Abstract: An environmentally sealed electronics assembly. The assembly includes a flexible envelope surrounding the active electronics board. The electronics board is insertable into the envelope and with subsequent sealing provides a reenterable but environmentally sealed active electronics package. Methods of manufacturing the assembly are also described.

Abstract: Sheet capacitive materials for use in forming a thin-film capacitor comprise an electrically nonconductive substrate, a layer of electrically conductive material disposed a surface of the substrate, and a layer of electrically nonconductive material disposed onto a surface of the conductive material layer. The conductive material layer includes a contact area along a first lengthwise edge of the substrate that is thicker than remaining portions of the material layer. A portion of the substrate adjacent a second lengthwise edge remains exposed. The electrically nonconductive material includes an anti-stick component, and covers the exposed substrate surface and a major portion of the material layer except for the contact area. A first and second sheet is constructed having contact areas along opposite lengthwise edges. The sheets are placed together so that the contact areas are oriented at opposite lengthwise edges, and are staggered so that the contact areas remain exposed.

Abstract: A ferroelectric capacitor structure variously having ceramic lower and upper electrodes, lower and upper insert layers, metal lower and upper electrodes, and a ferroelectric. The ceramic electrode(s) are variously connected with a writing terminal, and the metal electrodes are variously connected with a reading terminal. The use of a combination of metal and ceramic electrodes avoids both fatigue and leakage current.

Abstract: A magnetic noise eliminator mounted around the signal line of a computer or the like to stabilize the magnetic field produced by the signal line and to protect it against outside noise. The magnetic noise eliminator has two symmetrical cover shells connected together by forcing the longitudinal teeth and longitudinal grooves of one cover shell into engagement with the longitudinal grooves and longitudinal teeth of the other, and two longitudinally grooved magnetic blocks abutted together by forcing the longitudinal flange and longitudinal recess of one magnetic block into engagement with the longitudinal recess and longitudinal flange of the other.

Abstract: A capacitor including a cathode of a porous coating including an oxide of at least one metal selected from the group consisting of ruthenium, iridium, nickel, rhodium, platinum, palladium, and osmium disposed on each of two opposed electrically conducting plates; an anode disposed between and spaced from the porous coatings and the electrically conducting plates and including a metal selected from the group consisting of tantalum, aluminum, niobium, zirconium, and titanium; and an electrolyte disposed between and in contact with the porous coatings and the anode.

Abstract: Disclosed is a monolithic ceramic capacitor comprising dielectric ceramic layers made from a material which comprises an essential component of (1-.alpha.-.beta.){BaO}.sub.m .cndot.TiO.sub.2 +.alpha.Re.sub.2 O.sub.3 30 .beta.(Mn.sub.1-x-y Ni.sub.x Co.sub.y)O (0.0025.ltoreq..alpha..ltoreq.0.025; 0.0025.ltoreq..beta..ltoreq.0.05; .beta./.alpha..ltoreq.4; 0.ltoreq.x<1.0; 0.ltoreq.y<1.0; 0.ltoreq.x+y<1.0; 1.000<m.ltoreq.1.035) and from about 0.1 to 3.0 mols, relative to 100 mols of the essential component, of a side component MgO, and contains from about 0.2 to 3.0 parts by weight, relative to 100 parts by weight of said components, of an oxide of the type of Li.sub.2 O-B.sub.2 O.sub.3 -(Si,Ti)O.sub.2. The capacitor is low-priced and can be small-sized, while having large-capacity. It has a dielectric constant of 3000 or more, and has a high insulating resistance of 6000 M.OMEGA..cndot..mu.F or more and 2000 M.OMEGA..cndot..mu.F or more at 2 KV/mm and at room temperature and 125.degree. C.

Abstract: Disclosed is a monolithic ceramic capacitor comprising dielectric ceramic layers made from a ceramic composition, which comprises an essential component of (1-.alpha.-.beta.) {BaO}.sub.m .multidot.TiO.sub.2 +.alpha.{(1-x)M.sub.2 O.sub.3 +xRe.sub.2 O.sub.3 }+.beta.(Mn.sub.1-y-z Ni.sub.y Co.sub.z)O (0.0025.ltoreq..alpha..ltoreq.0.025; 0.0025.ltoreq..beta..ltoreq.0.05; .beta./.alpha..ltoreq.4; 0<x.ltoreq.0.50; 0.ltoreq.y<1.0; 0.ltoreq.z<1.0; 0.ltoreq.y+z<1.0; 1.000<m.ltoreq.1.035) and from 0.5 to mols, relative to 100 mols of the essential component, of a side component MgO, and contains from 0.2 to 3.0 parts by weight, relative to 100 parts by weight of said components, of an oxide of the type of Li.sub.2 O--(Si,Ti)O.sub.2 --Al.sub.2 O.sub.3 --ZrO.sub.2. The capacitor can be small-sized while having large capacity. It can be produced even through baking in atmospheres having a low oxygen partial pressure without producing semiconductors.

Abstract: A screening element for increasing the electromagnetic compatibility of electronic functional groups. The electronic functional groups being at least partially surrounded by electrically conducting, screening housing walls or containing printed circuit boards which have electrically conductive screening areas. The screening element forming an intermediate element for providing a sealing conductive bridge between screening areas. In the preferred embodiment, the screening element is in the form of a profile seal. The profile seal is composed of at least one compressible or elastic layer of conductive material which is applied directly to a surface of a support element.

Abstract: A latch connected to a surface mount component for subsequent connection to a printed circuit board is provided as well as a method for mounting a surface mount component to a printed circuit board. The surface mount component has a soldering tail extending therefrom and at least one latch insertable through an aperture in the printed circuit board, without force, such that the soldering tails extending from the surface mount component rest on corresponding soldering pads of the printed circuit board. As a result, surface mount components are mountable to a printed circuit board using standard, available equipment, such as a vacuum head placed component, and the components are subsequently soldered to the printed circuit board.

Abstract: A capacitor includes a substrate having a first trench, and a second trench, a first storage node having a first body and a first flange, the first body being on the first trench and having a first height and the first flange being extended at a top portion of the first body to a first length from the first body, a second storage node having a second body and a second flange, the second body being in the second trench and having a second height different from the first height of the first body, and the second flange being extended in a direction opposite to the first flange to a second length from the second length from the second body, a dielectric film on the surfaces of the first and second storage nodes, and a plate electrode on the dielectric film.

Abstract: Electrodes for electrochemical capacitor are modified with a metal macrocyclic complex made up of phthalocyanine or porphyrin ligands bound to a transition metal to achieve improved conductivity, reversibility, and charge storage capacity. The electrode is formed from a metal base and coated with an oxide, nitride or carbide of a transition metal or with a conductive polymer. This coating is modified with the metal macrocyclic complex. Suitable metal macrocyclic complexes are iron phthalocyanine (FePc), iron meso-tetra(N-methyl-4-phenyl)porphyrin (FeTPP) or cobalt protoporphyrin (CoPP).

Abstract: A computer system electromagnetic interference (EMI) shield housing is bolted on a rack for allowing simplified access to modules and circuit boards mounted to a chassis which is slidably mounted to the interior of the housing. EMI gasketing is mounted integral with and extending around the perimeter of a first access opening of the housing and a rear access opening of the housing. A front panel and a rear panel of the chassis provides EMI shielding when the chassis is fully recessed within the housing. The chassis can be extended beyond the housing a distance adequate to allow access to all aspects of computer system modules and to cables at the rear of the chassis. A hinge mounted to the rear of the chassis and to the interior rear of the housing in conjunction with a cable trough and conduits located on the hinge allows power and input/output (I/O) cables to move outwardly and extend with the chassis.

Abstract: A card holder (10) for a card (11), such as a PCB, includes a bottom member (13) and a top cover (14) which easily snap together to enclose the card (11) therebetween. The bottom member (13) may be made from a precision hot-flow semi-solid aluminum forging operation, and the top cover (14) may be made as an aluminum stamping. The overall assembly of the card holder (10) has high mechanical strength and rigidity, and the top member (14) merely serves as a cover. A substantially complete EMI shielding is provided, and both members are hard anodized for electrical insulation. The card holder (10) is cost-effective, yet rugged and reliable, and the anodizing provides a pleasing product appearance. An injection molding operation is not necessary, and a separate plastic part is eliminated.

Abstract: A small and highly sensitive capacitance type pressure sensor is obtained by filling an alkali halide material such as KBr into a through-hole, forming a conductive thin film on the surface, and dissolving and removing the alkali halide material. An insulating plate disposed with a through-hole in the thickness direction is filled with a molten alkali halide material such as KBr. After forming a conductive thin film on the surface of the alkali halide material filled into the through-hole and the vicinity thereof, the alkali halide material is dissolved by water and removed. In this way, a diaphragm is made of the through-hole and the conductive thin film. A curve of the diaphragm caused by a pressure difference between the both faces of the conductive thin film is detected as a capacitance change between the conductive thin film and the electrode layer.

Abstract: An electrochemical cell for etching a metal workpiece such as an aluminum foil, a method for etching the foil using the electrochemical cell, and foil thus produced is provided. The cell includes an etch tank having an etch electrolyte disposed therein and containing at least a first and a second compartment each containing (i)an etch electrolyte, (ii) a cathode plate, and (iii) an ion exchange membrane separator portion comprising an ion exchange polymeric material effective to substantially retard or prevent reduction of the oxidizing agent or agents present in the etch electrolyte, the first and second compartments being arranged in the etch tank with the ion exchange membrane separator portions in facing relationship one to the other; and a metal workpiece such asan aluminum foil anode present in the etch tank and disposed between each said first and second compartments.

Abstract: An EMI gasket blocks electromagnetic radiation between electrically conductive bodies, is disposed to occupy an area, and can have openings for conductors or connectors. A resilient core is covered on opposite surfaces with a conductive sheet material such as a metalized polymer fabric that can be woven, nonwoven, knitted, braided, etc., for providing electromagnetic sealing when the gasket is compressed between the bodies. The polymer sheet is coupled through between the opposite faces of the gasket along lengthwise seams that are heat sealed through the core or have conductive thread, yarn, wire or fasteners that extend through the core. Preferably, the gasket is quilted using conductive thread or yarn.

Abstract: A precision analog metal-metal capacitor is fabricated by forming a first capacitor plate in an insulation layer by forming a trench therein, depositing metal within the trench and planarizing the device. A thin dielectric layer is then deposited and patterned over the first capacitor plate. A second insulator is then deposited over the device and discrete openings etched therein to expose the insulation layer and first metal plate. Metal is deposited within the openings and planarized, thereby forming a contact to the first metal plate and the second metal plate of the capacitor.

Abstract: A thin film protected capacitor structure having a thin film capacitor and a protection device is provided on an integrated circuit wafer. The wafer has a low resistivity substrate of a first type disposed under an epitaxial layer of a second type different from the first type. The structure includes a first heavily doped region, which is of the first type, in and through the epitaxial layer, and an oxide layer having a first oxide region disposed above the first heavily doped region. The first heavily doped region and the low resistivity substrate form the first plate of the thin film capacitor. There is also included a metal layer disposed above the first oxide region. A portion of this metal layer forms the second plate of the thin film capacitor. Between the second plate and the first plate, the aforementioned first oxide region represents the insulating dielectric. There is also included a second heavily doped region in the epitaxial layer.

Abstract: A method for making electrical connection to an electrically conductive surface, providing improved electrical performance. The electrical connection is made across an extent of the surface, rather than at just one point of the surface, and furthermore is made to be substantially nonuniform along its extent. This nonuniformity can be structured to provide preferential admittance at plural apertures, with these apertures having suitable dimensions and spacings. By this method, improved electrical performance can be provided, compared to prior art methods that connect substantially at one point, or that connect substantially uniformly along an extent.

Abstract: A terminal element for compensating length tolerances of electrical capacitors, particularly electrolyte capacitors, that are secured to busbars in capacitor batteries is fashioned as a straddling dowel. The terminal element is attached as a length-compensating element in a blind hole located in the capacitor terminal.