Abstract: A water-cooling thermal dissipating method controls at least one of a fan, a pump, and a throttle valve to cool a heat generating element inside an electronic device through a cooling liquid. The method includes steps of: (a) performing a self-condition inspection, (b) detecting whether a working temperature of the cooling liquid is greater than a first predetermined temperature, and detecting whether a working temperature of the heat generating element is greater than a second predetermined temperature, (c) outputting a first warning signal if the working temperature of the cooling liquid is greater than the first predetermined temperature and a liquid level of the cooling liquid is not lower than a threshold liquid level, and outputting a second warning signal if the working temperature of the heat generating element is greater than the second predetermined temperature, and (d) displaying the first warning signal and the second warning signal.

Abstract: The invention relates to a power module (4) for a medium or high voltage converter (1), preferably a modular multilevel converter, comprising at least one power semiconductor module (7), preferably an IGBT assembly, at least one energy storage module (9), preferably a capacitor module, at least one cooling device (14), wherein the cooling device (14) is formed as a cooling plate (17) that can be run through by a coolant, in particular flown through by a cooling liquid, and the at least one power semiconductor module (7) and/or the at least one energy storage module (9) are arranged on an upper side (18) and/or bottom side (19) of the cooling plate (17), and wherein the at least the power semiconductor module (7) is connected with the cooling plate (17) in a thermally conductive manner, and wherein the cooling plate (17) is provided for load-bearing support on a rack (2) of an assigned receiving space (3) of the medium or high voltage converter (1) and comprises support surfaces (16) projecting laterally in th

Abstract: A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.

Abstract: A cooling system for power modules is provided. The cooling system includes two covers, a plurality of power modules and a plurality of first spaces. The power modules are disposed between the two covers. Each power module includes a housing, a circuit board and heat dissipation elements disposed on the two sides of the circuit board. There is a through hole on the housing. Each first space is formed between two neighboring power modules or is formed between the cover and the neighboring power module. The heat dissipation elements of each power module are located in the neighboring first spaces, and the through hole of each power module is in communication with the neighboring first spaces. The first spaces and the through holes of the power modules are communicated with each other to form a coolant passageway collaboratively for allowing a coolant to pass through.

Abstract: A power conversion apparatus has: a heat-generating component; and a first capacitor module and a second capacitor module that are arranged to face each other with the heat-generating component therebetween. The first capacitor module has a first capacitor element, a first case that accommodates the first capacitor element, and a first bus bar with one end connected to the first capacitor element. The second capacitor module has a second capacitor element, a second case that accommodates the second capacitor element, and a second bus bar with one end connected to the second capacitor element. The second bus bar has an intervening part that intervenes between the second capacitor element and the heat-generating component, in a state of being separated from the two.

Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.

Abstract: A wireless charger, charging assembly, matching assembly and bracket for electric equipment, including: cold conduction plate, power interface, wireless charging module, semiconductor cooling sheet and heat dissipation module; power interface couples with wireless charging module and semiconductor cooling sheet respectively; cold conduction plate includes first and second cold conduction surface, first cold conduction surface sticks to electronic equipment, second cold conduction surface covers semiconductor cooling sheet; when powered on, wireless charging module charges electronic equipment, semiconductor cooling sheet cools down electronic equipment, heat dissipation module dissipates heat from semiconductor cooling sheet.

Abstract: Systems and methods are provided for a leak sensor drip tray. In some embodiments, an Information Handling System (IHS) may include: a component; a cold plate disposed above the component; a leak sensor board disposed above the cold plate; and a drip tray disposed above the leak sensor, wherein the drip tray is configured to capture a fluid leak from a fitting coupled to the cold plate.

Abstract: An electrical distribution panel for controlling the distribution of electrical power to a plurality of loads includes a plurality of solid-state circuit breakers (SSCBs), each including a thermally conductive heatspreader and one or more power semiconductor devices that control whether electrical current is able to flow to an attached load; a distribution panel heatsink configured in thermal contact with the SSCB heatspreaders; one or more cooling fans that blow air onto the distribution panel heatsink; a stacked bus bar with quick-fit pin-mount receptacles for receiving mating/matching press-fit connection pins located on line-side terminals of the SSCBs; a communications and control (comm/control) bus communicatively coupled to the plurality of SSCBs; and a head-end interface and gateway to which an external computer can connect, to, among other things, set and alter trip settings of the plurality of SSCBs via the comm/control bus.

Abstract: A system and method of reducing consumption of electricity used to cool electronic components such as in an electronic computer data center or in a facility of networking and telecommunications equipment, and to reduce the incidence of thermal failure of the electronic components, includes providing one or more partitions configured to form a reduced-volume cooled-environment chamber in order to supply cooled air from an air conditioning system to the chamber adjacent to racks containing the electronic components, thereby preventing dilution of the cooling air by warmer air from outside of the chamber, and controlling the delivery of cooling air through the reduced-volume cooled-environment chamber.

Abstract: A filling method for an accommodating system is provided. The filling method includes filling a liquid into an accommodating device at a first temperature, and withdrawing a predetermined amount of the liquid from the accommodating device using a pump. The predetermined amount is related to a temperature change.

Abstract: The disclosed computer cooling system includes a liquid immersion cooling tank configured as a server chassis with an integrated power bus, control bus and data bus. The server chassis tank receives and services a plurality of modular blades including disaggregated single server components dedicated to similar functions and resembling a beekeeper's box of vertical and spaced operation, insertion and extraction. The modular blades include at least one management blade, interfaces and peripherals blade, storage blade, CPU blade and one or more GPU blades and other processors. Each blade configures hottest operating components lowest in a heat flow via transverse mounted brackets and vented ends. A blade extraction mechanism includes movable winches for manipulating the plurality of modular blades from a top side of the heat flow and a hydraulic lift for pushing each modular blade from a bottom of the heat flow out of the liquid immersion cooling tank.

Abstract: A DC matrix power switch structure mechanically and electrically connects m DC power modules to n charge dispensers for charging electric vehicles. The matrix includes an input structure having m conducting input busbar pairs and an output structure having n conducting output busbar pairs. A first busbar of n output busbar pairs is connected to a positive voltage terminal and a second busbar of n output busbar pairs is connected to a negative voltage terminal of each of n charge dispensers, producing two times m×n busbar crossing points. A power switch is mechanically mounted to a cross point or is moved to a crossing point and, when activated, connects to the associated busbar at the busbar crossing point providing power to the appropriate charge dispenser. A power switch includes one or more actuators to connect an input busbar to an output busbar with a flexible conductor.

Abstract: A switch module assembly including a switch module including a bus bar system having a positive bus bar and a negative bus bar, and at least one snubber capacitor fastened to the switch module, each of the at least one snubber capacitor having a body part, a positive terminal connected to the positive bus bar, and a negative terminal connected to the negative bus bar. The switch module assembly includes a capacitor support member adapted to reduce vibration of the body part of the at least one snubber capacitor relative to the switch module, the capacitor support member is made of flexible material, and is in contact with the body part of the at least one snubber capacitor and the switch module.

Abstract: An electric power substation includes a circuit breaker, an electromagnetic pulse mitigation module coupled to the circuit breaker and comprising a continuous conductive enclosure that is impervious to radiated or coupled electromagnetic energy, an input/output device housed within the electromagnetic pulse mitigation module, and a control house communicably coupled to the circuit breaker via a primary communication line and housing one or more primary relay panels.

Abstract: This invention discloses a rackless modular power electronic system that optimizes thermal management, modularity, manufacturability, transportation, and installation. Such a power electronic converter system consists of one or more modular power electronic converters mounted one-on-top-of-another and/or one-next-to-another through mounting units, such as screws, nuts and bolts. Each modular power electronic converter is built with a case with heat-dissipating fins on the exterior surface and with vertical and horizontal mounting mechanisms, such as holes, bolts, nuts and screws, which are aligned vertically and horizontally, respectively, for easy mounting. One or more electric fans can be mounted to the system to enhance heat dissipation. Possible applications include any field that adopts power electronic converters, e.g., in wind power, solar power, storage systems, home appliances, IT equipment, motor drives, electric vehicles, more-electric aircraft, and all-electric ships.

Abstract: A motor drive converter includes a cold plate having a first side and a second side, the first side being opposite to the second side. The motor drive converter may further include at least one motor phase power electronics disposed on the first side of the cold plate, and a capacitor array disposed on the second side of the cold plate. The cold plate may include slots therethrough for a conductor to pass through the cold plate. The conductor may be configured to electrically coupling the capacitor array and the at least one motor phase power electronics.

Abstract: An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.

Abstract: An electronic apparatus includes an apparatus main body having a first external surface that faces a first direction and a first side surface that faces a second direction orthogonal to the first direction, and a first exterior panel curved at least partly, in which the first exterior panel covers the first external surface and is attached to the first external surface, and the first exterior panel has, at an end portion of the first exterior panel, a first projecting portion beyond a position of the first side surface.

Abstract: A power conversion device includes an electronic component, a cooler, a housing, protruding pipes, and annular seal members. Each of the seal members includes a seal body portion interposed between a corresponding one of the protruding pipes and the housing, and a flange portion extending outward from the seal body portion in a radial direction and contacting an outer surface of the housing from an axial direction. The housing includes a peripheral wall surface formed to surround the flange portion from an outer peripheral side, and an annular groove portion formed along an outer peripheral edge of the flange portion inside the peripheral wall surface. The peripheral wall surface is formed to extend outward, in the axial direction, from an axial contact surface of the housing contacted by the flange portion.