Vadi, Helen Hai-Jo Tarn
-
Patent number: 8001504Abstract: A set of respective first delay values for paths from a clock source to nodes of the integrated circuit is generated. Respective second delay values for the paths are generated from the clock source through the clock tree to the nodes. Each first delay value corresponds to one of the second delay values for one of the nodes, and each is greater than the corresponding second delay value. A set of common delay values is generated, with each common delay value being a delay for a shared portion of the paths from the clock source through the clock tree to two of the nodes. The determined clock skew is based on the first delay value for a first node, the second delay value for a second node, and the common delay value for the shared portion of the paths from the clock source to the first and second nodes.Type: GrantFiled: July 29, 2008Date of Patent: August 16, 2011Assignee: Xilinx, Inc.Inventor: Scott J. Campbell
-
Patent number: 8001510Abstract: Disclosure is made of approaches for mapping an electronic design specification to an implementation. In one approach, quality metrics are associated with functional units of the design, and the functional units are mapped to respective initial implementations. For each functional unit a respective quality indicator is determined based on the mapping. The quality indicator specifies a degree to which the functional unit achieves the associated quality metric. At least one of the functional units is selected for remapping based on the quality indicator of that functional unit or the quality indicator of another functional unit. An alternative implementation to the initial implementation is selected for each selected functional unit to improve the quality indicator. The selected functional unit is remapped to the selected alternative implementation.Type: GrantFiled: September 5, 2008Date of Patent: August 16, 2011Assignee: Xilinx, Inc.Inventors: Ian D. Miller, Jorn W. Janneck, David B. Parlour, Paul R. Schumacher
-
Patent number: 8001438Abstract: A computer-implemented method of measuring bridge fault coverage for a test pattern for a circuit design to be implemented within a programmable logic device can include identifying simulation results and stuck at coverage of the circuit design for the test pattern (610, 620). Pairs of nets in the circuit design that are adjacent can be identified (625). Each type of bridge fault for which each pair is tested can be determined according to the simulation results (640, 645, 655, 660). A measure of bridge fault coverage for the test pattern can be calculated according to which types of bridge faults each pair is tested and which net of each pair acts as an aggressor for each type of bridge fault tested (675). The measure of bridge fault coverage can be output (680).Type: GrantFiled: August 15, 2008Date of Patent: August 16, 2011Assignee: Xilinx, Inc.Inventor: Deepak M. Pabari
-
Patent number: 7996649Abstract: A dual-port block random access memory (BRAM) can include first and second sections including direct mapped cache entries. The dual-port BRAM further can include third and fourth sections including translation look-aside buffer entries, wherein entries of the third section are associated with entries of the fourth section and wherein an entry of the third section and an associated entry of the fourth section collectively specify complete translation look-aside buffer data. The dual-port BRAM also can include first and second address ports concurrently accessing at least one of the first, second, third, or fourth sections of the dual-port BRAM to locate a virtual address to be translated.Type: GrantFiled: April 29, 2008Date of Patent: August 9, 2011Assignee: Xilinx, Inc.Inventor: Stefan Asserhall
-
Patent number: 7994609Abstract: A capacitor in an integrated circuit (“IC”) includes a core capacitor portion having first conductive elements electrically connected to and forming a part of a first node of the capacitor formed in a first layer and second conductive elements electrically connected to and forming a part of a second node of the capacitor formed in the first layer. The first and second conductive elements alternate in the first conductive layer. Third conductive elements electrically connected to and forming a part of the first node are formed in a second layer adjacent to the first layer. The capacitor also includes a shield capacitor portion having fourth conductive elements formed in at least first, second, third, and fourth layers. The shield capacitor portion is electrically connected to and forms a part of the second node of the capacitor and surrounds the first and third conductive elements.Type: GrantFiled: November 21, 2008Date of Patent: August 9, 2011Assignee: Xilinx, Inc.Inventor: Patrick J. Quinn
-
Patent number: 7994631Abstract: A substrate for an integrated circuit package is disclosed. The substrate comprises a core comprising a first dielectric layer having a first thickness; conductive traces formed on the first dielectric layer for routing signals within the integrated circuit package, wherein the conductive traces have a second thickness; and a substrate support structure comprising conductive traces formed on the first dielectric layer, where the conductive traces of the substrate support structure have a third thickness which is greater than the second thickness. A method of forming an integrated circuit package is also disclosed.Type: GrantFiled: May 4, 2009Date of Patent: August 9, 2011Assignee: Xilinx, Inc.Inventor: Leilei Zhang
-
Patent number: 7996604Abstract: A shared memory switch is provided for storing and retrieving data from BlockRAM (BRAM) memory of a PLD. A set of class queues maintain a group of pointers that show the location of the incoming “cells” or “packets” stored in the memory in the switch based on the time of storage in the BRAM. A non-blocking memory architecture is implemented that allows for a scalable N×N memory structure to be created (N=number of input and output ports). A write controller stripes the data across this N×N memory to prevent data collisions on read in or read out of data. The data is scheduled for read out of this N×N shared memory buffer based on priorities or classes in the class queues, with priorities being set by a user, and then data is read out from the BRAM.Type: GrantFiled: October 25, 2005Date of Patent: August 9, 2011Assignee: Xilinx, Inc.Inventors: Gautam Nag Kavipurapu, Sweatha Rao, Chris Althouse
-
Patent number: 7994610Abstract: A capacitor in an IC has a first layer of conductive strips extending along a first direction (Z-direction). A first plurality of conductive strips in the first layer forms a portion a first node of the capacitor and alternates with a second plurality of conductive strips forming a portion of a second node of the capacitor. A plate layer adjacent to the first layer has a third plurality of conductive strips forming a portion the first node. Each strip in the third plurality of conductive strips is adjacent to another strip forming a part of the first node. The strips in the plate layer extend along a second direction (X-direction) orthogonal to the first direction. A first via electrically connects a first conductive strip in the first plurality of conductive strips in the first layer to a second conductive strip in the plate layer.Type: GrantFiled: November 21, 2008Date of Patent: August 9, 2011Assignee: Xilinx, Inc.Inventor: Patrick J. Quinn
-
Publication number: 20110191729Abstract: An embodiment of the invention relates to a computer-implemented method of designing an integrated circuit (IC). In this embodiment, layout data describing conductive layers of the integrated circuit on a substrate is generated according to design specification data for the integrated circuit. The conductive layers include a topmost layer of bond pads. Metal structures in the layout data are modified to maximize metal density in a superimposed plane of the conductive layers within a threshold volume under each of the bond pads. A description of the layout data is generated on one or more masks for manufacturing the integrated circuit. By maximizing metal density in the superimposed plane, vertical channels through the dielectric material in the interconnect are reduced or eliminated. Thus, alpha particles cannot readily penetrate the interconnect and reach the underlying semiconductor substrate, reducing soft errors, such as single event upsets in memory cells.Type: ApplicationFiled: January 29, 2010Publication date: August 4, 2011Applicant: Xilinx, Inc.Inventor: Michael J. Hart
-
Patent number: 7990867Abstract: A pipeline is provided for processing network packets. The pipeline includes a look-ahead stage, an operation stage, an insert/remove stage, and an interleave stage. The look-ahead stage synchronizes two or more fields of a network packet. The operation stage modifies one or more of the fields of the network packet. The operation stage may modify state data and the fields of the network packet as a function of the state data and the fields. The insert/remove stage performs data insertion and removal at one or more fields of the network packet. The interleave stage ensures that the modified network packet follows rules for interleaving network packets. The look-ahead, operation, insert/remove, and interleave stages are generated from a textual language specification of the processing of the network packets by the pipeline.Type: GrantFiled: May 3, 2007Date of Patent: August 2, 2011Assignee: Xilinx, Inc.Inventors: Eric R. Keller, Philip B. James-Roxby
-
Patent number: 7991937Abstract: A receive-side client interface for a media access controller embedded in an integrated circuit having programmable circuitry is described. A media access controller core includes a receive engine. A receive-side datapath is coupled to the media access controller core. The receive-side datapath is configured to operate at two frequencies to accommodate the programmable circuitry in the integrated circuit.Type: GrantFiled: October 31, 2008Date of Patent: August 2, 2011Assignee: Xilinx, Inc.Inventors: Robert Yin, Hamish T. Fallside, Richard P. Burnley, Nicholas McKay, Martin B. Rhodes, Douglas M. Grant, Stuart A. Nisbet, Gareth D. Edwards
-
Patent number: 7991712Abstract: An evolution approach involves the automatic generation of an evaluation function. According to an example embodiment of the present invention, a consensus result from a population of designs is used to evaluate designs in the population for fitness. New designs are evolved using the consensus result as an evaluation function, with newly-evolved designs replacing ones of the population of designs determined to be unfit. With this approach, automatic design evolution is carried out independently from a fixed evaluation function, which is sometimes susceptible to error.Type: GrantFiled: August 20, 2003Date of Patent: August 2, 2011Assignee: Xilinx, Inc.Inventor: Stephen M. Trimberger
-
Patent number: 7992020Abstract: Power management with a packaged multi-die integrated circuit (IC) is described. A first integrated circuit die is capable of a first operational mode. A second integrated circuit die is coupled to the first integrated circuit die. The first integrated circuit die has a rate of power consumption that is lower than the second integrated circuit die when the first integrated circuit die is in the first operational mode and the second integrated circuit die is in a second operational mode. The first integrated circuit die is configured for power management of the second integrated circuit die for placing the second integrated circuit die in a standby mode from the second operational mode and for returning the second integrated circuit die to the second operational mode from the standby mode.Type: GrantFiled: March 5, 2008Date of Patent: August 2, 2011Assignee: Xilinx, Inc.Inventors: Tim Tuan, Kerry M. Pierce, Albert Franceschino
-
Patent number: 7989959Abstract: A stacked-die integrated circuit and a method of fabricating same. The stacked-die integrated circuit has circuitry formed in the first surface of a mother die, a plurality of through-die vias with at least one through-die via providing electrical connection between the circuitry of the mother die and the second surface and a plurality of contact pads formed in the second surface of the semiconductor die for mounting a daughter die wherein some of the contact pads are electrically isolated dummy pads.Type: GrantFiled: January 29, 2009Date of Patent: August 2, 2011Assignee: Xilinx, Inc.Inventor: Arifur Rahman
-
Patent number: 7992111Abstract: Approaches for processing an electronic circuit design. In one embodiment, the graphical model of an outer subsystem block and an inner subsystem block are translated into a high-level language (HLL) program. The HLL program includes a specification of a first function corresponding to the outer subsystem block and within the specification of the first function a specification of a second function corresponding to the inner subsystem block. The specification of the first function references a parameter of the outer subsystem block and specifies invocation of the second function. The specification of the second function specifies invocation of a third function corresponding to a leaf block in the inner subsystem block. The specification of the first function references a variable corresponding to the parameter, and that variable is referenced by the second or third functions. Execution of the HLL program instantiates a model of the design.Type: GrantFiled: May 18, 2009Date of Patent: August 2, 2011Assignee: Xilinx, Inc.Inventors: Haibing Ma, Jingzhao Ou, Chi Bun Chan
-
Patent number: 7991909Abstract: Method and apparatus for communication between a processor and processing elements in an integrated circuit (e.g., a programmable logic device is described. In an example, a first lookup table is configured to store first information representing which of the processing elements is capable of performing which of a plurality of instructions. A second lookup table is configured to store second information representing which of the plurality of instructions is being serviced by which of the processing elements. Control logic is coupled to the processor, the first lookup table, and the second lookup table. The control logic is configured to communicate data from the processor to the processing elements based on the first information, and communicate data from the processing elements to the processor based on the second information.Type: GrantFiled: March 27, 2007Date of Patent: August 2, 2011Assignee: Xilinx, Inc.Inventors: Paul R. Schumacher, Daniel L McMurtrey, Shengqi Yang
-
Patent number: 7990173Abstract: A circuit for handling single event upsets includes a plurality of digital clock manager circuits. A plurality of counters are respectively coupled by their inputs to the outputs of the digital clock managers and a reset controller is coupled to the outputs of the counters. The reset controller is configured to determine an expected value of the counters. In response to an output value of one of the counters being less than the expected value, the reset controller triggers a reset of the digital clock manager coupled to the input of the one of the counters. In response to an output value of one of the counters being greater than or equal to the expected value, the reset controller continues operation without triggering a reset of a digital clock manager.Type: GrantFiled: March 16, 2010Date of Patent: August 2, 2011Assignee: Xilinx, Inc.Inventors: Chen W. Tseng, Carl H. Carmichael
-
Patent number: 7987358Abstract: Methods of authenticating a user design in a programmable integrated circuit. The methods utilize an identifier unique to the programmable IC and a data word taken from the user design. The data word can be unique to the design and can include a string of data taken from the configuration data for the design, or the values of circuit nodes read from selected points throughout the design. A function is performed on the identifier and the data word, producing a key specific to the user design as implemented in that programmable IC. The key is compared to an expected value. When the key matches the expected value, the user design is enabled. When the key does not match the expected value, at least a portion of the user design is disabled. Circuitry for performing the steps of the method can be implemented in the programmable resources of the programmable IC.Type: GrantFiled: June 9, 2006Date of Patent: July 26, 2011Assignee: Xilinx, Inc.Inventors: James A. Walstrum, Jr., Steven K. Knapp, Shalin Umesh Sheth