Abstract: Zero wire load based assertions are generated. A zero wire load report is generated for a set of logic in a hardware description language corresponding to a circuit design. A set of assertions is identified for the circuit design by parsing the zero wire load report based in part on real data values corresponding to best case delays for one or more input pins and one or more output pins in a plurality of macros of the circuit design. A circuit may be fabricated based on the set of assertions.

Abstract: Swap insertion in mapping logical qubits on a quantum circuit is performed by obtaining an operation sequence including a plurality of operations to be executed on a quantum circuit. The quantum circuit including a plurality of physical qubits and a plurality of couplings. Finding a blocking set of operations including leading unresolved operation in the operation sequence. Calculating a first coupling score for each coupling of the plurality of couplings based on total reduction of shortest path lengths of a plurality of unresolved operations of the plurality of operations Selecting a coupling based on the first coupling score of each coupling. Updating the blocking set by removing any leading unresolved operations from the blocking set that can be performed after swapping a pair of logical qubits stored in a pair of physical qubits connected by the selected coupling.

Abstract: Embodiments included herein are directed towards a system and method for implementing an IC package design with an IC package design estimator. Embodiments may include estimating a number of layers for an integrated circuit (IC) package design that includes a plurality of IC die designs. Embodiments may further include determining whether the estimated number of layers can accommodate routing demands for interconnections between the IC package design and each of the plurality of IC die designs. Embodiments may also include identifying a number of layers required to perform routing between each of the plurality of IC die designs. Embodiments may further include determining a power layer or ground layer based upon, at least in part, one or more factors and generating an output for the IC package design based upon, at least in part, the estimated number of layers and the power layer or ground layer.

Abstract: A computer-method is provided for designing a router network to connect components of an integrated circuit, where the router network comprises a plurality of connected data routing elements. The method comprises generating an undirected graph to represent a mesh of candidate router elements, where the candidate data routing elements are positioned dependent on at least one characteristic of the integrated circuit. The undirected graph comprises a node to represent each candidate data routing element and an edge to represent each connection between the candidate data routing elements.

Abstract: Event tracing for a system-on-chip (SOC) may be implemented by instrumenting, using a computer, a design for the SOC with instrumentation program code that, responsive to execution by a processor of the SOC, generates software trace events. The design may be specified in a high level programming language. A circuit design specifying an accelerator circuit for a function of the design may be generated using the computer. The accelerator circuit is configured for implementation within programmable circuitry of the SOC. The circuit design may be instrumented to include trace circuitry using the computer. The trace circuitry may be configured to detect hardware trace events for operation of the accelerator circuit, receive the software trace events, and combine the hardware and software trace events into time synchronized trace data.

Abstract: A computing system determines a first set of registers having constant next-state functions in the netlist. The computing system identifies an observable gate in fan-out of a register in the first set, wherein an observable gate is a gate that is critical to a verification or synthesis context. The computing system identifies a second set of reducible registers in the fan-in of the observable gate. The computing system modifies at least one of an initial value and a next-state function of at least one reducible register of the second set to reflect an observable value of the at least one reducible register observed at the observable gate. The computing system simplifies one or more logic gates implementing the observable gate and the fan-in of the observable gate by eliminating a reference to a constant next-state function register in the first set of registers.

Abstract: A system for concurrent CAx workflow includes a collaborative server that manages a model of an engineering object, the model comprising at least design data and analysis data corresponding to the design data, a design client for editing of the design data by a design user, an analysis client for editing of the analysis data by an analysis user concurrent with editing of the design data by the design user; and wherein the collaborative server and the analysis client are collectively configured (i.e., one or both are configured) to enable the analysis user to edit the analysis data, view a plurality of geometric elements within the design data, and create a reference within the analysis data to a selected geometric element of the plurality of geometric elements within the design data. A corresponding apparatus, method, and computer-readable medium are also disclosed herein.

Abstract: Methods, apparatuses, and systems for determining a binary mask pattern from a pixelated mask pattern include: determining, by a processor, based on a fast marching method (FMM), arrival values for pixels of a portion of the pixelated mask pattern; determining the binary mask pattern based on the arrival values; and updating at least one of the arrival values based on a comparison between a design pattern corresponding to the pixelated mask pattern and a substrate pattern simulated based on the binary mask pattern.

Abstract: A test pattern includes first line patterns disposed at a first level, having discontinuous regions spaced apart by a first space, having a first width, and extending in a first direction. The test pattern includes a connection line pattern disposed at a second level and extending in the first direction, second line patterns disposed at the second level, branching from the connection line pattern, having a second width, and extending in a second direction perpendicular to the first direction. The test pattern includes via patterns disposed at a third level, having a third width, and formed around an intersection region having the first width of the first line pattern and the second width of the second line pattern. First pads are connected with the first line patterns. A second pad is connected with the connection line pattern.

Abstract: A method of fabricating an integrated circuit is disclosed. The method includes defining a via grid, generating a first layout design of the integrated circuit based on at least the via grid or design criteria, generating a standard cell layout design of the integrated circuit, generating a via color layout design of the integrated circuit based on the first layout design and the standard cell layout design, performing a color check on the via color layout design based on design rules, and fabricating the integrated circuit based on at least the via color layout design. The first layout design has a first set of vias arranged in first rows and first columns based on the via grid. The standard cell layout design has standard cells and a second set of vias arranged in the standard cells. The via color layout design has a third set of vias.

Abstract: A per-chip equivalent oxide thickness (EOT) circuit sensor resides in an integrated circuit. The per-chip EOT circuit sensor determines electrical characteristics of the integrated circuit. The measured electrical characteristics include leakage current. The determined electrical characteristics are used to determine physical attributes of the integrated circuit. The physical attributes, including EOT, are used in a reliability model to predict per-chip failure rate.

Abstract: A method to collect data and train, validate and deploy statistical models to predict overlay errors using patterned wafer geometry data and other relevant information includes selecting a training wafer set, measuring at multiple lithography steps and calculating geometry differences, applying a plurality of predictive models to the training wafer geometry differences and comparing predicted overlay to the measured overlay on the training wafer set. The most accurate predictive model is identified and the results fed-forward to the lithography scanner tool which can correct for these effects and reduce overlay errors during the wafer scan-and-expose processes.

Abstract: In one implementation, a multilayered printed circuit board is configured to redirect current distribution. The current may be distributed by steering, blocking, or otherwise manipulating current flows. The multilayered printed circuit board includes at least one power plane layer. The power plane layer does not distribute current evenly. Instead, the power plane layer includes multiple patterns with different resistances. The patterns may include a hatching pattern, a grid pattern, a directional pattern, a slot, a void, or a continuous pattern. The pattern is a predetermined spatial variation such that current flows in a first area differently than current flows in a second area.

Abstract: The present embodiments relate to critical path aware voltage drop analysis. A method can include identifying a number of cell instances with largest individual power consumption values. The method can include identifying, by performing static timing analysis, a first number of circuit timing paths of an integrated circuit design with largest timing violations. The method can include identifying, by performing the static timing analysis, a second number of circuit timing paths of the integrated circuit design. Each of the second number of circuit timing paths has a timing violation and is formed by one or more of the identified number of cell instances. The method can include generating logic state toggle vectors by propagating logic states through the first and second numbers of circuit timing paths. The method can include performing voltage drop analysis on the integrated circuit design using the generated logic state toggle vectors.

Abstract: A method for semiconductor structure design includes performing, by a processor, error processing of an initial design file layout. The processor further detects a tip-to-tip (T2T) structure design violation at a design cell boundary for a metal layer above (Ma) a via (Vx) at a tip of the Ma for the initial design file layout for a semiconductor structure based on a library of pattern rules. Upon detection of the T2T structure design violation, the processor retargets the Vx for generating a resulting design file layout of the semiconductor structure.

Abstract: A method, system, and computer program product for enhancing integrated circuit noise performance. The method is for arranging target wires in a target region, the method including: for each wire in the target wires, obtaining a signal jump interval with respect to each of the other wires in the target wires, wherein the signal jump interval of one wire with respect to a further wire is a time interval between occurrence of signal jump on the one wire and occurrence of signal jump on the further wire; calculating a corresponding time influence factor based on the signal jump interval, wherein the time influence factor is a decreasing function of the signal jump interval; and arranging the target wires in the target region based on the time influence factor. Coupling noise between wires may be reduced according to the technical solution of an embodiment of the present invention.

Abstract: An apparatus including a memory storing instructions and a processor executing the instructions to perform a method including: performing error processing of an initial design file layout; detecting a tip-to-tip (T2T) structure design violation at a design cell boundary for a metal layer above (Ma) a via (Vx) at a tip of the Ma for the initial design file layout for a semiconductor structure based on a library of pattern rules; retargeting the Vx for generating a resulting design file layout of the semiconductor structure; and generating a physical semiconductor structure based on the resulting design file layout of the semiconductor structure.

Abstract: A method, system, and computer program product for enhancing integrated circuit noise performance. The method is for arranging target wires in a target region, the method including: for each wire in the target wires, obtaining a signal jump interval with respect to each of the other wires in the target wires, wherein the signal jump interval of one wire with respect to a further wire is a time interval between occurrence of signal jump on the one wire and occurrence of signal jump on the further wire; calculating a corresponding time influence factor based on the signal jump interval, wherein the time influence factor is a decreasing function of the signal jump interval; and arranging the target wires in the target region based on the time influence factor. Coupling noise between wires may be reduced according to the technical solution of an embodiment of the present invention.

Abstract: A method of generating a layout usable for fabricating an integrated circuit is disclosed. The method includes generating a block layout layer usable in conjunction with a first conductive layout layer. The first conductive layout layer includes a fuse layout pattern, and the block layout layer includes a block layout pattern overlapping a portion of a fuse line portion of the fuse layout pattern. A second conductive layout layer is generated to replace the first conductive layout layer. The generating the second conductive layout layer includes performing an optical proximity correction (OPC) process on the first conductive layout layer except the portion of the fuse line portion of the fuse layout pattern corresponding to the block layout pattern.

Abstract: A method of determining colorability of a layer of a semiconductor device includes iteratively decomposing a conflict graph to remove all nodes having fewer links than a threshold number of links. The method further includes determining whether the decomposed conflict graph is a simplified graph based on a comparison between the decomposed conflict graph and a stored conflict graph. The method further includes determining whether the decomposed conflict graph is colorable based on a number of masks used to pattern the layer of the semiconductor device. The method further includes flagging violations in response to a determination that the decomposed conflict graph is not colorable.