Abstract: In a method relating generally to starting a plurality of transmitters, a sequence is initiated for each of the plurality of transmitters having corresponding data buffers. Latency is set for each of the data buffers responsive to execution of the sequence. The sequence includes: obtaining a read address associated with a read clock signal; obtaining a write address associated with a write clock signal; determining a difference between the read address and the write address; asserting a flag signal associated with the difference; and adjusting the read clock signal to change the difference to locate a change of state location for the flag signal to set the latency for a data buffer of the data buffers.

Abstract: Methods and circuits are disclosed for forward-error-correction (FEC) decoding. A plurality of symbols are received in an interleaved format of rows and columns of the symbols. A plurality of FEC decoding iterations are performed on the plurality of symbols. Each decoding iteration performs FEC decoding of the rows of the plurality of symbols and performs FEC decoding of the columns of the plurality of symbols. After performing the decoding iterations, rows in error and columns in error of the plurality of symbols are determined. In response to the determined rows in error and the determined columns in error matching a deadlock pattern, symbols at intersections of the determined rows and columns in error are determined. Bits of one or more symbols of the determined symbols are inverted. After the inverting of the bits, one or more of the FEC decoding iterations are performed.

Abstract: Systems, devices, and circuits for source-synchronous memory interfaces are disclosed. For example, a device includes a first NAND gate with an input for receiving a serial mode enable signal. In addition, the device also includes a second NAND gate with an input for receiving a forwarded strobe signal and an input for receiving an output of the first NAND gate. The device also includes a third NAND gate with an input for receiving a data strobe signal, and an XNOR gate with an input for receiving an output of the second NAND gate and an input for receiving an output of the third NAND gate.

Abstract: A master-slave flip-flop implemented in an integrated circuit comprises a master latch coupled to receive data at an input; and a slave latch coupled to an output of the master latch, wherein the slave latch comprises an SEU-enhanced latch, and the master latch is not enhanced for SEU protection. A method of implementing a master-slave flip-flop in an integrated circuit is also described.

Abstract: Examples generally provide a stacked silicon interconnect product and method of manufacture. The stacked silicon interconnect product includes a silicon substrate-less interposer comprising a plurality of metallization layers, wherein at least one metallization layer includes a plurality of metal segments separated by dielectric material. The stacked silicon interconnect product also includes a first die coupled to a first side of the silicon substrate-less interposer via a first plurality of microbumps. The stacked silicon interconnect product further includes a second die coupled to a second side of the silicon substrate-less interposer via a second plurality of microbumps, the second die communicatively coupled to the first die through a metallization layer of the plurality of metallization layers.

Abstract: To implement a circuit design on a programmable integrated circuit (IC), first data are generated for implementing the circuit design. Critical and non-critical portions of the circuit design are determined, and second data are generated for programming configuration memory cells of the programmable IC to implement the circuit design. A first subset of the second data is assigned to program a first type of configuration memory cells to implement the critical portion of the circuit design on a first subset of programmable logic resources and a first subset of programmable interconnect resources of the programmable IC. A second subset of the second data is assigned to program a second type of configuration memory cells to implement the non-critical portion of the circuit design on a second subset of programmable logic resources and a second subset of programmable interconnect resources. The second data are stored in an electronically readable storage medium.

Abstract: In a receiver, there is a precursor iterative canceller (“PIC”) having first and second paths. A postcursor decision block is coupled to the PIC to provide a decision signal thereto. The PIC includes: comparators for receiving an input signal and corresponding threshold inputs for precursor ISI speculation; and select circuits for selecting a first speculative input for the first path and a second speculative input for the second path, respectively associated with a negative precursor contribution and a positive precursor contribution. The first path and the second path in combination include at least a first stage and a second stage for processing the first speculative input and the second speculative input. The decision signal is provided to the first stage and to the select circuits. The select circuits are coupled to receive the decision signal for selection of the first speculative input and the second speculative input.

Abstract: Emulating power gating includes identifying an isolation circuit having a first input coupled to an output of a first power domain, a second input coupled to an isolation signal, and an output coupled to an input of a second power domain; removing a power gate circuit configured to selectively decouple the first power domain from a power supply responsive to a power gate signal; and decoupling the first input of the isolation circuit from the output of the first power domain. A power gate emulation circuit is inserted using a processor. The power gate emulation circuit is coupled to the isolation signal, the power gate signal, and the output of the first power domain.

Abstract: In one approach for processing a data packet, in at least one stage of a plurality of stages of a pipeline circuit, a respective packet field value is extracted from the data packet. In each stage of the plurality of stages, a respective tuple field value is inserted into a respective tuple register of the stage at a respective offset. The respective tuple field value in the at least one stage is based on the respective packet field value. In each stage of the plurality of stages except a last one of the stages, the contents of the respective tuple register of the stage are provided as input to a next one of the stages.

Abstract: Estimating power consumption of a circuit design includes associating, using a processor, each partition of a plurality of partitions of a circuit design with a probability distribution (315). For each partition, the associated probability distribution specifies a distribution for a probability distribution parameter correlated with power consumption for the partition. Using the processor, an output probability distribution specifying power consumption of the circuit design can be calculated according to the probability distribution of each partition of the circuit design (320).

Abstract: One approach for authenticating data includes storing a plurality of combinations of representations of public keys and session key IDs in a non-volatile memory. A payload and accompanying public key, session key ID, and signature of the payload are input. The signature is a function of the payload and a private key of a key pair that includes the accompanying public key and the private key. Authenticity of the payload is determined based on the accompanying public key and session key ID and the combinations stored in the non-volatile memory, and from the signature and the payload. In response to determining that the payload is authentic, the payload is processed, and in response to determining that the payload is not authentic, processing of the payload is disabled.

Abstract: A circuit includes a first finger capacitor having a first bus line coupled to a first plurality of finger elements and a second bus line coupled to a second plurality of finger elements. The first bus line is parallel to the second bus line. The circuit further includes an inductor having a first leg oriented perpendicular to the first bus line and the second bus line. The first leg of the inductor is coupled to a center of the first bus line.

Abstract: Compiling a circuit design includes receiving the circuit design specified in a hardware description language, detecting, using a processor, a slice of a vector within the circuit design, and determining that the slice is defined by a left slice boundary variable and a right slice boundary variable. A hardware description is generated from the circuit design using the processor by including a first shifter circuit receiving the left slice boundary variable as an input signal, a second shifter circuit receiving the right slice boundary variable as an input signal, a control signal generator coupled to the first and second shifter circuits, and an output stage. The output stage, responsive to a control signal dependent upon an output from the first shifter circuit and an output from second shifter circuit, generates an output signal including newly received values from a data signal only for bit locations of the output signal corresponding to the slice.

Abstract: In an example, a capacitor in an integrated circuit (IC), includes: a first finger capacitor formed in at least one layer of the IC having a first bus and a second bus; a second finger capacitor formed in the at least one layer of the IC having a first bus and a second bus, where a longitudinal edge of the second bus of the second finger capacitor is adjacent a longitudinal edge of the first bus of the first finger capacitor and separated by a dielectric gap; and a first metal segment formed on a first layer above the at least one layer, the first metal segment being electrically coupled to the first bus of the first finger capacitor and increasing a width and a height of the first bus of the first finger capacitor.

Abstract: In an adaptation module relating generally to adaptive optical channel compensation, an analysis module is coupled to receive a first data signal and a second data signal and coupled to provide first information and second information. A comparison module is coupled to compare the first information and the second information to provide third information. An adjustment module is coupled to receive the third information to provide fourth information to compensate for distortion in the second data signal with reference to the first data signal. The second data signal is associated with a conversion of the first data signal to an optical signal for communication via an optical channel.

Abstract: An exemplary interconnect circuit for a programmable integrated circuit (IC) includes an input terminal coupled to receive from a node in the programmable IC, an output terminal coupled to transmit towards another node in the programmable IC, first and second control terminals coupled to receive from a memory cell of the programmable IC, and a complementary metal oxide semiconductor (CMOS) pass-gate coupled between the input terminal and the output terminal and to the first and second control terminals. The CMOS pass-gate includes a P-channel transistor configured with a low threshold voltage for a CMOS process used to fabricate the programmable IC.

Abstract: In an exemplary system, a first sampling circuit is coupled to a clock module to receive values therefrom. A second sampling circuit is coupled to the clock module to receive the values therefrom. The first sampling circuit includes a first converter, a first phase interpolator, and a first sampler. The first converter is coupled to replace the values with first replacement values for input to the first phase interpolator. The second sampling circuit includes a second converter, a second phase interpolator, and a second sampler. The second converter is coupled to replace the values with second replacement values for input to the second phase interpolator.

Abstract: An integrated circuit (IC) includes a bridge circuit configured to receive a first request from an external system, a discover circuit coupled to the bridge circuit and configured to process the first request received from the bridge circuit, and a memory map coupled to the discover circuit. The memory map stores a record for each of a plurality of Intellectual Property (IP) blocks implemented within the IC. The discover circuit is configured to generate a list of the IP blocks implemented within the IC from the records of the memory map responsive to the first request. The bridge circuit is configured to send the list to the external system.

Abstract: In one example, a programmable integrated circuit (IC) includes a first logic tile in a first power domain having a first local voltage. The first logic tile includes a driver operable to use the first local voltage to output a signal having a logic-level referenced to the first local voltage. The first logic tile further includes a level-shifter coupled to receive the signal from the driver and operable to output a level-shifted signal having a logic-level referenced to a global handshaking voltage. The programmable IC further includes a second logic tile in a second power domain having a second local voltage, the second logic tile including a receiver operable to use the second local voltage to receive the level-shifted signal. The global handshaking voltage is at least as high as the first local voltage and at least as high as the second local voltage.

Abstract: In an example, an integrated circuit (IC) package includes a package substrate, an IC die, solder bumps, a first plurality of trenches, and underfill material. The IC die includes a front surface and a back surface, the front surface facing the package substrate and including a conductive interface. The solder bumps couple the conductive interface to the package substrate. The first plurality of trenches includes at least one trench proximate each corner of the IC die formed in the front surface of the IC die in an area between the conductive interface and a perimeter of the IC die. The underfill material is disposed between the front surface of the IC die and the package substrate, the underfill material being in contact with the first plurality of trenches.