Patents Examined by Boris L. Chervinsky
  • Circuit board with cooling function
    Patent number: 7808786
    Abstract: The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: October 5, 2010
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Chi-Hao Liang, Xie-Zhi Zhong, Hui-Ying Kuo
  • Communication chassis heat dissipation structure
    Patent number: 7800907
    Abstract: A communication chassis heat dissipation structure includes a chassis body defining an inner receiving space. The chassis body is divided into at least one heat concentration portion and at least one heat dissipation portion. A first heat pipe set is arranged in the receiving space to extend between and connect to the heat concentration portion and the heat dissipation portion, so that heat absorbed by the heat concentration portion is quickly transferred via the first heat pipe set to the heat dissipation portion and then dissipates from the heat dissipation portion into ambient air. Therefore, heat inside the chassis body can be quickly dissipated outward, enabling a communication chassis to have excellent heat dissipation effect.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: September 21, 2010
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chiu-Mao Huang, Chang-Moou Huang
  • Information processing apparatus
    Patent number: 7800899
    Abstract: An information processing apparatus includes a casing having a first accommodating unit, and a second accommodating unit which protrudes from at least one area of the first accommodating unit; a main body which includes at least one heat generating component which is accommodated in the first accommodating unit, and a port unit which is formed at an outer side of the first accommodating unit; and a heat radiating unit which is accommodated in the second accommodating unit, and discharges heat of the heat generating component to an outside of the casing.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: September 21, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Yong-duck Kim
  • Power supply cooling apparatus and configuration
    Patent number: 7800901
    Abstract: An improved system for cooling a power supply of a welding or plasma cutting system, and an improved configuration of a power supply. The system cools achieves the improvement in configuration and cooling by mounting electrical components to a circuit board and then to a heat sink. Electrical components are also mounted to a common panel that improves the circulation of air. A central panel supporting the power supply heat sink and components allows a smaller and more compact design while maintaining proper temperatures. Electromagnet cooling is improved by modifying electromagnetic cores to conduct heat to the heat sink, and by the use of thermally conducting polymers.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: September 21, 2010
    Assignee: Hypertherm, Inc.
    Inventors: Dennis M. Borowy, Michael F. Kornprobst, Ronald E. Morris
  • Electronic device and heat dissipation unit thereof
    Patent number: 7800906
    Abstract: An electronic device and a heat dissipation unit thereof are provided. The electronic device includes a housing, a circuit board, a heat source, a heat dissipation system and a heat dissipation unit. The circuit board is disposed in the housing and the heat source is disposed on the circuit board. The heat dissipation abuts the heat source, and the heat dissipation unit, disposed on the housing, abuts the heat dissipation system, wherein a portion of the heat dissipation unit is exposed outside of the housing. The heat dissipation unit includes a connecting portion, a heat exchanger, and a heat pipe. The connecting portion, disposed in the housing, abuts the heat dissipation system. The heat exchanger is disposed in the housing, and a portion of the heat exchanger is exposed outside of the housing. The heat pipe connects the connecting portion with the heat exchanger.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: September 21, 2010
    Assignee: Giga-Byte Technology Co., Ltd.
    Inventor: Shih-Ho Chang
  • Junction box to protect individual solar panels from overheating
    Patent number: 7796391
    Abstract: The invention relates to a junction box for solar panels, with which the heat produced in the protecting diodes, MOSFETs or other corresponding power semiconductors of a solar panel can be reliably dissipated. In the junction box, the electronic components are pressed against the housing (1) or into recesses (3) corresponding to the geometry of the components by means of pressure elements, and electrical isolation, preferably a thermally conductive silicone rubber, is provided between the housing (1) and the components.
    Type: Grant
    Filed: April 26, 2007
    Date of Patent: September 14, 2010
    Assignee: FPE Fischer GmbH
    Inventors: Ulrich Fischer, Roland Pfeffer, Bernd Willer, Charles Hsu
  • Basepan assembly for a metering device
    Patent number: 7796375
    Abstract: A basepan assembly for hook-on attachment onto a metering device is provided including a basepan support having at least two insert latches disposed at a first end and a side flange disposed at a second opposite end. A basepan body is provided being insertable onto said basepan support and including an inside wall configured to be attachable to a barrier of the metering device, as well as an outside wall, a bus stab chamber, and a hold-down insert configured to be attachable to the basepan body, the hold-down insert further having a side barrier. A top load stab having a first end affixable to the hold-down insert is provided and a bottom load stab insertable within said bus stab chamber is provided.
    Type: Grant
    Filed: February 17, 2009
    Date of Patent: September 14, 2010
    Assignee: Siemens Industry, Inc.
    Inventor: Fan Zhang
  • Fastener and heat sink assembly having the same
    Patent number: 7796390
    Abstract: A heat sink assembly is mounted on a printed circuit board to dissipate heat generated by an electronic component. The heat sink assembly includes a heat sink and a plurality of fasteners fixing the heat sink to the printed circuit board. The fastener includes a head, a post extending downwardly from the head through the heat sink, an elastic member encircling the post and compressed between the head and the heat sink, and an engaging member fixed to the printed circuit board. A top of the engaging member is fastened to a bottom of the post. When the post, together with the head, is rotated relative to an axis thereof toward a locked position, the post would be driven by the engaging member to automatically lock with the engaging member at the locked position.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: September 14, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Lei Cao, Min Li
  • Contour surface cooling of electronics devices
    Patent number: 7791887
    Abstract: The present invention provides a cooling device including a heat generating device having a device surface with a device surface contour on at least a portion of the device surface and a base having a base surface with a base surface contour on at least a portion of the base surface. The device surface contour and the base surface contour are substantially similar such that at least a portion of the device surface and the base surface fit in close proximity to each other.
    Type: Grant
    Filed: February 12, 2008
    Date of Patent: September 7, 2010
    Assignee: Honeywell International Inc.
    Inventors: Evgeni Ganev, Robert Dietrich, Michael Quan
  • Two-phase cooling circuit
    Patent number: 7791885
    Abstract: The disclosure relates to a two-phase cooling circuit. The cooling circuit can include an evaporator and a condenser. The evaporator and condenser can be connected by a feeder line and a first return line. A phase separator is arranged at an inlet side of the condenser. The phase separator can be connected with the evaporator by a second return line.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: September 7, 2010
    Assignee: ABB Research Ltd
    Inventors: Bruno Agostini, Berk Yesin
  • Heat-dissipating mechanism for use with memory module
    Patent number: 7791881
    Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: September 7, 2010
    Assignee: Asustek Computer Inc.
    Inventors: Chia-Hsing Chou, Chih-Wei Tsai, Chia-Hung Lu
  • Heat-dissipating component having stair-stepped coolant channels
    Patent number: 7782616
    Abstract: A heat-dissipating component including a heat-generating device such as a power semiconductor chip and a mounting structure is provided with coolant channels having a stair-stepped internal geometry that enhances cooling performance with both single-phase and two-phase cooling modes without unduly restricting coolant flow or significantly increasing manufacturing cost. The stair-stepped geometry enhances both single-phase and two-phase cooling modes by increasing the surface area of the channels, and further enhances the two-phase cooling mode by providing numerous high-quality bubble nucleation sites along the length of the channels. The stair-stepped channels are formed in the heat generating device and/or the mounting structure, and the stepped sidewalls may extend toward or away from the center of the channel.
    Type: Grant
    Filed: April 23, 2009
    Date of Patent: August 24, 2010
    Assignee: Delphi Technologies, Inc.
    Inventors: Bruce A. Myers, Suresh K. Chengalva, Darrell E. Peugh
  • Cooling system for a portable device
    Patent number: 7782613
    Abstract: A cellular cooling part includes a number at least one movable part, that can be the removable flap or movable cover for a fan. The fan, for example, can be moved or opened to expose it. A flap can also be opened. In addition, different covering structures can be used.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: August 24, 2010
    Assignee: Harris Technology, LLC
    Inventor: Scott C. Harris
  • Attachment apparatus for electronic boards
    Patent number: 7782622
    Abstract: Disclosed is an attachment apparatus. The attachment apparatus may facilitate attachment of various components to a printed circuit board (PCB) including a thermal management component.
    Type: Grant
    Filed: October 4, 2006
    Date of Patent: August 24, 2010
  • Heat dissipation module
    Patent number: 7782614
    Abstract: An electronic device includes a first electronic component, a second electronic component adjacent to the first electronic component, a heat sink arranged on the first electronic component to absorb heat therefrom, an axial fan mounted on the heat sink for generating an airflow to the heat sink, and a guiding member. The axial fan includes a frame and an impeller received in the frame. A cutout is defined in the frame facing the second electronic component. The guiding member is arranged between the axial fan and the second electronic component for guiding a part of the airflow escaping from the frame via the cutout to the second electronic component.
    Type: Grant
    Filed: June 1, 2009
    Date of Patent: August 24, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shu-Min Li, Xin-Xiang Zha
  • Electronic apparatus
    Patent number: 7782620
    Abstract: According to one embodiment, an electronic apparatus includes a semiconductor package including a resin substrate and a die mounted on the resin substrate, a printed circuit board on which the semiconductor package is mounted, and a heat receiving plate that has an area larger than an area of the die. The heat receiving plate has a concave portion that corresponds to a surface of the die at a normal temperature. The concave portion is provided with a pasty heat conductive agent. The heat receiving plate is thermally connected to the semiconductor package via the pasty heat conductive agent.
    Type: Grant
    Filed: April 24, 2009
    Date of Patent: August 24, 2010
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kentaro Tomioka, Tomomi Murayama
  • Electronic device and cooling system thereof
    Patent number: 7782615
    Abstract: An electronic device with a cooling system includes an enclosure. A first electronic component and a second electronic component in parallel are received in the enclosure. Air inlets are defined in a front board of the enclosure to receive cool air. A first flow of the cool air passes through a main airflow path to cool the first electronic component and the second electronic component. A second flow of the cool air passes through an auxiliary airflow path to cool the second electronic component. The main airflow path and the auxiliary airflow path are separated by a clapboard. The cool air heated by the first and second electronic components is then exhausted through the air outlets defined in a back board of the enclosure.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: August 24, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng Hao-Der, Hung-Chou Chan
  • Power distribution system with individually isolatable functional zones
    Patent number: 7782596
    Abstract: A power distribution system having a plurality of individually isolatable functional nodes each connected via an isolating device to a power distribution bus that is connected via an isolating device to a power input node which is connectable to a power source, wherein the power distribution bus and the isolating devices are housed in a power distribution compartment, and wherein the power input node and the functional nodes are housed separately from one another and the power distribution compartment in functional compartments adjacent thereto.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: August 24, 2010
    Inventor: Bradley Leighton Ross
  • System comprising heat-generator and cooler thereof, and disk array system
    Patent number: 7778029
    Abstract: A system comprises: a plurality of heat-generators; at least one cooler that cools the heat-generators by letting a cooling medium flow; and at least one cooling medium flow regulator that regulates the amount of the flow of said cooling mediums in accordance to the heat of said heat-generators; wherein the heat of said heat-generators is transmitted to said cooling medium flow regulator without recourse to transmitting through said cooling medium or air. The system may be a disk array system.
    Type: Grant
    Filed: February 22, 2008
    Date of Patent: August 17, 2010
    Assignee: NEC Corporation
    Inventor: Hidehiro Ueno
  • Structure and method for mounting a heat-generating component
    Patent number: 7778036
    Abstract: A structure for mounting a heat-generating component includes a circuit board on which a heat-generating component is mounted, a base on which the circuit board is disposed upright, a cover having thermal conductivity, a heat-conductive member electrically isolated from the heat-generating component and a heat transfer plate. The heat transfer plate is attached to the circuit board so as to extend in the sliding direction of the cover to cover a surface of the heat-conductive member. The cover presses the heat transfer plate by an inner surface thereof against the heat-conductive member in a direction perpendicular to the heat-conductive member so that the heat-generating component is thermally connected to the inner surface of the cover through the heat-conductive member and the heat transfer plate.
    Type: Grant
    Filed: May 18, 2009
    Date of Patent: August 17, 2010
    Assignee: Kabushiki Toyota Jidoshokki
    Inventor: Kazuyoshi Kontani