Patents Examined by Cathy F. Lam
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Patent number: 7294389Abstract: In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.Type: GrantFiled: September 1, 2004Date of Patent: November 13, 2007Assignee: Canon Kabushiki KaishaInventors: Takayuki Teshima, Takayuki Yagi, Yasuhiro Shimada, Takashi Ushijima
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Patent number: 7295421Abstract: A multilayer ceramic electronic component includes a skittered laminated body including internal electrodes that have a strength that is greater than that of ceramic layers provided therein. End portions of the internal electrodes protrude from end surfaces of the laminated body and are deformed so as to extend along the end surfaces by a barrel polishing process using balls. When external electrodes are formed on the end surfaces of the laminated body, a large contact area with the internal electrodes can be obtained. Therefore, a reliability of the electrical connection between the electrodes is definitely secured.Type: GrantFiled: February 18, 2004Date of Patent: November 13, 2007Assignee: Murata Manufacturing Co., Ltd.Inventors: Kenjiro Mihara, Atsushi Kishimoto, Hideaki Niimi
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Patent number: 7294393Abstract: In a sheet material (1), a bonding layer (2) is provided, and then a high-strength layer (3) is laminated on the bonding layer (2). The bonding layer (2) is made of an epoxy resin being a thermosetting material. The high-strength layer (3) is made of polyimide, which is not softened at a thermosetting temperature of the epoxy resin and has a tensile rupture strength higher than that of the cured thermosetting material. Moreover, the polyimide has a tensile rupture strength of 100 MPa or higher at 23° C. and a tensile rupture elongation of 10% or higher at 23° C. Assuming that a tensile rupture strength at ?65° C. is a and a tensile rupture strength at 150° C. is b, a ratio (a/b) is 2.5 or less.Type: GrantFiled: June 27, 2005Date of Patent: November 13, 2007Assignee: NEC CorporationInventors: Hideya Murai, Tadanori Shimoto, Kazuhiro Baba, Katsumi Kikuchi
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Patent number: 7291380Abstract: A method of plating a substrate including coating a substrate surface, laser-treating a region of the coated surface, and plating the region.Type: GrantFiled: July 9, 2004Date of Patent: November 6, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventors: Peter S. Nyholm, Curt Lee Nelson, Niranjan Thirukkovalur, Paul McClelland
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Patent number: 7288843Abstract: A substrate, in particular, a multilayer substrate, includes a mounting and electrical-connection support, and a face for mounting at least one integrated circuit chip (IC chip). The substrate and the mounted IC chip are placed in an injection mold. The injection mold has two parts that surround the periphery of the substrate. One part of the injection mold defines a cavity for molding an encapsulation material thereby encapsulating the IC chip, and includes a face for bearing on the mounting face. At least one recess is provided in one part of the injection mold. The recess defines, above the mounting face, a slot for providing a vent for venting gases. The mounting face includes a region on which a metal outer layer is placed. The metal outer layer extends along the recess and on the bearing face on both sides of the recess.Type: GrantFiled: January 24, 2002Date of Patent: October 30, 2007Assignee: STMicroelectronics SAInventors: Christophe Prior, Laurent Herard
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Patent number: 7288287Abstract: The insulating layer formation step of forming an insulating layer 24-1 on a base for resin application 20 by applying polymeric material, which has been diluted with a solvent, filled with inorganic filler to the base for resin application and by drying the base for resin application; the circuit formation portion forming step of creating a circuit formation portion and a via hole 25 in insulating layer 24-1 that has been formed in the above described insulating layer formation step by means of a laser treatment; and the circuit formation step of forming a circuit 23-1 by plating the circuit formation portion and via hole 25 that have been created in the above described circuit formation portion forming step are provided and the insulating layer formation step, the circuit formation portion forming step and the circuit formation step are repeated a plurality of times in this order and, thereby, a circuit formation part (multi-layered substrate) is manufactured.Type: GrantFiled: March 2, 2001Date of Patent: October 30, 2007Assignee: Omron CorporationInventors: Hirokazu Tanaka, Satoshi Hirono
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Patent number: 7289183Abstract: A copper conducting wire structure is for use in the thin-film-transistor liquid crystal display (LCD) device. The copper conducting wire structure includes at least a buffer layer and a copper layer. A fabricating method of the copper conducting wire structure includes the following steps. At first, a glass substrate is provided. Next, the buffer layer is formed on the glass substrate. The buffer layer is comprised of a copper nitride. At last, the copper layer is formed on the buffer layer.Type: GrantFiled: September 7, 2005Date of Patent: October 30, 2007Assignee: AU Optronics Corp.Inventors: Feng-Yuan Gan, Han-Tu Lin, Kuo-Yuan Tu
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Patent number: 7285321Abstract: The present invention relates to a multi-layer laminate having a low glass transition temperature polyimide layer, a high glass transition temperature polyimide layer, and a conductive layer. The low glass transition temperature polyimide layer is synthesized by contacting an aromatic dianhydride with a diamine component, the diamine component comprising about 50 to about 90 mole % aliphatic diamine (the remainder being aromatic diamine) having the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16. The low glass transition polyimide is an adhesive and has a glass transition temperature in the range of from 150° C. to 200° C. The high glass transition temperature polyimide layer has a glass transition temperature above the low glass transition temperature polyimide layer and is a thermoset polyimide.Type: GrantFiled: November 12, 2003Date of Patent: October 23, 2007Assignee: E.I. du Pont de Nemours and CompanyInventors: Kuppsuamy Kanakarajan, Brian C. Auman, Sounak Banerji
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Patent number: 7285316Abstract: The present invention is directed to a process for the manufacture of three-dimensional acoustically sound automotive insulation parts. In particular, the process includes mixing a two component polyurethane resin, applying the resin to a substrate, molding the substrate and then trimming and demolding the resin applied substrate.Type: GrantFiled: May 14, 2004Date of Patent: October 23, 2007Assignees: Bayer MaterialScience LLC, Bayer AktiengesellschaftInventors: Sven Meyer-Ahrens, Thomas J. Matwiczyk, Bin Lee, Michael A. Blaszkiewicz, Walter Guarnieri
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Patent number: 7279217Abstract: There is provided a multilayer ceramic device enabling achievement of secure electric connection via electroconductive members in through holes and reduction in the thickness of internal electrodes during manufacturing. In multilayer piezoelectric device 1, a melting point of a material of the electroconductive members in the through holes is higher than a melting point of a material of the internal electrodes 2 and others. For this reason, the electroconductive members in the through holes have a contraction percentage in baking smaller than that of the internal electrodes 2 and others. Therefore, contraction of the electroconductive members is relatively constricted in baking, so as to decrease the difference of contraction percentages in baking between green sheets intended for piezoelectric layers 3 and others, and the electroconductive members in the through holes. This results in preventing breakage of the electrical connection via the electroconductive members in the through holes.Type: GrantFiled: May 18, 2005Date of Patent: October 9, 2007Assignee: TDK CorporationInventor: Satoshi Sasaki
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Patent number: 7267713Abstract: Provided is a conductive paste capable of adjusting resistivity and forming a conductor film having high strength of bonding with a glass substrate and high mounting strength of a metal terminal. The conductive paste contains a conductive component, a glass frit having a composition containing a Bi2O3—B2O3—SiO2—Al2O3 or Bi2O3—B2O3—SiO2—Al2O3—ZnO primary component and about 0.5 to 5% by weight of NiO as a secondary component, and an organic vehicle. The conductive paste is applied on a glass substrate and then baked to form a conductor film. A glass circuit structure formed by using the conductor film can be advantageously used as a defogging glass for an automobile window.Type: GrantFiled: March 18, 2004Date of Patent: September 11, 2007Assignee: Murata Manufacturing Co., Ltd.Inventor: Fumiya Adachi
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Patent number: 7265803Abstract: A circuit sheet comprising a substrate and wells dispersed on the substrate operable to hold conductive polymers that form circuit devices.Type: GrantFiled: August 27, 2003Date of Patent: September 4, 2007Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Gregory Frank Carlson, Todd Alan McClelland, Patrick Alan McKinley
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Patent number: 7265298Abstract: A stretchable electronic apparatus and method of producing the apparatus. The apparatus has a central longitudinal axis and the apparatus is stretchable in a longitudinal direction generally aligned with the central longitudinal axis. The apparatus comprises a stretchable polymer body, and at least one circuit line operatively connected to the stretchable polymer body, the at least one circuit line extending in the longitudinal direction and having a longitudinal component that extends in the longitudinal direction and having an offset component that is at an angle to the longitudinal direction, the longitudinal component and the offset component allowing the apparatus to stretch in the longitudinal direction while maintaining the integrity of the at least one circuit line.Type: GrantFiled: April 16, 2004Date of Patent: September 4, 2007Assignee: The Regents of the University of CaliforniaInventors: Mariam N. Maghribi, Peter A. Krulevitch, Thomas S. Wilson, Julie K. Hamilton, Christina Park
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Patent number: 7264482Abstract: An anisotropic conductive sheet capable of transmitting high-speed digital signals reliably is provided. The anisotropic conductive sheet has a conductive property in a thickness direction thereof under a predetermined condition, and includes: insulative matrix members having a dielectric constant value of at most 2.28 and a dielectric loss value of at most 0.025; and conductive members having a conductive property in the thickness direction under the predetermined condition in the conductive members capable of flowing electricity between top and bottom surfaces thereof are located in a scattered manner in the matrix members, and the conductive and matrix members are bonded chemically. Especially, the matrix member is made from a resin material having a resin foamed body of a foaming structure, i.e. homogeneous microcell structure. At least one of the conductive members may be of conductive elastomer.Type: GrantFiled: March 9, 2005Date of Patent: September 4, 2007Assignee: J.S.T. Mfg. Co., Ltd.Inventor: Miki Hasegawa
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Patent number: 7261841Abstract: A thick film composition consisting essentially of: a) electrically conductive powder; b) an inorganic binder wherein the inorganic binder is selected from TiO2 and any compounds that can generate TiO2 during firing; and c) an organic medium.Type: GrantFiled: October 19, 2004Date of Patent: August 28, 2007Assignee: E. I. du Pont de Nemours and CompanyInventors: Yueli Wang, Christopher R. Needes, Patricia J. Ollivier
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Patent number: 7255919Abstract: Provision of a releasing layer transfer film which can form, in a simple manner, a releasing layer on a COF flexible printed wiring board, the releasing layer preventing melt adhesion of an insulating layer to a heating tool, thereby enhancing productivity and reliability of semiconductor devices produced by use of a semiconductor chip mounting line. The releasing layer transfer film 1 for forming a releasing layer onto an insulating layer serving as a component layer of a COF flexible printed wiring board, the releasing layer transfer film includes a transfer film substrate 2 and a transferable releasing layer 3 provided on a surface of the transfer film substrate 2, wherein the transferable releasing layer 3 is formed from a releasing agent and can be transferred onto the insulating layer.Type: GrantFiled: March 11, 2003Date of Patent: August 14, 2007Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Ken Sakata, Katsuhiko Hayashi
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Patent number: 7252891Abstract: A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electrically insulating substrate with this wiring transfer sheet, convexities which are complementary to the concavities are formed on the electrically insulating substrate. The convexities improve adhesion between a wiring board and a resin stacked thereon. Therefore, the wiring board thus obtained has surface coplanarity suitable for mounting a semiconductor bare chip and an electronic component as a whole, and a microscopical surface structure which adheres to a material stacked thereon.Type: GrantFiled: January 16, 2004Date of Patent: August 7, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventor: Hideki Higashitani
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Patent number: 7250840Abstract: A layered product prepared by applying a surface treatment to an adherend having a surface with a low binding property with an anaerobic adhesive, which does not require a complex work, primer application, effected by accelerating an adhesive curing rate, and does not change surface conditions of the adherend. The layered product comprises an adherend, an uneven deposition comprising Cu, V, a Cu alloy or a V alloy and having a height of 500 nm or less on the surface of the adherend, and an adhesive layer formed at least on the uneven deposition.Type: GrantFiled: March 28, 2005Date of Patent: July 31, 2007Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Ryo Osugi
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Patent number: 7243951Abstract: Durable security devices that are resistant to chemical attack and mechanical degradation and security articles employing such devices, are provided. By way of the durable security device of the present invention, opposing longitudinal borders adjacent an information-bearing layer are sealed, thereby preventing corrosive and/or degrading materials from reaching this layer through these sealed borders. In a preferred embodiment, at least a portion of the information-bearing layer is fully encapsulated, thereby rendering this portion or layer and the information conveyed thereby, impervious to chemical attack.Type: GrantFiled: August 19, 2003Date of Patent: July 17, 2007Assignee: Technical Graphics, Inc.Inventors: Paul F. Cote, Stephen B. Curdo, Gerald J. Gartner, Daniel G. Leeds, Brian C. Page, Gary R. Wolpert, Timothy T. Crane
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Patent number: 7241510Abstract: In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic high temperature release structure (215) that comprises a co-deposited layer (250) and a metal oxide layer (260). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer.Type: GrantFiled: May 27, 2005Date of Patent: July 10, 2007Assignee: Motorola, Inc.Inventors: Gregory J. Dunn, Remy J. Chelini, Timothy B. Dean