Abstract: The present invention provides a protective shield for a plasma etcher. The protective shield 40 protects the chamber wall 30 around the etch detect window from plasma etching and electrical arcing. The invention comprises a plasma etcher 10 has a wall 30 surrounding a chamber 14. The wall has an opening 16. The wall 30 having an inside face 30A and an outside face 30B. An opening edge 30C defines the opening 16. A window 24 covers over the opening 16 and over a portion of the outside face 30B of the wall. The protective shield 40 covers the opening edge 30C around the opening 16 and a portion of the inside face 30A of the wall 30 around the opening 16. The shield 40 is composed of an electrically insulating and plasma resistant material whereby the protective shield 40 prevents the chamber from arching and generating particles and extends the lifetime of the wall 30.

Abstract: A process for fabricating dispersion-strengthened ceramic-metal composites is claimed. The process comprises in-situ interaction and chemical reaction of a metal in gaseous form with a ceramic producer in plasma form. Such composites can be fabricated with macroscopic dimensions. Special emphasis is placed on fabrication of dispersion-strengthened aluminum oxide-aluminum composites, which can exhibit flow stresses more characteristic of high strength steel.

Abstract: In the manufacture of a microelectronic component having metallic features on a polyimide layer, the metallic features being spaced from one another by gaps, at least some of which gaps have widths in a range from about one micron to about 500 microns, corrosion protection is provided by plating those features by electroless deposition of a nickel-phosphorus alloy forming a layer having a thickness in a range from about 200 .ANG. to about 3000 .ANG., at a rate of about 100 .ANG. per minute, in an aqueous plating bath comprising nickel sulfate hexahydrate in an amount of about 5.5 grams per liter, sodium hypophosphite in an amount of about six grams per liter, boric acid in an amount of about 30 grams per liter, sodium citrate in an amount of about 45 grams per liter, lead acetate in an amount of about one part per million by weight of lead, and a surfactant in an amount of about 0.1 grams per liter. The bath has a temperature of about 72.degree. C. and a pH of about 8.1.

Abstract: The present invention relates to a method for plating nickel onto metal substrates. The method broadly comprises the steps of passing the metal substrate to be plated through a dilute organic acid bath solution to remove contaminants and other deleterious materials, agitating the bath solution as the metal substrate passes therethrough, and thereafter electrolessly plating nickel on the surfaces of the metal substrate. The method of the present invention may be used to nickel plate substrates formed from steel, copper and aluminum.

Abstract: A device insulating film, a lower-layer platinum film, a ferroelectric film, an upper-layer platinum film, and a titanium film are sequentially formed on a semiconductor substrate in this order. On the titanium film, a photoresist mask is further formed in a desired pattern. The thickness of the titanium film is adjusted to be 1/10 or more of the total thickness of a multilayer film consisting of the upper-layer platinum film, the ferroelectric film, and the lower-layer platinum film. The titanium film is then subjected to dry etching and the photoresist film is removed by ashing process. The titanium film thus patterned is used as a mask in etching the upper-layer platinum film, the ferroelectric film, and the lower-layer platinum film by a dry-etching method using a plasma of a gas mixture of chlorine and oxygen in which the volume concentration of oxygen gas is adjusted to be 40%. During the dry-etching process, the titanium film is oxidized to provide a high etching selectivity.

Abstract: The invention pertains to a process for throughplating of printed circuit boards using conductive plastics for direct plating, wherein a polymer film with intrinsic electric conductivity is adhesively deposited on non-conductive areas of the printed circuit boards, whereupon a metal film is applied. Selective production of the polymer film has previously been seen as requiring an oxidative pre-treatment of the printed circuit board, though this can negatively affect the further course of the process. With the present invention the potential negative effects are avoided by forgoing the oxidation pre-treatment.

Abstract: A method of improving the storage life of goods by storing the goods in an environment comprising heptafluoropropane at pressures of between about 0.1 atmospheres and about 2.0 atmospheres. Foods, pharmaceuticals, and other goods adversely affected by oxygen and/or moisture are effectively stored by the claimed method. The method is particularly effective for goods stored in plastic containers, and for goods stored in containers stoppered by rubber stoppers.

Abstract: A stable aqueous solution comprising a water soluble salt of a magnesium compound, a surfactant and a calcium salt inhibitor is used to reduce deposits in kilns or furnaces used to make iron ore agglomerates, known as pellets, during iron ore calcination.

Abstract: A mixed solvent composition, for cleaning electronic components, which consists essentially of dichloropentafluoropropane and 1,1,1,2,3,4,4,5,5,5-decafluoropentane.

Abstract: A method for forming an aluminum or aluminum alloy plug in the fabrication of a semiconductor device. An opening is formed in a wafer. A titanium wetting layer is then deposited over the wafer and lines the sidewalls and bottom of the opening. The opening is then filled with aluminum in two steps, both steps being performed at approximately the same temperature. The first aluminum deposition step is performed at a first (slower) deposition rate. The second aluminum deposition step is performed at the same temperature as the first deposition step but at a different (or second/faster) deposition rate until the opening is completely filled.

Abstract: To an electroless gold plating bath comprising a water-soluble gold compound, a complexing agent, and a reducing agent is added a small amount of polyvinyl pyrrodidone. The bath allows a satisfactory gold plating film to be formed on metal portions on a non-conductive substrate without plating spread.

Abstract: A multi-layer stencil is disclosed for applying solder paste to a printed circuit board. The stencil is formed from first and second layers of stencil material, e.g., stainless steel sheet, the second layer overlying the first layer in selected areas thereby forming a region of increased stencil thickness in those areas. A first plurality of apertures is defined through the thickness of the first layer only and a second plurality of apertures is defined through the combined thickness of the first and second layers in the selected regions. This type of multilevel stencil is useful for depositing differing thicknesses of solder paste onto a circuit board comprising a hybrid of through-hole and SMT devices.

Abstract: A wobble plate in a wobble plate compressor has a bevel gear positioned at a central portion thereof. The bevel gear is provided with a centered ball seat. A second bevel gear is supported on the cylinder block and also has a centered ball seat. A bearing ball is seated in both of the ball seats so that the wobble plate nutates about the ball. At least one of the bevel gears is coated with electroless composite plating layer having a self-lubricative material, such as polytetrafluoroethylene (PTFE), dispersed therein. Consequently, the bevel gears have low frictional resistance, high hardness and improved anti-seizure characteristics.

Abstract: The invention relates to a process for electrical insulation of conductive or semiconductor materials of a substrate, characterized in that it comprises at least the following steps:(a) at least one so-called conformal layer of insulating oxide is deposited on the predetermined regions of the substrate to be insulated;(b) a layer of planarizing oxide precursor is deposited on the predetermined regions by chemical reaction in plasma phase of a tetraalkylsilicate and of hydrogen peroxide;(c) at least one layer of insulating oxide is deposited on the predetermined regions; and(d) a conversion annealing operation is carried out.It also relates to the semiconductor devices and integrated-circuit elements having insulated narrow cavities.

Abstract: A process is provided for producing a bioceramic composite in which an alumina based ceramic substrate is coated with an intermediate calcium pyrophosphate layer to cement a porous calcium phosphate material to the alumina based ceramic substrate. In one aspect of the invention, the porous calcium phosphate material is a porous lattice made from natural bone. A bioceramic composite which includes an alumina-based ceramic substrate, an intermediate calcium pyrophosphate layer and a porous natural bone material bonded to the intermediate calcium pyrophosphate layer is also disclosed.

Abstract: A gas turbine engine component coating having superior abradability and erosion resistance is disclosed. The coating includes a base coat foundation layer, a graded interlayer and an abradable top layer for an overall thickness of preferably about 50 mils. The coating is characterized by a plurality of vertical microcracks. By precisely controlling the deposition parameters, composition of the layers and layer particle morphology, segmentation is achieved, as well as superior abradability and erosion resistance.

Abstract: The present invention relates to a method of forming coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising hydrogen silsesquioxane resin and a polysilazane on a substrate and heating the coated substrate at a temperature sufficient to convert the resins to ceramics.

Abstract: The invention relates to a method for forming a corrosion-resistant coating on a ferrous substrate comprising: mixing the coating components in the powdered form with water until all of the powder is in suspension; coating the selected exposed surfaces of the ferrous substrate with the suspension; drying the ferrous substrate coated with the suspension to remove substantially all of the water; heating the coated substrate to an appropriate temperature and maintaining the coated substrate at this temperature for an amount of time sufficient for the formation of an alloy coating at the substrate-coating interface; cooling the coated substrate; and further to the coating produced according to this method.

Abstract: Disclosed herein are process of preparing carbon supports coated with polyolefin or fluorinated polyolefin to be employed as a network substrate of such an electrochemical cell, in these processes, a solvent which solvates the polyolefin is employed for forming polyolefin in the shape of nearly single fibers which are the smallest unit conceivable. The carbon supports coated with the said solvated polyolefin which possesses the maximum uniformity concalvable have the maximum performance when they are employed in a gas diffusion electrode.

Abstract: Disclosed is a process for the electroless deposition of a copper coating on an iron or iron alloy surface wherein the workpiece surface is contacted with a solution which contains hydrogen ions, 5 to 30 g/l Cu as well as 0.2 to 5 g/l Mg and preferably copper and magnesium with a weight ratio of Cu:Mg of (35 to 5):1 for a treatment time of 3 sec to 15 min at a temperature of the solution of 20.degree. to 65.degree. C.The invention also comprises a solid concentrate for preparing and replenishing the solution for carrying out the process, which consists of at least 85 wt-% CuSO.sub.4.5H.sub.2 O and MgSO.sub.4 (anhydrous) with a weight ratio of (35 to 5):1, and preferably contains in addition a maximum of 10 wt-% polyglycol and a maximum of 5 wt-% sodium chloride.