Abstract: A transmission system is disclosed including a driver circuit. The driver circuit includes multiplexer circuits that receive parallel data and operate as a differential pair. At least one of the multiplexer circuits is coupled to a first circuit node and a second circuit node of the driver circuit. The at least one the multiplexer circuits outputs serial data from the multiplexer circuits at the first and second circuit nodes. The first and second nodes are coupled to a differential output network. The first and second nodes are coupled to an inductor circuit. The first and second nodes are coupled to a cross-coupled circuit. The inductor circuit drains driver circuit current at the first circuit node. The second circuit node and the cross-coupled circuit steer driver circuit current at the first circuit node and the second circuit node.

Abstract: Embodiments herein describe integrity check techniques that are efficient and flexible by using local registers in a segment to store check values which can be used to detect errors in the local configuration data in the same segment. In addition to containing local registers storing the check values, each segment can include a mask register indicated which of the configuration registers should be checked and which can be ignored. Further, the segments can include a next segment register indicating the next segment the check engine should evaluate for errors.

Abstract: Embodiments herein describe arranging TX and RX circuitry in ICs such that rotated and mirrored ICs are aligned when connected in a multiple-chip device. In one embodiment, the TX circuitry (e.g., TX physical layer or PHY) is arranged in one row while the RX circuitry (e.g., RX physical layer or PHY) is arranged in another row. As such, when an IC is rotated or mirrored, at least one TX PHY is aligned with a RX PHY on the other IC. As such, non-crossing chip-to-chip connections can be formed through the interposer.

Abstract: Embodiments herein describe a NoC where its internal switches have buffers with pods that can be assigned to different virtual channels. A subset of the pods in a buffer can be grouped together to form a VC. In this manner, different pod groups in a buffer can be assigned to different VCs (or to different types of NoC data units), where VCs that transmit wider data units can be assigned more pods than VCs that transmit narrower data units.

Abstract: Descriptor fetch for a direct memory access system includes, in response to receiving a first data packet, fetching a plurality of descriptors including a first descriptor and a specified number of prefetched descriptors. The plurality of descriptors specify different buffer sizes. In response to processing each data packet, selectively replenishing the plurality of fetched descriptors to the specified number of prefetched descriptors.

Abstract: Embodiments herein describe a solution for deterministic de-assertion of write and read resets of an asynchronous gearbox FIFO having unequal write and read data bit widths. Proposed approaches look for a stable region between read and write clock phases by sweeping one of the clock phases until the leading edges (phases) of both clocks are aligned then releasing the write and read resets deterministically based upon a change in cyclic behavior of detected logic levels of a reset beacon waveform.

Abstract: Offloading trace data from an integrated circuit (IC) can include receiving, by a high-speed debug port (HSDP) trace circuit, streams of trace data from a plurality of compute circuits of different compute circuit types. The compute circuits and the HSDP trace circuit are disposed in a same IC. Compute circuit type identifiers are included within the trace data. The compute circuit type identifiers specify the compute circuit type from which respective ones of the streams of the trace data originate. Debug trace packets (DTPs) are generated from the trace data and transmitted over a high-speed communication link to a trace data storage device (TDSD) external to the IC. Within the TDSD, trace data from the DTPs are stored in a memory of the TDSD.

Abstract: Implementing circuit designs in integrated circuit devices includes determining, using computer hardware, regular control sets, super control sets, and mega control sets for a circuit design. Control set optimization is performed on the circuit design. Performing control set optimization includes performing a clock-enable-only control set reduction for each super control set. Performing control set optimization includes performing a set/reset control set reduction and a clock-enable control set reduction for each mega control set. The circuit design is selectively modified by committing changes determined from the control set reductions to the circuit design on a per control set basis based on an improvement of a cost metric for each control set.

Abstract: A direct memory access (DMA) system includes a plurality of read circuits and a switch coupled to a plurality of data port controllers configured to communicate with one or more data processing systems. The DMA system includes a read scheduler circuit coupled to the plurality of read circuits and the switch. The read scheduler circuit is configured to receive read requests from the plurality of read circuits, request allocation of entries of a data memory for the read requests, and submit the read requests to the one more data processing systems via the switch. The DMA system includes a read reassembly circuit coupled to the plurality of read circuits, the switch, and the read scheduler circuit. The read reassembly circuit is configured to reorder read completion data received from the switch for the read requests and provide read completion data, as reordered, to the plurality of read circuits.

Abstract: An integrated circuit includes a high-speed debug port trace circuit. The high-speed debug trace circuit includes a plurality of input receiver circuits each configured to receive a stream of trace data. The plurality of input receiver circuits receive streams of trace data from a plurality of compute circuits of different compute circuit types. The plurality of compute circuits are within the integrated circuit. The high-speed debug trace circuit includes a stream selector circuit configured to perform multiple stages of arbitration among the plurality of streams of trace data to generate output trace data. The stream selector circuit inserts compute circuit type identifiers within the output trace data. Each compute circuit type identifier specifies a compute circuit type that originated each portion of trace data of the output trace data. The high-speed debug trace circuit includes an output transmitter circuit configured to output the output trace data.

Abstract: Evicting queues from a memory of a direct memory access system includes monitoring a global eviction timer. From a plurality of descriptor lists stored in a plurality of entries of a cache memory, a set of candidate descriptor lists is determined. The set of candidate descriptor lists includes one or more of the plurality of descriptor lists in a prefetch only state. An eviction event can be detected by detecting a first eviction condition including a state of the global eviction timer and a second eviction condition. In response to detecting the eviction event, a descriptor list from the set of candidate descriptor lists is selected for eviction. The selected descriptor list can be evicted from the cache memory.

Abstract: Descriptor fetch for a direct memory access system includes obtaining a descriptor for processing a received data packet. A determination is made as to whether the descriptor is a head descriptor of a chain descriptor. In response to determining that the descriptor is a head descriptor, one or more tail descriptors are fetched from a descriptor table specified by the head descriptor. A number of the tail descriptors fetched is determined based on a running count of a buffer size of the chain descriptor determined as each tail descriptor is fetched compared to a size of the data packet.

Abstract: In one example, an integrated circuit (IC) is provided that includes data circuitry and a processing circuitry. The data circuitry is configured to provide data to be transferred to a different circuitry within the IC or to an external IC. The processing circuitry is configured to: read the data provided by the data circuitry before it is transferred to the different circuitry or the external IC; calculate a first signature for the data; attach the first signature to the data; calculate, after transferring the data to the different circuitry or the external IC, a second signature for the data; extract the first signature corresponding to the data; compare the first signature to the second signature; and generate a signal based on a comparison of the first signature to the second signature.

Abstract: Embodiments herein describe techniques for preparing and executing tasks related to a database query in a database accelerator. In one embodiment, the database accelerator is separate from a host CPU. A database management system (DBMS) can offload tasks corresponding to a database query to the database accelerator. The DBMS can request data from the database relevant to the query and then convert that data into one or more data blocks that are suitable for processing by the database accelerator. In one embodiment, the database accelerator contains individual hardware processing units (PUs) that can process data in parallel or concurrently. In order to process the data concurrently, the data block includes individual PU data blocks that are each intended for a respective PU in the database accelerator.

Abstract: An integrated circuit (IC) device includes a controller circuitry having an input connected to a photodiode of an optoelectronic circuitry and an output connected to a biasing circuitry, the biasing circuitry having an input connected to the output of the controller circuitry, the controller circuitry configured to transmit a transimpedance control signal code to the biasing circuitry configured to cause the biasing circuitry to offset a DC current component of the output of the photodiode.

Abstract: A device may include a processor system and an array of data processing engines (DPEs) communicatively coupled to the processor system. Each of the DPEs includes a core and a DPE interconnect. The processor system is configured to transmit configuration data to the array of DPEs, and each of the DPEs is independently configurable based on the configuration data received at the respective DPE via the DPE interconnect of the respective DPE. The array of DPEs enable, without modifying operation of a first kernel of a first subset of the DPEs of the array of DPEs, reconfiguration of a second subset of the DPEs of the array of DPEs.

Abstract: A method for die pair partitioning can include providing a first circuit die having a first metal stack. The method can additionally include positioning a second circuit die having a second metal stack in a manner that places a temperature sensor in a transistor layer of the second circuit die in planar proximity to at least one hot spot located in an additional transistor layer of the first circuit die. The method can also include connecting the first metal stack of the first circuit die to the second metal stack of the second circuit die. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A method for circuit die stacking can include providing a first circuit die having a first metal stack, wherein the first circuit die corresponds to a primary thermal source of an integrated circuit including the first circuit die. The method can additionally include providing a second circuit die of the integrated circuit, wherein the second circuit die has a second metal stack and is configured for connection to at least one of a package substrate or an additional die. The method can also include connecting the first metal stack to the second metal stack. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A method for providing backside power can include providing a first circuit die having a first metal stack. The method can also include connecting a second metal stack of a second circuit die to the first metal stack of the first circuit die, wherein a backside power delivery network is located in a passivation layer of at least one of the first circuit die or the second circuit die. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: An emulation system can include a first integrated circuit (IC) including first circuitry and a first transceiver. The first circuitry is configured to emulate a first partition of a circuit design. The first circuitry is clocked by an emulation clock and the first transceiver is clocked by a transceiver clock asynchronous with the emulation clock. The transceiver clock has a higher frequency than the emulation clock. The emulation system can include a second IC configured to emulate a second partition of the circuit design. The second IC includes a second transceiver. The first transceiver is configured to generate multiplexed emulation data by multiplexing a plurality of nets that cross from the first partition to the second partition of the circuit design. The first transceiver is configured to send the multiplexed emulation data over a serial communication channel to the second transceiver. The multiplexed emulation data includes a clock signal of the first transceiver embedded therein.