Abstract: The current invention is a method and apparatus for shock mounting an obj in a container. A container is provided having side walls to accommodate movement of the object. The container is filled with a fluid having substantially the same density as the object to be shock mounted. The object is mounted in the container by a plurality of shock mounts. In accordance with the apparatus, a container is provided with an incompressible fluid therein. The object to be shock mounted is immersed in the fluid and suspended at an equilibrium position in the fluid filled container. The object can be a circuit board or some other similarly delicate device.

Abstract: A method of producing a composite component and a composite device which are small in size, high in the mass-production aptitude, and stable in the electrical characteristics. The composite component includes an inductor (1), coupling unit (3), and at least one circuit component (2) different from the inductor (1). The inductor (1) includes a coil support (12) having a coil winding portion (123) at the middle body thereof, and has a coil (11) wound around the coil winding portion (123). The coupling unit (3) is arranged such that one end of metal pieces (31 and 32) is fixed to one end face of the two end faces of the coil support (12) and the other ends of the metal pieces face each other across a space. The circuit component (2) is a chip component having electrodes (22 and 23) at two opposite ends of a base body (21), and is disposed between the metal pieces (31 and 32). The electrodes ( 22 and 23) are mounted fixedly to the metal pieces (31 and 32).

Abstract: An avionics line replaceable unit (LRU), of the type having numerous electronic circuit cards disposed therein in a parallel fashion. The cards being securely held in place when the cover of the LRU is screwed on thereby actuating a spring which transfers force to the circuit cards.

Abstract: A printed circuit board having a through-hole in a land is disclosed. A solder resist of a photo-curable solder resist is formed on the substrate surface of the printed circuit board and the through-hole is stopped with the same photo-curable solder resist as the solder resist layer. If a land on which a chip component is mounted co-exists with a land on which a discrete component is mounted, only the through-hole in the land on which the chip component is mounted is selectively stopped with the photo-curable solder resist. The solder resist layer and the photo-curable solder resist stopping the through-hole are formed by selective light exposure from both the front and reverse surfaces of the substrate.

Abstract: A docking station (10) slidably receives a device (12) to provide make, break or tap functions, respectively, in a circuit interface. The circuit interface includes a pair of connector housings (17, 18) provided with flexible (or compressible) electrical connectors (19, 20), respectively. A camming member (28, 29; 31, 32; 44) separates the connector housings (17, 18) as the device (12) is slidably inserted into the docking station (10), thereby assuring a substantially zero insertion force on the circuit interface. Preferably, the circuit interface is between the flexible electrical connectors (19, 20), a printed circuit board (13), and a flexible etched circuit (15). The flexible etched circuit (15) is provided with a stiffener (24) resiliently biased by springs (27).

Abstract: A semiconductor circuit device includes a multi-layered substrate comprising a plurality of signal lines sandwiched between a power source line and a ground line, with insulation layers formed therebetween to reduce fluctuation of a ground line potential at the time of simultaneous switching of the signal lines and to increase the operational speed. The signal lines provides bidirectional current paths and is disposed between the current source line and the ground line. The multi-layered substrate is formed around a semiconductor pellet. Electrode pads are formed on the insulation layer over the ground line on the same level as the signal lines and generally on the same level as the main surface of the semiconductor pellet where electrodes pads are formed. Bonding wires are used to electrically connect the electrode pads on the pellet and the electrodes formed on the insulation layer.

Abstract: To facilitate the registered connection between a ball grid array package and an associated multi-tiered circuit board, a spaced series of vias are formed transversely through the board substrate between its opposite first and second sides. A spaced series of relatively shallow, circularly cross-sectioned socket areas, offset from the vias, are also formed on the first side of the circuit board. The sockets have diameters slightly larger that those of the generally ball-shaped leads of the BGA package, and are positioned on the same centerline pattern as the leads. After the vias and sockets are formed, a multi-layer metallic coating is deposited on their interiors and around their open ends on the first board side, with the coating being extended across the first board side between associated socket and via pairs.

Abstract: There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.

Abstract: This invention is a printed circuit card latching and stiffening assembly with an elongated stiffener member located on the top edge of the printed circuit card. A latch is pivotally attached to the stiffener member. At least one compliant clip is mounted on the stiffener member so that the clip may be slid to engage the pivotal latch in a locked position. The latch also includes a slot for engaging an electronic enclosure structure, such as a card cage. The slot enables the card to be cammed into the base of the card cage when the pivotal latch engages the sliding compliant clip. The latching and stiffening assembly further includes at least one pivotal member which may pivot from the stiffener member to engage a side of the printed circuit card further stiffening the card.

Abstract: An insertion and extraction device for plug-in modules provided in component carriers, having a holding bracket and a pivoting lever. The holding bracket has a receiving slit for a front plate supports a console and two bearing cylinders, and the pivoting lever comprises a housing part and a lid part corresponding to this housing part, these parts being connected with frictional lockup by means of bushings and integral plug pins, and having integral support trays for the bearing cylinders.

Abstract: An electronic component includes a substrate having chip parts. First lead terminals and second lead terminals are led out from one end of the substrate toward an outside. The first lead terminal has a holding portion at an intermediate portion. The second lead terminal has a connecting portion for connecting to the substrate and an inserting portion for inserting to the hole of an external circuit board. The connecting portion and the inserting portion of the second lead terminal is connected with an oblique portion. The holding portion of the first lead terminal is in a same plane perpendicular to the surface of the substrate with a boundary portion between the oblique portion and the inserting portion of the second lead terminal.

Abstract: The present invention comprises a semiconductor chip 1, chip electrodes 2 provided on one surface of the semiconductor chip 1, and connected to semiconductor elements formed in the semiconductor chip, a flexible insulating film 3 wrapping the chip electrodes, wiring layers 5 formed in the insulating film 3, and electrically connected to the chip electrodes 2, and terminal electrodes 6 provided on that surface of the insulating film 3 which extends on the upper surface of the chip 1, the electrodes 6 being electrically connected to the wiring layers 5, and functioning as external terminals of the chip 1. Thus, the terminal electrodes 6 are introduced, by means of the wiring layers 5 formed in the insulating film 3, onto that surface of the insulating film 3 which extends on the upper surface of the chip 1.

Abstract: A semiconductor device comprises a semiconductor chip carrier and a semiconductor chip packaged therein with a resin. The semiconductor chip carrier comprises a printed wiring substrate with conductor patterns, a first adhesive layer formed on at least an outer peripheral portion of the substrate, a second adhesive layer formed on the conductor pattern of the substrate, a lead frame joined to the substrate through the adhesive layers and comprised of plural leads for external connection. The conductor pattern is electrically connected to a part of inner leads of the lead frame.

Abstract: A stiffening device for an electronic assembly which engages each circuit card assembly (CCA) in approximately its center of area. Each CCA which is positioned within an electronic enclosure has a collar which surrounds a hole through its center of area. A shaft is passed through the electronic enclosure and pins engage each of the collars. The shaft and pin assembly rigidly connects each of the CCA's to the body of the electronic enclosure. This has the effect of reducing the vibrational deflection and potential damage to each CCA, allowing the electronic enclosure to survive a much higher vibrational and shock environment.

Abstract: A tamperproof arrangement for an integrated circuit device. The arrangement includes a package and lid fabricated of heavy metals to prevent X-radiation or infrared detection of circuit operation. Sensors and control circuitry are located on the integrated circuit die itself which detect increased temperature and radiation and clear or zeroize any sensitive information included within the integrated circuit device. Electrode finger grids above and below the integrated circuit die detect physical attempts to penetrate the integrated circuit die. Critical circuit functions are segregated from non-critical functions. Power applied to the integrated circuit device is monitored and separated for critical and non-critical circuit functions.

Abstract: In a semiconductor chip carrier which has a rectangular insulating substrate having four corners and electrode leads deposited on a peripheral surface of the substrate and which is mounted onto a circuit board with each electrode lead being connected to the corresponding board electrode through a solder mass, widths of the electrode leads are wider at each of the four corners than those of the electrode leads located at positions except the four corners. An area of the contact through the solder between each electrode lead positioned at each corner and the corresponding board electrode is wider than that between each of the other electrode lead and each corresponding board electrode. As each electrode lead positioned at each corner is strongly connected to the board electrode, it is seldom peeled off from the board electrode even when the circuit board is twisted or warped during or after the process of mounting the chip carrier onto the circuit board.

Abstract: A novel printed circuit board is disclosed. The printed circuit board has a high density of circuit components with lower circuit components residing within recesses in a printed wiring board and upper circuit components residing above the lower circuit components.

Abstract: A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex circuit card extends into an elastomeric end and terminates with a ball shaped contact which is angled to wipe against mating pads on the printed circuit card for making electrical contact. The cable assembly uses multiple wires attached to a plurality of elastomeric connectors. At least one elastomeric connector is attached to each end of the cable assembly and each elastomeric connector has a plurality of contacts which are used to mate with a plurality of pads on the surface of the printed circuit board. The elastomeric connector described in the present invention provides a high density, cable-to-board interconnection that is perpendicular to the surface of the printed circuit board.

Abstract: A circuit board (12) and electrical connector (10) mounted to an edge (18) thereof is disclosed. The circuit board (12) includes an edge (18) and two major surfaces (14, 16) extending therefrom having circuitry (20). Plated through holes (24) are arranged adjacent the edge and are interconnected to circuitry on the circuit board. Each plated through hole (24) is associated with an opening such as a slot (26) or partial slot (27) that is formed in the edge (18) of the board so that it intersects the hole. The posts (32) of the connector (10) extend into the openings (26, 27) preferably in interference fit therewith whereafter soldering completes the electrical connections of the posts to the through holes.

Abstract: Disclosed is an apparatus and method for delivering power utilizing a multiplane power via matrix wherein the vias are each interconnected on each of the planes through which they pass such that a current flowing along any particular via, or via group, is free to either continue along its current path, or to move across any of the planes as a function of least resistance. The invention provides a system of vias for transferring power from any particular first plane to any desired second plane.