Abstract: A combined electronics mounting plate and heat exchanger and method of manufacturing same. The present invention provides an electronics mounting plate formed from a metal matrix composite and a metal heat exchanger in order to combine the low coefficient of thermal expansion and high heat dissipation characteristics of a metal matrix composite, with the cost effectiveness and relatively easy manufacturability of metal. In the preferred embodiment, the metal matrix composite is provided in the form of aluminum and silicon carbide, and the metal heat exchanger is provided in the form of aluminum fins. The method of manufacturing the present invention includes the steps of cleaning the metal matrix composite mounting plate and aluminum heat exchanger in a nitric acid fluoride salt before brazing the elements together.

Abstract: An overhanging separator structure with a post projecting from a surface which may be a substrate, an underlying layer on the surface, and a separator layer on the underlying layer, with the separator layer overhanging the underlying layer. A discontinuous film is then formed in a single process step having a first portion on the separator layer and a second portion on the post, the discontinuity caused by the overhanging separator layer. The structure is made into a stacked capacitor with the second (post) portion of the discontinuous film being the bottom electrode, by forming a continuous dielectric layer on the bottom electrode and a continuous top electrode layer on the dielectric layer.

Abstract: A capacitor and electrode structure comprising a PZT ferroelectric layer 17 with a primary component (Pb) and secondary component (Ti), a lower electrode layer 16 formed on the underside of the ferroelectric layer and made up of a special element (Pt) and Ti, and compounds thereof, and a diffusion barrier layer 18 which is formed on the underside of the lower electrode layer and which functions as a diffusion barrier with respect to Pb. The capacitor and the electrode structure, which may be a component of a semiconductor memory device, suppress fluctuations in the composition of the ferroelectric layer in PZT, etc., so as to maintain the intended performance of the PZT ferroelectric layer, thereby simplifying and stabilizing film fabrication, and preventing the degradation of electrical characteristics and adverse effects on lower layers.

Abstract: A terminal for an electronic component having a connecting section with a rectangular shaped cross sectional for connection to the casing of the electronic component, and a taping section also with a rectangular shaped cross sectional for attachment to a tape carrying a plurality of such terminals. In between the connecting section and the taping section are a lower rod section and an upper rod section. The lower rod section facilitates the separation of the taping section from the tape. The upper section facilitates the separation of the connecting section from the remaining portion of the terminal.

Abstract: An electronic appliance housing is arranged by a cover with a locking groove, an operation portion with a locking portion fitted to this locking groove, and a housing to which the cover is attached. This cover is slidably mounted on the housing. Both the locking groove of the cover and a locking portion have portions inclined with respect to the cover, for instance, such a portion whose sectional shape is a parallelogram. The operation portion has a portion slid along a direction perpendicular to the sliding direction of the cover. With this sliding portion, the locking portion is slidably entered/derived into/from the locking groove. When the locking portion is fitted into the locking groove such that the cover is mounted on the housing, the cover is fixed so as not to be dropped out. The operation portion is attached to a portion of the housing, and has such a structure that this operation portion is moved downwardly by depressing the housing from the upper direction.

Abstract: A composite functional device is provided. The device includes a magnetic ceramic including an Ni--Zn ferrite; and a semiconductive including zinc oxide and an oxide of at least one of nickel and iron in an amount of from about 0.001 to 0.1 mol % in terms of NiO or Fe.sub.2 O.sub.3.

Abstract: A device for forming a seal around an elongate object having: (a) a sealing plate having a hole through which the object can pass, and containing a chamber in communication with the hole; (b) a pressure plate positioned within and movable relative to the chamber; and (c) a sealing material positioned within the chamber such that when the elongate object passes, in use, through the hole in the sealing plate, the sealing material is positioned between the pressure plate and the elongate object, wherein the pressure plate can be moved, in use, towards the object in a direction transversely of the object, to urge the sealing material into sealing contact with the object.

Abstract: A capacitor having a ceramic dielectric and at least two electrodes, the ceramic dielectric being predominantly composed of a dielectric, ceramic composition having a main component of BaTiO.sub.3 and/or ?Ba.sub.1-y Sr.sub.y !Ti.sub.x O.sub.31 z, wherein 0.95.ltoreq.x.ltoreq.0.995, 0.ltoreq.y.ltoreq.0.04, z=2(1-x), and having at least an additive of the group formed by XMnO.sub.3, X.sub.2 MoO.sub.6, X.sub.2 WO.sub.6, X.sub.2 SiO.sub.5 +Mn.sub.2 SiO.sub.4 and Li.sub.2 SiO.sub.3 +Mn.sub.2 SiO.sub.4, and at least an additive of the group formed by Li.sub.2 SiO.sub.3, SiO.sub.2 and a mixture of 6 mol % Li.sub.2 O, 13 mol % BaO, 13 mol % SrO, 13 mol % MgO and 55 mol % SiO.sub.2, which is calcined at 800.degree. C., and, if necessary, an additive of the group formed by XInO.sub.3, XGaO.sub.3 and XAlO.sub.3, wherein X is one or more elements of the group formed by Y, Dy and Er, is characterized by a flat .DELTA.C/.DELTA.t curve and a stable dielectric behavior on exposure to temperature and voltage influences.

Abstract: The fixing process according to the invention of a winding to one or more electronic circuits permits elimination of an important manufacturing step of the processes according to the prior art, whether the positioning, then the gluing or the precise fixing of the winding or of the core to be wound on the electronic circuit or circuits. By a suitable arrangement of the electronic circuit or circuits and of the possible core, independently of one another, on a holding tool according to the invention, a semi-finished product is obtained, also according to the invention, made up of the circuit or circuits and the winding, the mechanical connection between them being ensured solely by the copper wires producing, moreover, the electrical connecting between the two elements. The finished component according to the invention will be obtained by disposing the preceding semi-finished product on a support ensuring a permanent mechanical connection between the two elements.

Abstract: The dielectric ceramic composition for use with a laminated capacitor to be used in a high frequency region improves in costs of manufacturing by lowering the temperature of calcination as relatively high as from ca. 1,200.degree. C. to 1,500.degree. C. required for conventional ones and by reducing the expensive costs of electricity required otherwise by the manufacture of conventional ones. The dielectric ceramic composition contains a magnesium silicate-zinc component, an alumina component and a strontium titanate component, as represented by formula:Z(Mg.sub.a Zn.sub.(1-a)).sub.x SiO.sub.x+2 --YAl.sub.2 O.sub.3 --ZSrTiO.sub.3wherein a is equal to or larger than 0.1 and equal to or smaller than 0.8; and x is equal to or larger than 0.67 and equal to or smaller than 1.5; and wherein a molar ratio (%) of the magnesium silicate-zinc component, as represented by (Mg.sub.a Zn.sub.(1-a)).sub.x SiO.sub.x+2, to the alumina component, as represented by Al.sub.2 O.sub.

Abstract: A packaged electrical component includes a tubular body having first and second ends and an opening at the first end for receiving an electrical component; an electrical component disposed within the tubular body; an end cap mounted on the first end of the tubular body, closing the opening; and a fluid-filled pressure-applying element disposed within the tubular body between the end cap and the electrical component, applying pressure to the electrical component within the tubular body. The fluid-filled pressure-applying element is preferably a variable volume container that contains a gas, a liquid, or a solid produced by curing of a liquid. A fluid is injected into the container after assembly of the package so that a uniform pressure is applied to the component compensating for thickness non-uniformities of the component. Assembly is simplified since the element is pressurized after assembly of the package rather than while the package is being manufactured.

Abstract: Signal communication paths between multiple chips are established through inter-chip electro-magnetic coupling, thereby potentially eliminating mechanical inter-chip contacts and increasing inter-chip interconnection capacity while maximizing chip real estate allocated to a circuit layer. In one embodiment, multiple chips each include a conductive layer, disposed over a circuit layer on a substrate, divided into electro-magnetic coupling device elements such as capacitor plates. When utilizing capacitor plates, chips are arranged face-to-face with opposing chips having mirror image capacitor plate patterns to form a plurality of capacitors. Conventional signal transmission circuits produce time-varying signals which propagate to conventional signal receiving circuits of another chip via an embodiment of electro-magnetic signal communication paths formed by the capacitors.

Abstract: An interface device having a printed circuit board connected to a processor unit and an electronic base with grooves to receive the board with active or passive interface devices connected by terminal blocks. The interface devices are housed in separate modules having lengths which are equal to or integer multiples of a modulus wherein each module includes a strip of indicator openings or terminal operating openings disposed lengthwise at a particular pitch. The modules have complementary grooves and tongues on their side faces in order to permit assembly perpendicular to the plane of the board thereby forming a rigid assembly.

Abstract: A method of preventing non-uniform bonding wire sweep during an encapsulating process of an integrated circuit package includes the step of forming an encapsulating material flow restricting element between two widely spaced functional bonding wires. The integrated circuit package includes an array of electrically conductive leads for electrically connecting the package to other electrical elements and an integrated circuit die having a plurality of input/output terminal pads. A plurality of functional bonding wires electrically connects certain ones of the input/output terminal pads to associated electrically conductive leads such that the functional bonding wires have a predetermined pitch which defines an approximate minimum desired spacing between adjacent functional bonding wires. The plurality of functional bonding wires includes two widely spaced functional bonding wires which are spaced apart from one another by a distance substantially greater than the predetermined minimum desired spacing.

Abstract: A preferred embodiment of this invention comprises a first thin dielectric buffer layer of a first leakage-current-density material (e.g. strontium titanate 32) with a first moderate-dielectric-constant, a high-dielectric-constant layer of a second leakage-current-density material (e.g. barium strontium titanate 34) overlaying the first thin dielectric buffer layer, and a second thin dielectric buffer layer of a third leakage-current-density material (e.g. strontium titanate 36) with a second moderate-dielectric-constant overlaying the high-dielectric-constant layer, wherein the first and third leakage-current-density materials have substantially lower leakage-current-densities than the second leakage-current-density material. The first and second thin moderate-dielectric-constant buffer layers (e.g. strontium titanate 32, 36) substantially limit the leakage-current-density of the structure, with only modest degradation of the dielectric constant of the structure.

Abstract: An encapsulated solid electrolytic capacitor has an anode lead terminal, a cathode lead terminal, a capacitor element and a mold which is made of a synthetic resin material and encapsulates the capacitor element entirely. The capacitor element has an anode bar protruding longitudinally from a main body and is disposed between the anode lead terminal and the cathode lead terminal with the main body being electrically connected to the cathode lead terminal. The tip of the anode bar is welded to the anode lead terminal. The anode lead terminal has integrally formed with it a raised part which is L-shaped as seen longitudinally and is capable of having the anode bar inserted under its middle part, preventing it from becoming bent when it is soldered.

Abstract: The invention is directed to a fluid cooled electrical conductor assembly. The fluid cooled electrical conductor assembly includes a terminal having an open end and a fluid passage in communication with the open end. A sleeve is at least partially received within the open end of the terminal. The sleeve is metallurgically bonded to the terminal, such as by solder. The sleeve has a flared end disposed around an electrical conductor and a distal end disposed adjacent to an end of the conductor. The sleeve has a longitudinally extending groove which is in communication with the fluid passage in the terminal. A casing is connected to the terminal and surrounds the conductor to thereby define a fluid passageway at a periphery of the conductor. During manufacture, a single sleeve is swedged onto an electrical conductor and subsequently cut in half to define two substantially identical sleeves which may be inserted into respective terminals.

Abstract: A multilayer circuit board unit includes a plurality of printed boards, an electronic component, an anisotropic conductive film, and a notched hole. The printed boards have printed circuits on surfaces thereof and are stacked on each other. The electronic component is mounted on at least one of the printed boards and arranged between the printed board on which it is mounted and an adjacent printed board. The anisotropic conductive film electrically connects the printed circuits of the printed boards to each other. The notched hole is formed in the adjacent printed board to correspond to the electronic component.

Abstract: A modular cable protection system which is intended to protect electrical cables, fluid hoses and data cables from externally caused physical or mechanical damage. The modular protective components may be detachably interlocked with other structural components so as to form a suitably sized cable protection system. The components may be constituted of molded plastic material of high rigidity and strength, and are adapted to be selectively joined to other components as required to provide the necessary protective array in a simply assembled and decorative manner which not only fulfills the desired protective tasks but which is also authentically pleasing in appearance.

Abstract: A basic ground plate adapter which is adapted for utilization with wiring devices installable in non-metallic electrical boxes, and in particular, a ground plate adapter which is employable for a single-gang and is selectively connectable to ground plate adapters for constructing multi-gang arrangements as may be required for specific physical and utilitarian applications. The basic ground plate adapter includes a generally inverted U-shaped bracket structure adapted to clampingly engage the edge or rim of the sidewall of a non-metallic or plastic electrical box, and includes a Z-shaped plate arrangement or further bracket attached to the inverted U-shaped bracket structure. The ground plate adapter also includes a threaded aperture for receiving a ground screw.