Abstract: A power module includes a power device having a top electrode and a bottom electrode, an upper metal block connected to the top electrode, a lower metal block connected to the bottom electrode, a resin covering the power device, the upper metal block and the lower metal block so as to expose a upper surface of the upper metal block and a lower surface of the lower metal block, an upper terminal-cooling power-applying block connected to the upper metal block, a lower terminal-cooling power-applying block connected to the lower metal block, an upper terminal connected to the upper terminal-cooling power-applying block, a lower terminal connected to the lower terminal-cooling power-applying block, and a insulating case covering all elements so as to expose a part of the upper terminal and a part of the lower terminal.

Abstract: An electronic device having a heat-dissipating module includes a housing and an electronic component (e.g., a central processing unit) disposed within the housing. The heat-dissipating module is used for dissipating heat of the electronic component, and includes a two-phase flow heat-dissipating loop and a thermoelectric cooling component. The two-phase flow heat-dissipating loop can be a loop heat pipe (LHP) or a capillary pumped loop (CPL). The thermoelectric cooling component includes a cooling portion and a heat-generating portion respectively to cool or heat necessary portions of the two-phase flow heat-dissipating loop, or directly cool the electronic component through the cooling portion, thereby increasing the heat-dissipation effect of the two-phase flow heat-dissipating loop.

Abstract: An electrical component may include a vent located in a mounting portion of a case to vent a blast from within the case. A chassis may have a mounting site for an electrical component, wherein the mounting site includes a passage to receive a blast from the electrical component. A system may include a chassis having a mounting site to engage a mounting portion of a case for an electrical component, wherein the mounting portion of the case includes a vent, and the chassis forms at least a portion of a blast chamber to receive a blast from the vent.

Abstract: A heat sink assembly includes a heat sink main body and a contact member attached to a base of the heat sink main body. The contact member includes a container with thermal grease contained therein and a movable cover movably attached to the container. The container includes a bottom plate configured to contact a heat generating component, and a plurality of holes defined in the bottom plate. When the heat sink is attached to the heat generating component, the movable cover is pressed towards the container and impels the thermal grease out from the holes to spread the thermal grease between the bottom plate of the container and the heat generating component.

Abstract: The invention relates to cooling techniques for portable devices such as, for example, mobile telephones. In one implementation, a portable device comprises one or more printed circuit boards (“PCBs”) supporting multiple heat-generating components, an airflow generator adapted to generate an airflow internally in the portable device, and a heat sink element thermally connected to the heat-generating components, wherein the heat sink element is adapted to receive heat from the heat-generating components for dissipation by the airflow.

Abstract: A modular power distribution system comprises a chassis and a backplane including a power input, and a plurality of module connection locations. A plurality of modules are mounted in the chassis, each module mounted to one of the module connection locations. Each module includes: (i) a circuit protection device; and (ii) a power output connection location. Bus bars connect front power inputs to the backplane.

Abstract: In one embodiment, an apparatus includes a card chamber, an air intake, an airway, an exhaust plenum, and at least one fan. At least one electronics card can be supported in the card chamber. Ambient air from outside the apparatus can flow into the card chamber via the air intake. The airway is located across the card chamber from the air intake. Air flows substantially linearly across the card chamber from the intake to the airway. The exhaust plenum is located adjacent the card chamber and the airway. The fan is operable to draw air from the airway into the exhaust plenum.

Abstract: An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conductin

Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.

Abstract: A support system for an electrical device arranges the plurality of heat-sink assemblies in an orientation that allows the forces associated with an electrical fault that are transferred to the support structure to be reduced. The arrangement allows the electrical fault forces to cancel one another out such that the resulting net force applied to the support structure is significantly reduced. The size, strength and/or robustness of the support system can be reduced as the forces transmitted thereto are greatly reduced. The heat-sink assemblies can be arranged to facilitate ease of maintenance by allowing the heat-sink assemblies to be removed from a front access panel of the electrical device.

Abstract: There is a concern that water on the top surface of a cover 50A will penetrate the top face of a case 20 through gaps between an opening portion 51H and parts accommodation portions 34 because the parts accommodation portions 34 are exposed to the outside at the opening portion 51H on the top face of the cover 50A while the electrical connection box P is positioned in the cover 50A. Because drainage grooves 35 and 36, which reach the drainage channels 38 on the outside face of the case 20, are formed on the top face of the case 20, water that remains on the top face of the case 20 (the main body portion 30) is reliably drained by flowing into the drainage grooves 35 and 36.

Abstract: A heat dissipating apparatus includes a heat sink, a blower, and a fan. The blower and the fan can be mounted together via a connection element. The heat sink defines an accommodating space. The blower and the fan can be positioned to the heat sink via the connection element, with the blower being accommodated in the accommodating space. The heat dissipating apparatus can achieve an optimal heat dissipating effect.

Abstract: The present invention relates generally to a switchgear apparatus. More particularly, the invention encompasses a mounting base with arc plenum for a switchgear apparatus. The present invention also relates to enclosures for switchgear, panel boards, circuit breakers, and more particularly to an enclosure for low voltage switchgear and switchboard assemblies. The enclosure can be a walk-in type enclosure or a non-walk-in type enclosure. This invention further provides a method and apparatus for channeling plasma (hot arc gasses) that are generated from an arc. The switchgear mounting base with internal arc plenum can be an integral part of an arc resistant switchgear assembly and is preferably located under the switchgear. The switchgear mounting base works in conjunction with a ventilation system in the switchgear apparatus to channel hot arc gasses (plasma) from the lower breaker compartments in the front of the switchgear in the event of an internal arcing fault in one of the breaker compartments.

Abstract: Disclosed is a design for a computer enclosure. Heat is passed from the heat-generating components directly to a non-conductive liquid coolant. Some of the heat is expelled directly to the environment via a heatsink “chimney”, and some is expelled with the help of a thermoelectric heat pump.

Abstract: A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.

Abstract: An enclosed electronic apparatus including a first continuous heat-transfer band forming at least a portion of the exterior surface of the enclosure, with continuous lateral edges on either side thereof, and mounting points on an internal side of the continuous heat transfer band to which a printed circuit board assembly is mountable. A printed circuit board assembly is mounted to the heat transfer band at the mounting points, with a thermally conductive portion forming a thermal path between a heat-producing electronic component of the printed circuit board assembly and the heat transfer band. A thermally conductive gasket between the printed circuit board assembly and the heat transfer band at the mounting points facilitates heat transfer. Opposing first and second enclosure portions seal the respective continuous lateral edges of the heat transfer band against penetration of fluid or debris.

Abstract: A heat dissipation unit is provided. The heat dissipation unit includes a heat sink, a first fixing station, a first heat pipe, a second fixing station and a second heat pipe. The first fixing station is located on a first plane. The first heat pipe is connected to the first fixing station and the heat sink. The second fixing station is located on a second plane, wherein a gap is formed between the first plane and the second plane. The second heat pipe is connected to the second fixing station and the heat sink, wherein the first fixing station partially overlaps the second fixing station.

Abstract: There is provided a digital broadcasting receiver apparatus in which a temperature in the area surrounding a removable HDD does not become a high temperature during an operation regardless of whether it is disposed horizontally or vertically. A component with a large heat generating quantity and a component with a small heat generating quantity are installed in respective spaces inside a case. An adapter of the removable HDD is mounted to dispose the removable HDD in a space in which a component with a small heat generating quantity is mounted, thereby preventing the temperature in the area surrounding the removable HDD from becoming a high temperature.

Abstract: A flange (3) for sealing an opening (1) of a fuel container (2) of a motor vehicle maintains an electronic component (9) which is arranged on the external side (5) on a carrier (12). The carrier (12) is embodied as a single piece and has a heat-conducting element (13) which can penetrate the wall (4) of a flange (3). The heat-conducting element (13) dissipates the heat which is produced by the electronic component (9) to the inside (7) of the fuel container (2).

Abstract: A fastening apparatus for fastening a first device to a second device is disclosed. The apparatus comprises a standoff member disposed through a through hole of the first device; a clamp member having a clamp portion for clamping the standoff member; a sleeve member having a hollow body and enclosing the clamp member, wherein the clamp member is compressed in the hollow body; a resilient member wrapping around the sleeve member; a rotatable cam member pivotly coupled to the clamp member; and a cap member arranged between the rotatable cam member and the resilient member, wherein the rotatable cam member is rotated to a first location to compress the resilient member for causing a first preload force exerted on the second device.