Abstract: A multi-layer integrated circuit package which contains layers of dielectric that substantially reduce metal migration between the metal conductors of the package. The package has metal baseplates that are separated from a lead frame by a plurality of dielectric tapes. The integrated circuit is mounted to the baseplate which has a plurality of tabs that are connected to the lead frame of the package. The power or ground leads of the package are bonded to the corresponding baseplate through the tabs of the metal plate. The lead frame, metal baseplate and dielectric tapes all have center openings to provide clearance for the integrated circuit. The center opening of the tapes are such that the dielectric material extends beyond the ends of the baseplates and lead frame.

Abstract: A coaxial, fiber optic, or twisted pair cable having a is core surrounded by an armor layer and an outer protective jacket such that relative movement between the armor layer and the protective jacket is permitted. The armor layer has a pair of opposing longitudinal edge portions and is wrapped around a cable core such that a longitudinally extending seam is produced. The outer surface of the armor layer has an adhesive layer disposed thereon for bonding an outer protective jacket thereto. Portions of the outer surface of the armor layer adjacent the longitudinally extending seam are oxidized, thereby effectively neutralizing the adhesive layer. The oxidized portions of the armor layer reduce, if not eliminate, adherence between the protective jacket and the armor layer along the longitudinally extending seam.

Abstract: A method of fabricating a multilayer capacitor includes depositing a plurality of electrode layers on a substrate alternately with a plurality of amorphous hydrogenated carbon dielectric layers, forming at least two holes in the electrode and dielectric layers with each hole intersecting alternating ones of the electrode layers, and providing an electrically conductive material in each hole for coupling the alternating ones of the electrode layers. Forming the holes can include forming initial holes and then further exposing selected edge portions of the electrode layers by widening dielectric layer portions of the initial holes. Providing the electrically conductive material can include coating surfaces of the holes with an electrically conductive layer and pouring an electrically conductive filler material into the holes. If filler material is poured into the holes, a capacitor lead can be positioned adjacent the filler material and attached by hardening the filler material.

Abstract: Capacitors and methods of fabricating high dielectric capacitors which do not create a step difference where the high dielectric material is formed are provided. These methods include forming a first electrode layer on an integrated circuit device substrate and a layer of high dielectric material on the first electrode layer opposite the integrated circuit device substrate. A second electrode layer is formed on the layer of high dielectric material opposite the first electrode layer. The first electrode layer, the high dielectric layer and the second electrode layer are patterned to form a capacitor cell unit having a sidewall which extends from the first electrode beyond the layer of high dielectric material and to the second electrode layer. An insulating spacer is formed on the sidewall of the capacitor cell unit extending from the first electrode layer to the second electrode layer.

Abstract: A fixing part having a room in which a metal attachment leg is inserted to attach a capacitor unit is disposed on an outside face of a case. An electrode connected to a terminal of a capacitor element is disposed in the fixing part, and a lock part to be engaged with the inserted metal attachment leg is disposed, whereby when the metal attachment leg is inserted into the fixing part, the electrode of the fixing part is electrically contacted to the metal attachment leg by elasticity.

Abstract: A capacitor construction includes, i) a dense mass of electrically insulative oxide; ii) an electrically conductive inner capacitor plate overlying and contacting the electrically insulative oxide mass; iii) a capacitor dielectric layer overlying the inner capacitor plate and oxide mass, the capacitor dielectric layer comprising a nitride; iv) an electrically conductive outer capacitor plate overlying the capacitor dielectric layer; and v) the dense mass of electrically insulative oxide contacting the inner capacitor plate being characterized by a wet etch rate of less than or equal to about 75 Angstroms/minute in a 100:1 by volume H.sub.2 O:HF solution.

Abstract: A voltage variable capacitor (VVC) is made by placing an intercalation compound between two electrodes of a capacitor. The VVC has a reservoir of an intercalant in proximity with the intercalation compound. The two materials are chosen from those known to exhibit the intercalation reaction. The extent of the intercalation reaction is controlled by applying a voltage to the intercalant reservoir and the intercalation compound. A variable capacitor is created by applying a signal to the device and appropriately controlling the .di-elect cons. of the device by using the input control voltages.

Abstract: An EMI bulk head gasket assembly includes a bulk head and a gasket adapted to snap fit together. The bulk head includes a base plate and first and second bulk head side walls, positioned at right angles to the bulk head base plate. The first bulk head side wall includes a plurality of bulk head apertures. The gasket includes a base plate and first and second gasket side walls wherein the first gasket side wall forms an angle slightly greater than ninety degrees with the gasket base plate. The gasket is adapted to snap fit between the first and second bulk head side walls. The first gasket side wall includes inwardly pointing tabs positioned and adapted to fit into the plurality of bulk head apertures. The tabs retain the gasket between the first and second bulk head side walls. The gasket includes spring fingers each of which include a spring bend between a proximal spring finger section and a distal spring finger section. The spring finger is spring loaded by the spring bend.

Abstract: A submount including:an insulating substrate having therein a throughhole filled with a sintered metal powder, andan electroconductive layer formed on each of the two opposing surfaces of the insulating substrate, wherein the sintered metal powder filled in the throughhole of the insulating substrate is formed, for example, by filling, in the throughhole, a metal paste composed mainly of copper, tungsten, molybdenum or the like and then conducting firing and wherein the two electroconductive layers are electrically connected with each other at least partially by the sintered metal powder. The submount according to the present invention has a low electric resistance and high reliability and can be made in a small size. Therefore, it can be suitably used as a novel submount for semiconductor laser element, which promises electrical conduction between a semiconductor laser element and a heat sink.

Abstract: A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes.

Abstract: Disclosed is an encapsulation device for bare die. The encapsulation device includes chambers having parallet walls, an insertion void, and a spring retention electrical contact having a compliant foot and comprises a cap having a compression pad. The encapsulation device of the invention provides a reliable contact between the die and a mounting board via the compliant foot. The insertion void allows for a safe insertion of a die into a chamber of the encapsulation device. The compression pad and the spring retention electrical contact provide positive retainment of the bare die within the encapsulation device.

Abstract: A method and apparatus for converting a universal cover plate for an electrical outlet to any desired specific cover plate. The apparatus includes a base having removable tabs and hinges. To create the desired cover plate, the appropriate tabs are removed to leave apertures that accommodate the desired standard electrical outlet such as a light switch or socket. An optional cover may have removable hinges that allow the cover to open along more than one axis. To make a base that fits with a lid hinged on its longer side, hinges on the shorter side are removed, by prying, sawing, or cutting. Alternatively, to make a base that fits a lid hinged on the shorter side of the base, hinges on the longer side are removed. If a base with no cover is desired, all the hinges may be removed.

Abstract: The present invention discloses an inner module container provided for containing active circuit elements for processing and transmitting cable television signals receivable from and transmissible through pins of coaxial cables. The inner module container includes direct access openings for receiving coaxial cable pins for securely connecting to the active circuit elements whereby the pins of the coaxial cables are connected to the active circuit elements without requiring a separate connector outside of the inner module container. In a preferred embodiment, the active circuit elements further include mechanisms for locking coaxial cable pins for directly and securely locking to the coaxial cable pins.

Abstract: An integrated circuit package which has a flexible circuit that covers an integrated circuit. The flexible circuit contains a conductive line which prevents a probe from accessing the integrated circuit. The conductive line of the flexible circuit can be attached to the power lines, synchronization line, memory erase line, or any other line that will disable, erase or otherwise prevent access to the integrated circuit if the flexible circuit conductive line is broken. The integrated circuit can be mounted to a printed circuit board. The printed circuit board, integrated circuit and flexible circuit can all be enclosed within the package.

Abstract: A cooling device mounting a fan unit above a heat sink mounted on a heat-generating element or buried therein, which produces an effective air flow and achieves a uniform cooling action by having the heat sink shown in various shapes. Further, a cooling fan disposed away from the heat sink or to the side of the same is used for effective cooling through an air conduit passage formed by pipes or a cover.

Abstract: A shield for electromagnetic radiation including a first layer having a high magnetic permeability and a second layer having a high electrical conductivity.

Abstract: The capacitance type pressure transducer is disclosed which includes an isolation additional diaphragm made of the same material as the operative diaphragms the transducer. Material may be quartz, silicon, or aluminosilicate. The isolation diaphragm minimizes deflections of the operative diaphragms as the housing base is bowed due to the pressure differential between the internal reference pressure of the capsule and the ambient pressure. The transducer may be configured to measure an absolute pressure or a differential pressure.

Abstract: An electrical device to be mounted on a support includes a housing having an inner part and an outer part secured to one another. The housing is mounted on the support in a position in which the outer part of the housing is accessible. A cover plate is provided for obscuring the view of at least a portion of the housing and surrounding areas of the support. The cover plate has at least one through opening in it. The cover plate is secured to the housing by a screw passing through the opening and an aperture. The screw engages the thread of a threaded bore when the device is fully assembled. The outer housing part includes webs at or within the opening for engaging the shank of the screw and temporarily holding it, and with it the cover plate, in their proper positions prior to engagement of the shank thread with the bore thread.

Abstract: A capacitor includes a cathode having a coating including an oxide of one of cobalt, molybdenum, and tungsten, a nitride of a metal selected from the group consisting of titanium, vanadium, zirconium, niobium, molybdenum, and tungsten, a carbide of a metal selected from the group consisting of vanadium, niobium, molybdenum, and tungsten, an intercalation carbon cathode, or an electrically conducting polymer selected from polyacetylene, polypyrrole, poly-p-phenylene, polythiophene, poly-3-phenylthiophene, and poly-3-(4-fluorophenyl)-thiophene, an anode including a metal selected from tantalum, aluminum, niobium, zirconium, and titanium, spaced from the coating, and an electrolyte in contact with the coating and the anode.

Abstract: An improved ceramic feedthrough capacitor design which results in distinct advantages in EMI (electromagnetic interference) filtering and therapeutic waveform management for implantable defibrillators and pacemakers and the like. The invention provides ceramic capacitor electrode plate designs which provide both low impedance decoupling for EMI suppression, and, at the same time provide an isolated common ground point through a separate coupling capacitor for electrical isolation of the filtered circuit from the metal case (usually titanium) of the defibrillator or the like. Such an arrangement allows the defibrillator HV (high voltage) output pulse to the heart to be referenced lead to lead (including reverse polarity), or from either lead to a common floating ground point or to the titanium case. The primary application of the invention is directed to implantable defibrillators where the output pulse to the heart is typically high voltage (up to 750 volts) and of short duration (typically in the 10.times.