Abstract: Proposed is a layer structure (1100, 1030) comprising a crystalline piezoelectric III-N layer (1110, 1032) epitaxially grown over a metal layer which is epitaxially grown over a rare earth oxide layer on a semiconductor (1102, 1002). The rare earth oxide layer includes at least two discrete portions (1104, 1004), and the metal layer includes at least one metal portion (1108, 1006) that partially overlaps adjacent discrete portions, preferably forming a bridge over an air gap (1008), particularly suitable for RF filters.

Abstract: A display device includes a substrate, a first wiring and a second wiring positioned on the substrate, a thin film transistor (“TFT”) connected to the first wiring and the second wiring, and a pixel electrode connected to the TFT and including a transverse branch part, a longitudinal branch part, minute branches extending from the transverse branch part and the longitudinal branch part, and an outer branch part connecting end parts of the minute branches and adjacent to the storage electrode line, where a shortest distance from a center part of at least one side of the outer branch part to at least one side of the first wiring is different from a shortest distance from an edge part of at least one side of the outer branch part to at least one side of the first wiring.

Abstract: A semiconductor microcooler is fabricated by forming fins in a semiconductor substrate and forming a metal layer upon the fins. A stacked microcooler may be formed by stacking a plurality of semiconductor microcoolers. The microcoolers may be positioned such that the fins of each microcooler are vertically aligned. The microcoolers may include an inlet passage to accept coolant and an outlet passage to expel the coolant. One or more microcoolers may be thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the passages and heat from the one or more microcoolers may transfer to the liquid coolant.

Abstract: A semiconductor device includes gate stacked structures surrounding channel layers, a common source line filling a separation area between the gate stacked structures adjacent to each other and having an upper surface including first concave portions, and a support insulating layer filling the first concave portions and having sidewalls facing portions of the channel layers.

Abstract: A display apparatus includes a first display area including a first display unit configured to generate light and a first encapsulation unit disposed on the first display unit; a second display area including a second display unit configured to generate light and a second encapsulation unit disposed on the second display unit; and a through area disposed between the first display area and the second display area. The first encapsulation unit includes a first encapsulation layer covering a first side of an area of the first display unit corresponding to the through area. The second encapsulation unit includes a second encapsulation layer covering a second side of an area of the second display unit corresponding to the through area.

Abstract: A semiconductor microcooler is fabricated by forming fins in a semiconductor substrate and forming a metal layer upon the fins. A stacked microcooler may be formed by stacking a plurality of semiconductor microcoolers. The microcoolers may be positioned such that the fins of each microcooler are aligned. One or more microcoolers may be thermally connected to a surface of a coolant conduit that is thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the conduit and heat from the one or more microcoolers may transfer to the liquid coolant.

Abstract: A display panel measures a contact resistance of an adhesive portion to evaluate adhesion quality of an integrated circuit mounted thereon. The display panel includes a plurality of light-emitting elements, a first pad part including a plurality of first effective pads electrically connected to the light-emitting elements, and n (n being a natural number equal to or greater than 2) first measuring pads insulated from the light-emitting elements, a conductive adhesive film on the first pad part and including a plurality of conductive balls, an integrated circuit on the conductive adhesive film, and including an internal line electrically connected to the first measuring pads by the conductive balls, and a second pad part including a plurality of second effective pads electrically connected to the first effective pads, and 2n second measuring pads electrically connected to the first measuring pads.

Abstract: An electro-optical apparatus includes a first pixel and a second pixel. The first pixel and the second pixel include a reflective layer, an insulating layer, a functional layer, and an opposing electrode. The insulating layer includes a first insulating layer, a second insulating layer having a first opening, and a third insulating layer having a second opening. A first pixel electrode is provided on the first insulating layer in the first opening. A second pixel electrode is provided on the second insulating layer.

Abstract: The present technology relates to a solid-state imaging device that can achieve a higher resolution while increasing sensitivity. In a pixel array unit, pixels are formed with a combination of a first pixel that performs photoelectric conversion on light of a first color component with a first photoelectric conversion unit, and photoelectric conversion on light of a third color component with a second photoelectric conversion unit; a second pixel that performs photoelectric conversion on light of the first color component with a first photoelectric conversion unit, and on light of a fifth color component with a second photoelectric conversion unit; and a third pixel that performs photoelectric conversion on light of the first color component with a first photoelectric conversion unit, and on light of a sixth color component with a second photoelectric conversion unit. The first color component and the sixth color component are mixed, to generate white (W).

Abstract: Small LED sources with high brightness and high efficiency apparatus including the small LED sources and methods of using the small LED sources are disclosed.

Abstract: A package includes a device die, a molding material encircling the device die, wherein a top surface of the molding material is substantially level with a top surface of the device die, and a bottom dielectric layer over the device die and the molding material. A plurality of redistribution lines (RDLs) extends into the bottom dielectric layer and electrically coupling to the device die. A top polymer layer is over the bottom dielectric layer, with a trench ring penetrating through the top polymer layer. The trench ring is adjacent to edges of the package. The package further includes Under-Bump Metallurgies (UBMs) extending into the top polymer layer.

Abstract: A display device may include an insulation layer having openings, the insulation layer having opening edges around the respective openings; pixel electrodes in the respective openings and on the respective opening edges; an electroluminescence layer continuously on the pixel electrodes, the electroluminescence layer consisting of some layers including a bottom layer thereof, the electroluminescence layer including a light emitting layer in one of the layers except for at least the bottom layer, the light emitting layer overlapping with a corresponding one of the pixel electrodes; and a counter electrode on the electroluminescence layer.

Abstract: A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.

Abstract: An organic light-emitting display panel and a display apparatus are provided. An exemplary organic light-emitting display panel includes a base substrate; a pixel definition layer including a plurality of openings and disposed on the base substrate; and a plurality of sub-pixels. A sub-pixel includes an organic light-emitting diode; and at least a portion of the organic light-emitting diode is in an opening. The plurality of sub-pixels include at least one first sub-pixel; and at least one isolation element is disposed in the opening corresponding to the at least one first sub-pixel.

Abstract: An organic light-emitting display panel, includes an array substrate including a flexible substrate and a thin film transistor layer placed on the flexible substrate; an organic light-emitting component placed on the array substrate, including a plurality of light-emitting units; a packaging layer placed on aside of the organic light-emitting component away from the array substrate, the packaging layer including a first inorganic packaging layer and a first organic packaging layer, the first inorganic packaging layer and the first organic packaging layer being placed in order on a side of the packaging layer along a direction away from the array substrate; wherein the first organic packaging layer includes a plurality of scattering particles, refractive indexes of the first inorganic packaging layer, the first organic packaging layer and the scattering particle are defined as n1, n2 and n3 respectively, and n2 is different from n3.

Abstract: A display device includes a display panel and a housing capable of accommodating the display panel. The display panel includes a first display region and a second display region and is flexible. Display in the first display region and display in the second display region are visually recognizable in a first direction in a state where the display panel is taken out from the housing. The display in the second display region is visually recognizable in a second direction opposite to the first direction in a state where the display panel is accommodated in the housing.

Abstract: A power generation system includes a power generator operatively connected to a plurality of sensors and a processor. The processor is configured to observe usage-based or event-based data regarding one or more components and consumables of the power generator. A usage-based service schedule is observed for the one or more event-based components and consumables. Operation-based data is received from the plurality of sensors regarding the functioning of the power generation system and one or more operation-based components and consumables of the power generator. An operation-based service schedule is determined for the one or more operation-based components and consumables based on the operation-based data. A blended service schedule is generated, the blended service schedule including the usage-based service schedule and the operation-based service schedule. The blended service schedule is then provided to at least one of a local monitor or a remote monitor.

Abstract: A manufacturing method of a display device according to some embodiments includes: forming a protrusion pattern on a carrier glass; coating a polymer on the protrusion pattern to form a polymer layer; forming a stacked structure on the polymer layer, including a transistor and an organic light emitting element connected to the transistor; and separating the carrier glass and the protrusion pattern from the polymer layer, wherein an opening penetrating the polymer layer is formed during the separation of the protrusion pattern.

Abstract: An organic light emitting element includes a first electrode; a first organic layer on the first electrode; a second organic layer on the first organic layer; a second electrode on the second organic layer; and a mixed layer between the first organic layer and the second organic layer. A gap between a highest occupied molecular orbital (HOMO) energy level of the first organic layer and a lowest unoccupied molecular orbital (LUMO) energy level of the second organic layer may be in a range from about 1.35 eV to about 1.70 eV. The mixed layer may emit light having a wavelength in a range from about 740 nm to about 950 nm by exciplex.

Abstract: MEMS device, in which a body made of semiconductor material contains a chamber, and a first column inside the chamber. A cap of semiconductor material is attached to the body and forms a first membrane, a first cavity and a first channel. The chamber is closed on the side of the cap. The first membrane, the first cavity, the first channel and the first column form a capacitive pressure sensor structure. The first membrane is arranged between the first cavity and the second face, the first channel extends between the first cavity and the first face or between the first cavity and the second face and the first column extends towards the first membrane and forms, along with the first membrane, plates of a first capacitor element.