Abstract: A method of operating a mechanical switching device is disclosed. The switching device includes a housing, an assembly disposed in the housing, and a body. The assembly is thermally deformable and comprises a beam held in two different places by two arms secured to edges of the housing. The beam is remote from the body in a first configuration and in contact with and immobilized by the body in a second configuration. The assembly has the first configuration at a first temperature and the second configuration when one of the arms has a second temperature different from the first temperature. The method includes exposing an arm of the assembly to the second temperature, and releasing the beam using a release mechanism. The release mechanism includes a pointed element comprising a pointed region directed towards the body. The pointed element limits an open crater in a concave part of a projection.

Abstract: A coupling for connecting a circuit board to a mount with a fastener. The mount may be connected to a component. The fastener includes a first snap-fit connection formation for establishing a snap-fit connection with a second snap-fit connection formation provided on the mount. When connected, the fastener clamps the circuit board against the mount. The fastener further includes a first engagement formation configured to engage with a second engagement formation on the mount for bracing the snap-fit connection.

Abstract: A fan assembly includes a socket to receive a fan module, a fan flap coupled to a first side wall of the socket, and an anti-reflow device coupled to a second side wall of the socket. The fan flap moves in a curved path between a first position and a second position. The anti-reflow device has an attachment feature, an embossed feature, and a stopping feature. The attachment feature attaches the anti-reflow device to the second side wall. The embossed feature extends through a first aperture in the second side wall. The stopping feature extends through a second aperture in the second side wall and contacts the fan flap. When the fan module is removed, the stopping feature retains the fan flap in the first position to block the socket and prevent air from reflowing through the socket.

Abstract: A laser remote control switching system comprises a laser source and a control circuit. The control circuit comprises a power, an electronic device, a first electrode, a second electrode, and a photosensitive element electrically connected in sequence to form a loop. Each of the two nanofiber actuators comprises a composite structure and a vanadium dioxide layer. The composite structure comprises a carbon nanotube wire and an aluminum oxide layer. The aluminum oxide layer is coated on a surface of the carbon nanotube wire, and the aluminum oxide layer and the carbon nanotube wire are located coaxially with each other. The vanadium dioxide layer is coated on a surface of the composite structure, and the vanadium dioxide layer and the composite structure are located non-coaxially with each other.

Abstract: A 2-in-1 power electronics assembly includes a frame with a lower dielectric layer, an upper dielectric layer spaced apart from the lower dielectric layer, and a sidewall disposed between and coupled to the lower dielectric layer and the upper dielectric layer. The lower dielectric layer includes a lower cooling fluid inlet and the upper dielectric layer includes an upper cooling fluid outlet. A first semiconductor device assembly and a second semiconductor device assembly are included and disposed within the frame. The first semiconductor device is disposed between a first lower metal inverse opal (MIO) layer and a first upper MIO layer, and the second semiconductor device is disposed between a second lower MIO layer and a second upper MIO layer. An internal cooling structure that includes the MIO layers provides double sided cooling for the first semiconductor device and the second semiconductor device.

Abstract: This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

Abstract: A power distribution panel for distributing power to a plurality of components. A modular frame may removably attach in an aperture of a side of a chassis. A first module may be removably attached in an opening of the modular frame. A second module, different from the first module, may be removably attached in the opening of the modular frame.

Abstract: A power converter (100) includes a power converter circuit (1), a cooler (2), and a cover member (3). The power converter circuit is configured to convert input electric power into DC power or AC power. The power converter circuit is placed on the cooler. The cooler is configured to cool the power converter. The power converter circuit is housed between the cooler and the cover member. The cooler (2) includes a main body (20), a coolant flow passage (21), and a coolant input/output portion (22). The coolant flow passage is formed inside the main body. A coolant is circulatable through the coolant flow passage. The coolant input/output portion is coupled to the coolant flow passage. The coolant input/output portion includes a coolant introduction pipe (22a) and a coolant discharge pipe (22b). The coolant introduction pipe introduces the coolant from outside the cooler. The coolant discharge pipe discharges the coolant to outside the cooler. The coolant input/output portion (22) is joined to the main body.

Abstract: A portable information handling system structure located between housing hinges along one side of the housing has first and second antenna disposed at opposing ends with a cooling fan between the first and second antenna and over the antenna structure to isolate the first and second antenna. In one embodiment, a parasitic element disposed between the first and second antenna and under the cooling fan has resonance tuned to isolate wireless signals of a frequency supported by the first and second antenna.

Abstract: A sensor module includes: a flexible printed circuit board; a temperature sensor disposed on the flexible printed circuit board to measure the temperature of a measurement object; a distance sensor disposed on the flexible circuit board adjacent to the temperature sensor to measure the distance to the measurement object; a terminal cover disposed above the temperature sensor and the distance sensor and including a first hole exposing a top surface of the temperature sensor and a second hole exposing a top surface of the distance sensor; and a window disposed in the second hole of the terminal cover.

Abstract: A method, apparatus, and system for stopping a flow of a liquid coolant into, and drawing away a residual portion of the liquid, a portion of a cooling system, e.g., for resistance welding electrodes. The disclosed system does not require more than a single actuator, and in one case uses only a single actuator, coupled to both i) one or more liquid shutoff valves and ii) one or more liquid drawback apparatus. The liquid drawback apparatus draws on the liquid at approximately a same time that the one or more liquid shutoff valves shut off the flow of the liquid from the coolant supply. The liquid drawback apparatus includes a non-return check valve, disposed in the fluid passageway and biased against a normal flow of the liquid from the coolant supply.

Abstract: An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.

Abstract: An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.

Abstract: A wiring module to be attached to a plurality of power elements which store or generate power includes a bus bar connecting the power elements to each other or connecting the power element and a load to each other, an abnormality detection element detecting an abnormality of the power element, and an insulating protector holding the bus bar and the abnormality detection element. The insulating protector is integrally provided with a first holding shaft portion and a second holding shaft portion which position and hold the bus bar by fitting the bus bar there onto, and an element holding portion which position and hold the abnormality detection element by fitting the abnormality detection element there into.

Abstract: The invention relates to A nose cone assembly for a munition, comprising a transducer array operably linked to a transmission assembly, wherein the transducer array is operably connected to a transducer housing, said transducer housing comprising a first and second surface, wherein said transmission assembly is reversibly operably connected to the second surface of said transducer housing, said transmission assembly comprising a control board and a plurality of electronic circuit boards, wherein at least one electronic circuit board is a transceiver circuit board, said electronic circuit boards being reversibly connected to the control board and being arranged along their longest dimension, at an axis substantially perpendicular to the control board and further arranged such that the electronic circuit boards extend radially inwardly to a substantially rotational centre of the control board.

Abstract: An example electrical connector includes a body to receive a circuit board. The body includes a first end and a second end. The electrical connector also includes a first latch rotatably attaches to the first end. The electrical connector further includes a second latch rotatably attaches to the second end. The electrical connector further includes a link member attached to the body. In response to a rotation of the first latch, the link member is to slide across the body from the first latch towards the second latch to rotate the second latch.

Abstract: A holder for an electronic rack includes a pivot point and a first end of the holder having a first blind-mate connector to be coupled to a second blind-mate connector at a first engagement interface. The first blind-mate connector and the second blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack. The holder additionally includes a second end of the holder having a third blind-mate connector to be coupled to a fourth blind-mate connector at a second engagement interface. The third blind-mate connector and the fourth blind-mate connector are coupled in response to the holder moving to the second position in response to contact with the electronic rack.

Abstract: The invention relates to a method for producing a power module (1) and a power module (1), in particular for a medium or high voltage converter (2), comprising at least one power semiconductor module (3), at least one energy storage module (5), at least one cooling device (7), at least two busbars (10), wherein the cooling device (7) is configured to be electrically conductive and is connected to a protective housing (19) shielding at least the power semiconductor module (3) from the environment, which protective housing (19) has at least one insertion opening (20) for inserting and fastening a connecting element (15), and an electrically conductive connecting element (15) is arranged at a predefinable connection position (16) between at least the cooling device (7) and one of the busbars (10) for forming a defined charge-reversal path (17).

Abstract: Ruggedized avionics assemblies for use on kinetically launched space vehicles are disclosed. The avionic assemblies are able to maintain structural integrity and functionality under high acceleration forces generated during kinetic launch, including acceleration forces of >5,000 times Earth's gravity in a single direction of loading. The avionics assembly is ruggedized to withstand this level of acceleration force during launch via a plurality of constraining elements to constrain a plurality of printed circuit boards aligned in parallel to an acceleration vector. Further, a high specific strength and stiffness composition of the plurality of constraining elements aids in supporting the printed circuit boards and preventing them from bending and dislodging electronic components mounted to the printed circuit boards.

Abstract: A solid-state switch assembly includes a base plate and an electrically insulating layer affixed to the base plate. First, second, third, and fourth power traces are affixed to the electrically insulating layer. First semiconductor devices are arranged on the first power trace to control power flow between the first power trace and the second power trace, second semiconductor devices are arranged on the second power trace to control power flow between the second power trace and the third power trace, and third semiconductor devices are arranged on the third power trace to control power flow between the third and fourth power traces. A first signal conductor communicates with the first semiconductor devices. A second signal conductor communicates with the second semiconductor devices. A third signal conductor communicates with the third semiconductor devices.