Abstract: An integrated circuit design method includes receiving an integrated circuit design, and determining a floor plan for the integrated circuit design. The floor plan includes an arrangement of a plurality of functional cells and a plurality of tap cells. Potential latchup locations in the floor plan are determined, and the arrangement of at least one of the functional cells or the tap cells is modified based on the determined potential latchup locations.

Abstract: Various embodiments provide for assigning a clock pin to a clock tap within a circuit design based on connectivity between circuit devices of the circuit design. For some embodiments, an initial clock tap assignment, between a clock tap of a circuit design and a clock pin of the circuit design, is accessed as input, and a modified clock tap assignment (between the clock tap and another clock pin of the circuit design) can be generated based on one or more of the following considerations: a clock tap assignment should try to assign clock pins of connected circuit devices to the same clock tap; a clock tap assignment should try to assign clock pins of connected circuit devices having the critical timing problems; a clock tap assignment should try to assign clock pins of connected circuit devices to clock taps with longer common path length.

Abstract: An information processing apparatus includes a processor that generates a first node when a bus wiring condition is changed from a first condition to a second condition or when a result of bus wiring is generated based on the first condition. The processor stores the first condition and design data of bus wiring after the change in a storage unit in association with the first node when the bus wiring condition is changed. The processor stores the result of bus wiring, and the design data of bus wiring after the generation in the storage unit in association with the first node when the result of bus wiring is generated, the first condition. The processor searches, upon receiving a designation of a bus wiring condition, for a second node that matches the designated bus wiring condition. The processor outputs design data of bus wiring corresponding to the second node.

Abstract: A storage system includes a charging station assembly for charging a plurality of power sources and a method thereof. The charging station assembly includes a charging station support fixing the charging station assembly to a base of the storage system, a plurality of charging stations, each charging station including a charger that charges the plurality of power sources and a power source transport device enabling relocation of the power source between an operational position on a remotely operated vehicle and a charging position in or at any one of the plurality of charging stations.

Abstract: Described is a method for implementing a snap to capability that enables the manufactured of a valid pattern in a semiconductor device, based upon an originally invalid pattern.

Abstract: Techniques regarding functional placement of one or more logic gates in a periodic circuit row configuration are provided. For example, one or more embodiments described herein can comprise a system, which can comprise a memory that can store computer executable components. The system can comprise a processor, operably coupled to the memory, and that can execute the computer executable components stored in the memory. The computer executable components can comprise an optimization component, operatively coupled to the processor, that can determine functional placement of a logic gate in a self-aligned double patterning process that can form a periodic circuit row configuration.

Abstract: A method of designing a chip having an integrated circuit is provided. The method includes obtaining delta cell delays and delta net delays according to a process, voltage, and temperature (PVT) corner change with respect to a plurality of cells and a plurality of nets forming the integrated circuit; analyzing sensitivity with respect to a delay according to the PVT corner change of a plurality of paths in the integrated circuit, by using the delta cell delays and the delta net delays; determining N-number of sensitivity-critical paths among the plurality of paths based on a result of the analysis, wherein N is an integer greater than or equal to 0; and performing an engineering change order (ECO) based on a result of the determination.

Abstract: This application discloses a computing system implementing a schematic capture tool to place and connect parts in a schematic design of a printed circuit board assembly. The computing system implementing the schematic capture tool can select a type of communication interface to connect the parts in the schematic design and identify an interface definition that corresponds to the selected type of communication interface. The schematic capture tool can locate a mapping that describes connectivity between the parts and the interface definition, and automatically modify the schematic design to include an instance of the interface definition in the schematic design and connect the parts in the schematic design to the instance of the interface definition based on the mapping. The schematic capture tool also can utilize the interface definition to set constraints for or add terminations to the connection between the parts in the schematic design.

Abstract: Prediction based systems and methods for optimizing wafer chucking and lithography control are disclosed. Distortions predicted to occur when a wafer is chucked by a chucking device are calculated and are utilized to control chucking parameters of the chucking device. Chucking parameters may include chucking pressures and chucking sequences. In addition, predicted distortions may also be utilized to facilitate application of anticipatory corrections. Controlling chucking parameters and/or applying anticipatory corrections help reducing or minimizing overlay errors.

Abstract: A system for evaluating candidate materials for fabrication of integrated circuits includes a data processor coupled to a memory. Roughly described, the data processor is configured to: calculate and write to a first database, for each of a plurality of candidate materials, values for each property in a set of intermediate properties; calculate and write to a second database, values for a selected target property for various combinations of values for the intermediate properties and values describing candidate environments; and for a particular candidate material and a particular environment in combination, determine values for the intermediate properties for the candidate material by reference to the first database, and determine the value of the target property for the candidate material by querying the second database with, in combination, (1) the determined intermediate property values of the candidate material and (2) a value or values describing the particular environment.

Abstract: Generating a template-driven schematic from a netlist of electronic circuits is disclosed. The template-driven schematic may be useful to generate a set of related circuits for a single overall design as well as allow for a common transfer mechanism between different Computer Aided Design (CAD) systems. To assist in portability of designs, a common file format is disclosed based on a structured text file (e.g., XML). Further, in the disclosed approach, it is possible to not only place primitives but create custom symbols as well. In addition, primitives and symbols may be attached to models, simulation settings may be added, and routing of the circuit in a schematic may be completed. Associated devices and methods are disclosed as well.

Abstract: A semiconductor device includes a first standard cell and a second standard cell. A single diffusion break region extending in a first direction is formed in the first standard cell, and a first edge region extending in the first direction and having a maximum cutting depth in a depth direction perpendicular to the first direction is in the first standard cell. A double diffusion break region extending in the first direction is formed in the second standard cell, and a second edge region extending in the first direction and having the maximum cutting depth in the depth direction is formed in the second standard cell.

Abstract: A method is disclosed that includes providing an IP bank, an application bank, and a technology bank; generating a hierarchical table based on the IP bank and the application bank; performing an estimation of at least one of a performance value, a power value, an area value and a cost value, which corresponds to the hierarchical table, by using the technology bank, to output an result data as a basis of fabrication of a system.

Abstract: A dynamic memory management method for layout verification tools that maximizes main memory usage and minimizes required disk storage capacity. Layout data generated during each given geometric operation is retained in main memory at the end of the given geometric operation. At the beginning of each new (current) geometric operation, an estimated amount of main memory required to perform the current geometric operation at peak processing speed is determined. When insufficient available main memory is available, a Central Balancer Module determines whether previously generated layout data can be moved from main memory to disk storage. Layout data file(s) are then selected based on minimizing the amount of transferred layout data needed to provide the required estimated amount. A Distributed File Manager then transfers the selected layout data file(s) from main memory to disk storage, thereby facilitating execution of the current geometric operation at peak operating speed.

Abstract: A method of generating electronic circuit layout data can include electronically providing data representing a first standard cell layout including a first scaling enhanced circuit layout in an electronic storage medium. The first scaling enhanced circuit layout included in the first standard cell layout can be electronically defined using a marker layer. The first scaling enhanced circuit layout can be electronically swapped for a second scaling enhanced circuit layout to electronically generate data representing a second standard cell layout in the electronic storage medium. The data representing the second standard cell layout can be electronically verified.

Abstract: In accordance with an embodiment of the present invention, a method of testing a plurality of semiconductor devices includes applying a stress voltage having a peak voltage on a shield line disposed over a substrate. The substrate has functional circuitry of a semiconductor device. A fixed voltage is applied to a first metal line disposed above the substrate adjacent the shield line. The first metal line is coupled to the functional circuitry and is configured to be coupled to a high voltage node during operation. The peak voltage is greater than a maximum fixed voltage. The shield line separates the first metal line from an adjacent second metal line configured to be coupled to a low voltage node during operation. The method further includes measuring a current through the shield line in response to the stress voltage, determining the current through the shield line of the semiconductor device, and based on the determination, identifying the semiconductor device as passing the test.

Abstract: Vacant areas of a layer of an integrated circuit design are filled with shapes connected to the appropriate nets.

Abstract: Aspects of the disclosed technology relate to techniques of pattern-based resolution enhancement. Surrounding areas for a plurality of geometric layout elements in a layout design are partitioned into geometric space elements. The plurality of geometric layout elements and the geometric space elements are grouped, through pattern classification, into geometric layout element groups and geometric space element groups, respectively. Optical proximity correction is performed for each of the geometric layout element groups and sub-resolution assist feature insertion is performed for each of the geometric space element groups. The results are applied to the plurality of geometric layout elements and the geometric space elements in the layout design.

Abstract: Methods and systems for providing overlay corrections are provided. A method may include: selecting an overlay model configured to perform overlay modeling for a wafer; obtaining a first set of modeled results from the overlay model, the first set of modeled results indicating adjustments applicable to a plurality of term coefficients of the overlay model; calculating a significance matrix indicating the significance of the plurality of term coefficients; identifying at least one less significant term coefficient among the plurality of term coefficients based on the calculated significance matrix; obtaining a second set of modeled results from the overlay model, the second set of modeled results indicating adjustments applicable to the plurality of term coefficients except for the identified at least one less significant term coefficient; and providing the second set of modeled results to facilitate overlay correction.

Abstract: Various embodiments provide for circuit design routing based on parallel run length (PRL) rules. In particular, a plurality of PRL rules is accessed and used to generate a set of additional routing blockages around an existing routing blockage of the circuit design. The additional routing blockages can be positioned relative to the existing routing blockage. During routing, the set of additional routing blockages can be modeled into a capacity map, which is then used by global to generate routing guide(s) between at least two nodes of the circuit design. In doing so, the various embodiments can assist in routing a wire while avoiding violation of the plurality of PRL rules with respect to the existing blockage, can speed up performance of global routing, can make it easier for detailed routing to honor routing guides produced by global routing, and can speed up performance of detailed routing in resolving DRC violations.