Abstract: A heatsink shield with thermal-contact dimples can improve thermal-energy distribution in a radar assembly. The radar assembly includes a printed circuit board (PCB), the heatsink shield, a radome, and a housing. The PCB can include integrated circuits and other components, along with a thermally-conductive material that covers at least a portion of the PCB surfaces. The heatsink shield includes multiple dimples that thermally contact the thermally-conductive material. The heatsink shield is configured to distribute thermal energy produced at least in part by the PCB components to the housing. In this way, the described techniques and systems permit the radar assembly to better distribute thermal energy away from the PCB components to the rest of the PCB and through the housing.

Abstract: An electronic device includes a printed board, a frame for fixing the printed board, a connector fixed at a position along one side of a front surface of the printed board, and an electrically conductive member. An indented portion is formed at a position of the one side facing the connector. The electrically conductive member has a portion arranged in the indented portion, and is expanded and contracted in a direction along the one side and a thickness direction of the printed board by an external force. The electrically conductive member has an upper surface, a lower surface, and a side surface in contact, respectively, with a shell of the connector, one surface of the frame, at least one side-surface portion which is part of a portion forming the indented portion and extends along a direction crossing the one side. The electrically conductive member is electrically connected with a ground of the printed board via the side-surface portion.

Abstract: The disclosure relates to an immersion cooling apparatus configured to accommodate and cool at least one heat source. The immersion cooling includes a tank, a coolant, and at least one condenser. The coolant is accommodated in the tank and configured to direct thermal contact the at least one heat source. At least part of the at least one condenser is immersed in the coolant.

Abstract: An electronic device may include a backplane and an electrical connector carried by a front side of the backplane, and a circuit board assembly removably coupled to the electrical connector. Each circuit board assembly may include a circuit board and electronic components carried by the circuit board and generating waste heat, and a cooling fluid arrangement thermally coupled to the electronic components. The electronic device may include a cooling fluid manifold, and a pair of multi-functional tubes that provide alignment, keying, structural rigidity and fluid supply and return capabilities extending between the cooling fluid manifold and the cooling fluid arrangement.

Abstract: A fusible switch disconnect device includes a housing adapted to receive at least one fuse therein, and a switchable contact for connecting the fuse to circuitry. A current detecting element, a tripping mechanism, and control circuitry are provided to move the switchable contact to an open position in response to predetermined electrical current conditions in the device.

Abstract: There is disclosed a device for cooling a server rack within a server room having a first chamber and a second chamber, the device comprising: a main chilling unit; a heat exchanging unit operatively coupled to the main chilling unit; the main chilling unit including a housing for housing: an evaporator; a first airlock device to removably secure the main chilling unit to the server rack from a side of the first chamber; a first fan configured to force air from the first chamber to the second chamber; the heat exchanging unit including a housing for housing: a condenser in fluid communication with the evaporator, the condenser being configured to transmit heat from the liquid coolant to air surrounding the condenser; a second airlock device configured to removably secure the heat exchanging unit to the second chamber; a second fan configured to blow the heated air into the second chamber.

Abstract: The invention relates to a cooling device for cooling a power component, the cooling device having a one-piece cooling housing with a base, a first end face, a second end face, a first lateral face, and a second lateral face, which define a receiving area for receiving the power component. The cooling device further includes an inlet for supplying a cooling medium, an outlet for discharging a cooling medium, a first cooling channel, a second cooling channel, a third cooling channel, and a fourth cooling channel. The first cooling channel is arranged on the first end face, the second cooling channel is arranged on the second end face, the third cooling channel is arranged on the first lateral face, the fourth cooling channel is arranged on the second lateral face, and the first and the second cooling channel are each fluidically connected to the third and fourth cooling channel.

Abstract: Provided is a cooling apparatus for a semiconductor module including a semiconductor chip, the apparatus including a ceiling plate having a bottom surface; and a case portion having two sets of opposing edges in an overhead view, and including a flow portion arranged on the plate's bottom surface side and allowing coolant to flow therethrough, an outer edge portion surrounding the flow portion, and a side wall provided on the outer edge portion's inner side, the side wall including a first constricted portion changing the flow portion's width in a first direction parallel to one of the edge sets, along a second direction orthogonal to the first direction, a fastening portion for fastening the plate and the case portion to an external apparatus provided where the plate and the outer edge portion are overlapped and arranged, and the fastening portion arranged opposite the first constricted portion in the first direction.

Abstract: A high voltage electric switchboard in which manufacturing productivity is greatly improved and each functional part can be easily replaced and repaired is provided. In the high voltage electric switchboard, a plurality of functional parts including a bus bar part, a measurement and supervisory controller, a circuit breaker part, a wire part, and potential transformer part are independently modularized such that the functional parts do not have a shared surface with each other and at least two outer surfaces of an enclosure of each of the modularized functional parts are installed to be in contact with an outer surface of an enclosure of another functional part adjacent in a horizontal direction or a vertical direction.

Abstract: An electronic unit includes a first case made of metal; a second case made of metal; a frame made of synthetic resin arranged inside an assembly of the first case and the second case; a relay member made of metal that is separate from the frame and includes a first connection portion electrically connected to the first case, a second connection portion electrically connected to the second case, and a coupling portion coupling the first connection portion and the second connection portion; a first screw that passes through the first case and the first connection portion from the outside of the first case and is fixed to the frame; and a second screw that passes through the second case and the second connection portion from the outside of the second case and is fixed to the frame.

Abstract: An information handling system includes an enclosure having a front portion and a rear portion. An exhaust duct is located in between a first central processing unit and a first set of downstream components within the rear portion. The exhaust duct directs first airflow from the first central processing unit out of the information handling system without the first airflow reaching an inlet of the first set of downstream components. A first top cover is attached to the rear portion. The first top cover includes a first hole cut above the exhaust duct. The first hole enables the first airflow to escape from the rear portion.

Abstract: A cooling system for an eco-friendly vehicle is provided. The system includes an electronic component cooling device that cools an electronic component of an eco-friendly vehicle and a battery cooling device that cools a battery installed within the eco-friendly vehicle. A connector connects the electronic component cooling device and the battery cooling device with each other.

Abstract: A fusible switch disconnect device includes a housing adapted to receive at least one fuse therein, and a switchable contact for connecting the fuse to circuitry. A tripping mechanism including an electromagnetic coil is operable to move the switchable contact to an open position in response to a predetermined electrical condition when the fuse is engaged and when the switchable contact is in the closed position.

Abstract: This disclosure describes systems for arranging racks within a data center for a smaller and/or more flexible footprint, more efficient and/or resilient cooling, and/or easier installation. In some examples, this disclosure describes a data center rack system that includes an aisle and a plurality of rack stations adjacent to the aisle. The aisle includes an aisle guidance track defining an aisle axis. Each rack station of the plurality of rack stations includes a station guidance track defining a station axis. The station guidance track is configured to receive a rack from the aisle guidance track and position the rack in the respective rack station at a rack angle formed between the aisle axis and the station axis that is less than 90 degrees.

Abstract: The breaker 1 is provided with a fixed contact 20, a movable piece 4 extending in a first direction (D1), a thermally actuated element 5, a case 7 accommodating the movable piece 4 and the thermally actuated element 5, and a terminal piece 2 which partially protrudes outside the case 7 and is to be electrically connected with an external circuit. The terminal piece 2 has a first portion 21 and a second portions 22 having different heights from a bottom surface of the case 7, a first bent portion (23a) bent in a first bending direction, and a second bent portion (23b) bent in a second bending direction opposite to the first bending direction. The first bent portion (23a) and the second bent portion (23b) extend in parallel with the first direction (D1).

Abstract: Implants or sensors often include and rely on inductive and ferromagnetic electrical components to measure and communicate data outside of the body to an external device, creating a safety concern when a patient with these implants or sensors must undergo an MRI scan. Further, various external devices that include inductive and ferromagnetic electrical components are exposed to potentially damaging MRI scans. An electrical coil assembly can include an electrical coil that includes a substrate and an electrical conductor supported by a first face of the substrate. In an example, the electrical coil assembly further includes a fuse element that is configured to move from a disengaged position in which the electrical fuse conductor is out of contact with the electrical conductor to an engaged position in which the electrical fuse conductor contacts the electrical conductor so as to define a short circuit.

Abstract: A vehicle power module assembly including first and second power modules is provided. The first power module may include a first lock feature extending from a lower portion of a first minor side at a first central axis. The second power module may include a second lock feature at an upper portion of a second minor side at a second central axis. The lock features may be sized for interlock with one another to secure the power modules to one another. The first lock feature may be a loop element defining a through-hole and the second lock feature may be a wedge. The through-hole may be sized for the wedge to extend therein and to interlock the first power module and the second power module to one another. The first lock feature may be a flexible hook element and the second lock feature may be a slot.

Abstract: A storage device includes a casing; a drive that records data; a controller that controls a data processing of the drive; and a midplane that connects the drive to the controller, in which the midplane includes a plurality of split midplanes which are replaceable, a drive side connector is disposed on a drive side of the split midplane, and the drive side connector is connected to the drive.

Abstract: An electrical junction box includes a conductive input busbar, a conductive output busbar electrically connectable to the input busbar, a semiconductor relay electrically connected to the input busbar and the output busbar and configured to switch a connected state and a disconnected state of the input busbar and the output busbar, a substrate having mounted thereon a control circuit configured to output a control signal for controlling the semiconductor relay, and a control terminal electrically connecting the control circuit and the semiconductor relay to each other to output the control signal to the semiconductor relay. The semiconductor relay is mounted on at least one of the input busbar and the output busbar. The input busbar, the output busbar, and the semiconductor relay are disposed away from the substrate.

Abstract: A cooled electronic circuit board (10) comprising: a support circuit board (11) equipped with sockets (12a, 12b, 12c) mutually alongside each other for DIMM storage modules (13); DIMM storage modules (13) each equipped with a plug (14) which can be coupled with one of the sockets (12a, 12b, 12c); two supports (15, 16) for storage modules (13), having respective channels (17) for the passage of a cooling liquid; thermal conduits (18) connected to the channels (17), each located between two adjacent sockets (12a, 12b, 12c) of the support circuit board (11); heat diffusers (19) each equipped with two walls (20, 21) each covering a side of one of the storage modules (13). The heat diffusers (19) are designed in such a way that, in use, two of the adjacent heat diffusers are in mutual thermal contact and in thermal contact with the thermal conduits (18) and with the supports (15, 16).